Patents by Inventor In-Kun Kim
In-Kun Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10693969Abstract: An apparatus and method for providing one or more protocols for one or more electronic devices are provided. The method includes establishing, by an electronic device configured to provide a framework interface by executing instructions stored in a memory, one or more physical channels with an external electronic device, using one or more communication modules, executing, by the electronic device, two or more application programs to interface with the framework interface, and communicating, via the framework interface, data from the two or more application programs through the one or more physical channels to the external electronic device, using at least one logical channel or session for a respective one of the two or more application programs.Type: GrantFiled: December 21, 2018Date of Patent: June 23, 2020Assignee: Samsung Electronics Co., Ltd.Inventors: Ki-Soo Cho, Aravind Iyer, Mahesh Anjanappa, Ranjeet Kumar Patro, Prasad Tirumala Sree Hari Vara Vadlapudi, Suck-Ho Seo, In-Hyuk Choi, Il-Sung Hong, Abhijit C Pathak, Amit Prabhudesai, Ashok Subash, Ravindra Balkrishna Shet, Dong-Hyoun Son, Byeong-Ho Shim, Ji-Ryang Chung, Kangli Hao, Madhavan Vasudevan, Mahesh Malagouda Patil, M. S. S. K. Sharma, Ranjitsinh Udaysinh Wable, Shekhar Anantha Ambekar, Subba Reddy Venkata Kota, Raghavendra Vaddarahalli Ramegowda, Varunjith Therath Kainoth, Vishwanath Balekudige Gopalakrishna, Nam-Kun Kim, Young-Ju Kim, Jeong-Mi Kim, Chang-Sik Kim, Hyeong-Geun Kim, Shashanka Dasari, Gyu-Seok Shim, Won-Geun Shim, Anil Agiwal, Jin-Hyuk Lee, Sang-Hyun Han, In-Hyup Hwang, Ji-Young Hwang
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Patent number: 10636743Abstract: An electronic component package includes first and second wiring parts including insulating layers, conductive patterns formed in the insulating layers, and conductive vias penetrating through the insulating layers, to be connected to the conductive patterns, respectively; a frame disposed between the first and second wiring parts and having conductive connection parts electrically connecting one or more through-holes with the first and second wiring parts and an electronic component disposed to be surrounded by the through-hole, to thereby be connected to the first wiring part, wherein the conductive patterns formed to be adjacent to the electronic component among the conductive patterns of the first wiring part are embedded in the insulating layer of the first wiring part.Type: GrantFiled: April 4, 2019Date of Patent: April 28, 2020Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Yong Ho Baek, Sang Kun Kim, Ye Jeong Kim, Jae Ean Lee, Jae Hoon Choi
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METHOD FOR DETOXIFYING LIQUID CHEMICAL WARFARE AGENTS USING SURFACE-MODIFIED METAL ORGANIC FRAMEWORK
Publication number: 20200114189Abstract: The present invention relates to a method of detoxifying a liquid chemical agent using a metal organic framework having a surface modified with a basic amine-based compound. More particularly, a surface-modified metal organic framework having the amine-based compound deposited on a surface thereof and in pores thereof or bonded to the inside of a frame is prepared, and when the surface-modified metal organic framework comes into contact with the liquid chemical agent, a reaction with moisture in the atmosphere occurs, thus removing the liquid chemical agent through a hydrolysis reaction. It is possible to simultaneously detoxify various chemical agents such as a nerve agent and a vesicant, thus assuring a high detoxification effect on liquid chemical agents at room temperature even when using a small amount thereof.Type: ApplicationFiled: April 13, 2018Publication date: April 16, 2020Inventors: Sam-Gon RYU, Min-Kun KIM, Hyun-Sook JUNG -
Patent number: 10580584Abstract: A multilayer ceramic capacitor includes a body including first and second dielectric layers and having first to sixth surfaces; a second internal electrode disposed on the second dielectric layer to face the first internal electrode with the first or second dielectric layer interposed therebetween, exposed to the fourth, fifth, and sixth surfaces, and disposed to be spaced apart from the third surface by a second space; a first dielectric pattern disposed in at least a portion of the first space; a second dielectric pattern disposed in at least a portion of the second space; a side insulating layer disposed on the fifth and sixth surfaces; a first external electrode disposed on the third surface; and a second external electrode disposed on the fourth surface, in which the first and second dielectric patterns have a color different from the first and second dielectric layers.Type: GrantFiled: June 13, 2018Date of Patent: March 3, 2020Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Tae Hoon Kim, Byung Kun Kim, Byung Chul Jang, Chang Hak Choi, Jung Deok Park
