Abstract: The present invention relates to a light emitting apparatus. According to one aspect of the present invention, the light emitting device comprises: a plurality of light emitting devices including a blue light emitting device emitting blue light and a UV light emitting device emitting ultraviolet light; and a wavelength conversion part arranged in the path of the light emitted from the plurality of light emitting devices, and provided with fluorescent substances to convert the wavelengths of the light emitted from the plurality of light emitting devices, wherein a fluorescent substance excited by and mixed with the blue light to obtain white light is arranged on a first area corresponding to the blue light emitting device, and at least a blue fluorescent substance is arranged on a second area corresponding to the UV light emitting device.

Abstract: A method of manufacturing a substrate for mounting an electronic device, includes forming at least one through-hole in a plate-shaped substrate body in a thickness direction thereof. An electrode substrate having at least one core on an upper surface thereof is formed such that the at least one core corresponds to the at least one through-hole. The electrode substrate is coupled to the substrate body by inserting the at least one core into the at least one through-hole. A portion of the coupled electrode substrate is removed except for the at least one core.

Abstract: There is provided an alternating current (AC) driven light emitting device including a plurality of LED arrays connected in series, each having a structure in which a plurality of LEDs are electrically connected to form a two-terminal circuit and emit light by a bidirectional voltage when an AC voltage is applied to the two-terminal circuit; and a switching device connected to at least one of the plurality of LED arrays and controlling a total driving voltage with respect to the plurality of LED arrays. The AC driven light emitting device permits operation from a low driving voltage Vf while having a high driving voltage at a high voltage Vf, thereby achieving excellence in terms of power factor, THD, and energy efficiency.

Abstract: An LPG direct injection system may include an engine receiving liquefied petroleum gas (LPG) into a combustion chamber thereof, an injector adapted to inject the LPG into the combustion chamber of the engine, a high pressure fuel pump supplying high pressured LPG to the injector, a fuel tank storing the LPG for supplying to the engine, a regulator apparatus receiving the LPG from the fuel tank, controlling pressure of the received LPG, and delivering a controlled LPG to the high pressure fuel pump, a fuel supply line sequentially connecting the fuel tank, the regulator apparatus, the high pressure fuel pump, and the injector so as to supply the LPG stored in the fuel tank to the engine, and a fuel return line returning an LPG that remains in the high pressure fuel pump after pumping thereof to the fuel tank.

Abstract: Disclosed is a method of detecting a failure of a motor of an electric brake booster. The method includes: a) determining whether the electric vehicle brake booster is in the brake pressure control mode or the motor position control mode; b) storing a first position value of the motor for each of predetermined periods when it is determined that the electric vehicle brake booster is in the brake pressure control mode; c) comparing the first position value stored for the last period among the first position values with a second position value of the motor in the motor position control mode when the brake pressure control mode is changed to the motor position control mode; and d) determining that the motor is in a locked state when the first position value and the second position value are substantially identical.

Abstract: A light-emitting device package uses a metal layer as a reflective region and includes a light-emitting device chip and an electrode pad that are disposed on an insulating layer. In addition, the electrode pad and an electrode pattern of a printed circuit board are connected to each other by an electrode pattern formed of conductive ink. A method of manufacturing a light-emitting device package includes forming an insulating layer on a metal layer, and bonding a light-emitting device chip and an electrode pad on the insulating layer. The electrode pad and a printed circuit board are connected to each other by conductive ink.

Abstract: Provided are a light-emitting device package and a method of manufacturing the same. The light-emitting device package may include a plurality of light-emitting chips on one substrate (board). The plurality of light-emitting chips may produce colors around a target color. The target color may be produced by combinations of the colors of light emitted from the plurality of light-emitting chips. The colors around the target color may have the same hue as the target color and have color temperatures different from that of the target color. The plurality of light-emitting chips may have color temperatures within about ±250K of that of the target color.

Abstract: Disclosed herein is a quantum dot phosphor for light emitting diodes, which includes quantum dots and a solid substrate on which the quantum dots are supported. Also, a method of preparing the quantum dot phosphor is provided. Since the quantum dot phosphor of the current invention is composed of the quantum dots supported on the solid substrate, the quantum dots do not aggregate when dispensing a paste obtained by mixing the quantum dots with a paste resin for use in packaging of a light emitting diode. Thereby, a light emitting diode able to maintain excellent light emitting efficiency can be manufactured.

Abstract: Disclosed herein is a quantum dot phosphor for light emitting diodes, which includes quantum dots and a solid substrate on which the quantum dots are supported. Also, a method of preparing the quantum dot phosphor is provided. Since the quantum dot phosphor of the current invention is composed of the quantum dots supported on the solid substrate, the quantum dots do not aggregate when dispensing a paste obtained by mixing the quantum dots with a paste resin for use in packaging of a light emitting diode. Thereby, a light emitting diode able to maintain excellent light emitting efficiency can be manufactured.

Abstract: Disclosed are an LED package, an LED package module having the same and a manufacturing method thereof, and a head lamp module having the same and a control method thereof. The light emitting diode package includes: a package substrate; a light emitting diode chip mounted on one surface of the package substrate; an electrode pad formed on the other surface of the package substrate and electrically connected to the light emitting diode chip; and a heat radiation pad formed on the other surface of the package substrate and electrically insulated from the electrode pad.