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Patent number: 10522285Abstract: A multilayer ceramic capacitor (MLCC) includes a body including first dielectric layers and second dielectric layers, the body including first to sixth surfaces, a second surface, a third surface, a fourth surface, a fifth surface and a sixth surface; first internal electrodes disposed on the first dielectric layers, exposed to the third surface, the fifth surface, and the sixth surface, and spaced apart from the fourth surface by first spaces; second internal electrodes disposed on the second dielectric layers to oppose the first internal electrodes with the first dielectric layers or the second dielectric layers interposed therebetween, exposed to the fourth surface, the fifth surface, and the sixth surface, and spaced apart from the third surface by second spaces; first dielectric patterns disposed in at least a portion of the first spaces, and second dielectric patterns disposed in at least a portion of the second spaces; and lateral insulating layers.Type: GrantFiled: March 12, 2019Date of Patent: December 31, 2019Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Moon Soo Park, Jae Hun Choe, Dong Hun Kim, Byung Chul Jang, Chang Hak Choi, Byung Kun Kim
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Publication number: 20190362893Abstract: A multilayer ceramic capacitor (MLCC) includes a body including first dielectric layers and second dielectric layers, the body including first to sixth surfaces, a second surface, a third surface, a fourth surface, a fifth surface and a sixth surface; first internal electrodes disposed on the first dielectric layers, exposed to the third surface, the fifth surface, and the sixth surface, and spaced apart from the fourth surface by first spaces; second internal electrodes disposed on the second dielectric layers to oppose the first internal electrodes with the first dielectric layers or the second dielectric layers interposed therebetween, exposed to the fourth surface, the fifth surface, and the sixth surface, and spaced apart from the third surface by second spaces; first dielectric patterns disposed in at least a portion of the first spaces, and second dielectric patterns disposed in at least a portion of the second spaces; and lateral insulating layers.Type: ApplicationFiled: August 9, 2019Publication date: November 28, 2019Inventors: Moon Soo PARK, Jae Hun CHOE, Dong Hun KIM, Byung Chul JANG, Chang Hak CHOI, Byung Kun KIM
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Patent number: 10475574Abstract: A multilayer ceramic capacitor (MLCC) includes a body including first dielectric layers and second dielectric layers, the body including first to sixth surfaces, a second surface, a third surface, a fourth surface, a fifth surface and a sixth surface; first internal electrodes disposed on the first dielectric layers, exposed to the third surface, the fifth surface, and the sixth surface, and spaced apart from the fourth surface by first spaces; second internal electrodes disposed on the second dielectric layers to oppose the first internal electrodes with the first dielectric layers or the second dielectric layers interposed therebetween, exposed to the fourth surface, the fifth surface, and the sixth surface, and spaced apart from the third surface by second spaces; first dielectric patterns disposed in at least a portion of the first spaces, and second dielectric patterns disposed in at least a portion of the second spaces; and lateral insulating layers.Type: GrantFiled: November 7, 2017Date of Patent: November 12, 2019Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Moon Soo Park, Jae Hun Choe, Dong Hun Kim, Byung Chul Jang, Chang Hak Choi, Byung Kun Kim
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Patent number: 10476078Abstract: The present invention relates to a positive electrode for a secondary battery in which a maximum diameter of internal pores is controlled to be less than 1 ?m, a method of preparing the same, and a secondary battery including the positive electrode.Type: GrantFiled: February 1, 2018Date of Patent: November 12, 2019Assignee: LG Chem, Ltd.Inventors: Young Geun Choi, Kang Kun Kim, Song Taek Oh, Joo Young Choi, Ji Hye Yang
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Patent number: 10422052Abstract: Provided is a method of manufacturing high strength synthetic fibers, and high strength synthetic fibers manufactured using the same. More particularly, the method involves a localized heating process by raising the temperature of a molten spinning fiber to a temperature higher than that of a pack body during a short period of time with no degradation through a heating zone located in the immediate vicinity of capillary in the spinning nozzle, so as to effectively control the molecular entanglement structure in the molten polymer without reducing the molecular weight and thus to enhance the drawability of the as-spun fibers, thereby improving the mechanical properties of the as-spun fibers, such as strength, elongation, etc., using the existing processes of melt spinning and drawing and thus enabling a mass production of a high-performance fiber at low cost.Type: GrantFiled: March 9, 2016Date of Patent: September 24, 2019Assignee: KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGYInventors: Wan Gyu Hahm, In Woo Nam, Seung Jin Lee, Do Kun Kim, Ki Sub Lim, Joo Hyung Lee, Gyu Dong Lee, Yeong Og Choi, Byeong Jin Yeang
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Publication number: 20190229060Abstract: An electronic component package includes first and second wiring parts including insulating layers, conductive patterns formed in the insulating layers, and conductive vias penetrating through the insulating layers, to be connected to the conductive patterns, respectively; a frame disposed between the first and second wiring parts and having conductive connection parts electrically connecting one or more through-holes with the first and second wiring parts and an electronic component disposed to be surrounded by the through-hole, to thereby be connected to the first wiring part, wherein the conductive patterns formed to be adjacent to the electronic component among the conductive patterns of the first wiring part are embedded in the insulating layer of the first wiring part.Type: ApplicationFiled: April 4, 2019Publication date: July 25, 2019Inventors: Yong Ho BAEK, Sang Kun KIM, Ye Jeong KIM, Jae Ean LEE, Jae Hoon CHOI
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Publication number: 20190206622Abstract: A multilayer ceramic capacitor (MLCC) includes a body including first dielectric layers and second dielectric layers, the body including first to sixth surfaces, a second surface, a third surface, a fourth surface, a fifth surface and a sixth surface; first internal electrodes disposed on the first dielectric layers, exposed to the third surface, the fifth surface, and the sixth surface, and spaced apart from the fourth surface by first spaces; second internal electrodes disposed on the second dielectric layers to oppose the first internal electrodes with the first dielectric layers or the second dielectric layers interposed therebetween, exposed to the fourth surface, the fifth surface, and the sixth surface, and spaced apart from the third surface by second spaces; first dielectric patterns disposed in at least a portion of the first spaces, and second dielectric patterns disposed in at least a portion of the second spaces; and lateral insulating layers.Type: ApplicationFiled: March 12, 2019Publication date: July 4, 2019Inventors: Moon Soo Park, Jae Hun Choe, Dong Hun Kim, Byung Chul Jang, Chang Hak Choi, Byung Kun Kim
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Patent number: 10325856Abstract: An electronic component package includes first and second wiring parts including insulating layers, conductive patterns formed in the insulating layers, and conductive vias penetrating through the insulating layers, to be connected to the conductive patterns, respectively; a frame disposed between the first and second wiring parts and having conductive connection parts electrically connecting one or more through-holes with the first and second wiring parts and an electronic component disposed to be surrounded by the through-hole, to thereby be connected to the first wiring part, wherein the conductive patterns formed to be adjacent to the electronic component among the conductive patterns of the first wiring part are embedded in the insulating layer of the first wiring part.Type: GrantFiled: December 20, 2016Date of Patent: June 18, 2019Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Yong Ho Baek, Sang Kun Kim, Ye Jeong Kim, Jae Ean Lee, Jae Hoon Choi
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Patent number: 10311319Abstract: Provided is a technology for recognizing vehicle license plate information which includes detecting a position of a license plate from a vehicle image obtained by imaging a vehicle, extracting individual character images by separating a plurality of characters from a region of the detected license plate in the vehicle image and extracting a license plate type of the license plate according to a predetermined criterion, recognizing a license plate character string on the basis of the extracted individual character images and the license plate type and outputting the recognized license plate character string.Type: GrantFiled: May 18, 2017Date of Patent: June 4, 2019Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTEInventors: Pyong Kun Kim, Hyun Woo Kang, Kwang Ju Kim, Jong Taek Lee, Kil Taek Lim, Yun Su Chung, Byung Gil Han
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Patent number: 10297553Abstract: An electronic component package includes first and second wiring parts including insulating layers, conductive patterns formed in the insulating layers, and conductive vias penetrating through the insulating layers, to be connected to the conductive patterns, respectively; a frame disposed between the first and second wiring parts and having conductive connection parts electrically connecting one or more through-holes with the first and second wiring parts and an electronic component disposed to be surrounded by the through-hole, to thereby be connected to the first wiring part, wherein the conductive patterns formed to be adjacent to the electronic component among the conductive patterns of the first wiring part are embedded in the insulating layer of the first wiring part.Type: GrantFiled: May 17, 2018Date of Patent: May 21, 2019Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Yong Ho Baek, Sang Kun Kim, Ye Jeong Kim, Jae Ean Lee, Jae Hoon Choi
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Patent number: 10283116Abstract: Disclosed is a method providing voice recognition by an electronic device, including receiving a first signal including a request for triggering voice recognition from one or more external devices, triggering a program supporting the voice recognition in response to the first signal, receiving a second signal including voice data corresponding to a user's voice, performing voice recognition on the received voice data, determining an operation corresponding to the recognized voice, determining one or more performing devices which perform the determined operation, and enabling the one or more determined performing devices to perform the determined operation.Type: GrantFiled: January 5, 2017Date of Patent: May 7, 2019Assignee: Samsung Electronics Co., LtdInventors: Jae-Jeong Ko, Hae-Young Park, Nam-Kun Kim, Moung-Sub Kim, Dong-Hyoun Son, Gun-Ho Lee, Sung-Hye Heo