Abstract: An organic light-emitting device includes an emission layer between first and second electrodes, a first hole transport layer that is between the emission layer and the first electrode and that includes a first hole transport compound and a first electron acceptor, a second hole transport layer that is between the emission layer and first hole transport layer and that includes a second hole transport compound, a third hole transport layer that is between the emission layer and the second hole transport layer and that includes a third hole transport compound and a second electron acceptor, a fourth hole transport layer that is between the emission layer and the third hole transport layer and that includes a fourth hole transport compound, a buffer layer between the emission layer and the fourth hole transport layer, and an electron transport layer that includes a pyrimidine-based compound.

Abstract: A semiconductor light emitting device package includes a base unit including a main body having electrical insulation properties and at least one pair of first and second through electrodes formed in the main body in a thickness direction thereof and formed of a semiconductor material, and a light emitting structure disposed on the base unit and including first and second conductivity type semiconductor layers and an active layer interposed there between. The manufacturing process thereof may be simplified, whereby a reduction in manufacturing costs and time may be achieved.

Abstract: A method of manufacturing a printed circuit board (PCB) and the PCB are provided. The method includes: filling a resin in a via-hole formed at a substrate from one surface side of the substrate; emitting light for a predetermined period of time to the resin filled in the via-hole from the other surface side of the substrate; and applying another resin on the other surface of the substrate.

Abstract: Provided are a light-emitting device package and a method of manufacturing the same. The light-emitting device package may include a plurality of light-emitting chips on one substrate (board). The plurality of light-emitting chips may produce colors around a target color. The target color may be produced by combinations of the colors of light emitted from the plurality of light-emitting chips. The colors around the target color may have the same hue as the target color and have color temperatures different from that of the target color. The plurality of light-emitting chips may have color temperatures within about ±250K of that of the target color.

Abstract: Provided is a light emitting diode (LED) package. The LED package includes a package main body, first and second electrode structures, first and second LED chips, and first and second resin packing parts. The package main body includes a concave portion and a barrier wall dividing the concave portion into at least first and second accommodation recesses. The first and second electrode structures are formed at the package main body and are exposed at bottom surfaces of the first and second accommodation recesses respectively. The first and second LED chips are electrically connected to the first and second electrode structures are respectively mounted on the bottom surfaces of the first and second accommodation recesses. The first and second resin packing parts include at least one fluorescent material and are formed in the first and second accommodation recesses for packing the first and second LED chips.

Abstract: Provided are a light-emitting device package and a method of manufacturing the same. The light-emitting device package may include a plurality of light-emitting chips on one substrate (board). The plurality of light-emitting chips may produce colors around a target color. The target color may be produced by combinations of the colors of light emitted from the plurality of light-emitting chips. The colors around the target color may have the same hue as the target color and have color temperatures different from that of the target color. The plurality of light-emitting chips may have color temperatures within about ±250K of that of the target color.

Abstract: There are provided a sealing resin composition for a hard disk drive (HDD) motor and a HDD motor fabricated by using the same. The sealing resin composition includes: 45 to 65 parts by weight of urethane methacrylate resin; 35 to 50 parts by weight of methacrylate resin; and 2 to 4 parts by weight of acrylic acid. A sealing resin composition having a new composition is used as a sealing material of a FPC adhering part of the HDD motor, whereby a haze phenomenon due to air leak and outgas at the FPC adhering part may be improved and reliability of a HDD motor may be enhanced due to a reduction in generation of the outgas of the adhering part.

Abstract: There are provided an adhesive resin composition for a HDD motor and a HDD motor fabricated using the same. The adhesive resin composition for a HDD motor includes: 25 to 35 parts by weight of a bisphenol E-epoxy resin; 10 to 25 parts by weight of an epoxy resin; 10 to 20 parts by weight of mercaptan; and 5 to 15 parts by weight of imidazole. The constituents of an epoxy adhesive material may be controlled, such that a curing speed may be increased, as compared to the case of the related art, thereby enhancing working efficiency and reliability.

Abstract: An organic light-emitting diode includes a first electrode; a second electrode facing the first electrode; an emission layer (EML) between the first electrode and the second electrode; a first charge generation layer between the EML and the first electrode and including a first compound and a first charge generation material; a first layer between the EML and the first charge generation layer and including a second compound; a second charge generation layer between the EML and the first layer and including a third compound and a second charge generation material; a second layer between the EML and the second charge generation layer and including a fourth compound; and a buffer layer between the EML and the second layer. The first and third compounds each independently includes a compound represented by Formula 1, and the second and fourth compounds each independently includes a compound represented by Formula 2.

Abstract: There are provided an adhesive resin composition for a hard disk drive (HDD) motor and a HDD motor fabricated by the using the same. The adhesive resin composition includes: 45 to 55 parts by weight of an urethane methacrylate oligomer, 35 to 45 parts by weight of hydroxylalkyl methacrylate, 1 to 3 parts by weight of an acrylic acid, 1 to 2 parts by weight of organic hydroperoxide, and 2 to 5 parts by weight of a photo initiator. The HDD motor may be fabricated using the adhesive resin composition for a HDD motor prepared by controlling contents of an UV curable adhesive and a primer to reduce generation of outgas, whereby improved reliable quality of the motor may be obtained.