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Publication number: 20190132401Abstract: An apparatus and method for providing one or more protocols for one or more electronic devices are provided. The method includes establishing, by an electronic device configured to provide a framework interface by executing instructions stored in a memory, one or more physical channels with an external electronic device, using one or more communication modules, executing, by the electronic device, two or more application programs to interface with the framework interface, and communicating, via the framework interface, data from the two or more application programs through the one or more physical channels to the external electronic device, using at least one logical channel or session for a respective one of the two or more application programs.Type: ApplicationFiled: December 21, 2018Publication date: May 2, 2019Inventors: Ki-Soo CHO, Aravind IYER, Mahesh ANJANAPPA, Ranjeet Kumar PATRO, Prasad Tirumala Sree Hari Vara VADLAPUDI, Suck-Ho SEO, In-Hyuk CHOI, Il-Sung HONG, Abhijit C. PATHAK, Amit PRABHUDESAI, Ashok SUBASH, Ravindra Balkrishna SHET, Dong-Hyoun SON, Byeong-Ho SHIM, Ji-Ryang CHUNG, Kangli HAO, Madhavan VASUDEVAN, Mahesh Malagouda PATIL, M.S.S.K. SHARMA, Ranjitsinh Udaysinh WABLE, Shekhar Anantha AMBEKAR, Subba Reddy Venkata KOTA, Raghavendra Vaddarahalli RAMEGOWDA, Varunjith Therath KAINOTH, Vishwanath BALEKUDIGE GOPALKRISHNA, Nam-Kun KIM, Young-Ju KIM, Jeong-Mi KIM, Chang-Sik KIM, Hyeong-Geun KIM, Shashanka DASARI, Gyu-Seok SHIM, Won-Geun SHIM, Anil AGIWAL, Jin-Hyuk LEE, Sang-Hyun HAN, In-Hyup HWANG, Ji-Young HWANG
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Patent number: 10276629Abstract: A light emitting device package and a method of manufacturing the light emitting device package are provided. The light emitting package includes a light emitting stack including a first conductivity-type semiconductor layer, an active layer, a second conductivity-type semiconductor layer sequentially stacked, and having a first surface provided by the first conductivity-type semiconductor layer and a second surface provided by the second conductivity-type semiconductor layer and opposing the first surface; a first electrode structure disposed on a portion of the first surface and connected to the first conductivity-type semiconductor layer; a sealing portion disposed adjacent to the light emitting stack; an insulating layer disposed between the light emitting stack and the sealing portion; and a first metal pad disposed on the second surface and passing through the insulating layer at a side of the light emitting stack to connect to the first electrode structure.Type: GrantFiled: July 1, 2016Date of Patent: April 30, 2019Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Dong Kuk Lee, Yong Min Kwon, Hyung Kun Kim
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Publication number: 20190091503Abstract: Related are a chemical warfare agent (CWA) decontaminant, a method of decontaminating a CWA using the CWA decontaminant, and a product including the CWA decontaminant. The CWA decontaminant may include a metal-organic framework (MOF) including at least one metallic compound among metal hydroxide, metal hydride, metal acetate, metal methoxide, and metal oxide, and the at least one metallic compound may be dispersed either on a surface of the MOF or in pores of the MOF, or both.Type: ApplicationFiled: August 23, 2018Publication date: March 28, 2019Applicants: AGENCY FOR DEFENSE DEVELOPMENT, UNIVERSIDAD DE GRANADAInventors: Sam Gon RYU, Myung Kyu PARK, Min Kun KIM, Jorge Rodriguez NAVARRO, Rodrigo Gil San MILLAN, Elena Lopez MAYA, Elisa BAREA
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Publication number: 20190006107Abstract: A multilayer ceramic capacitor includes a body including first and second dielectric layers and having first to sixth surfaces; a second internal electrode disposed on the second dielectric layer to face the first internal electrode with the first or second dielectric layer interposed therebetween, exposed to the fourth, fifth, and sixth surfaces, and disposed to be spaced apart from the third surface by a second space; a first dielectric pattern disposed in at least a portion of the first space; a second dielectric pattern disposed in at least a portion of the second space; a side insulating layer disposed on the fifth and sixth surfaces; a first external electrode disposed on the third surface; and a second external electrode disposed on the fourth surface, in which the first and second dielectric patterns have a color different from the first and second dielectric layers.Type: ApplicationFiled: June 13, 2018Publication date: January 3, 2019Inventors: Tae Hoon KIM, Byung Kun KIM, Byung Chul JANG, Chang Hak CHOI, Jung Deok PARK
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Patent number: D853643Type: GrantFiled: December 29, 2017Date of Patent: July 9, 2019Assignee: HYUNDAI TECH CO., LTDInventor: Yong Kun Kim