Abstract: The present invention relates to a vinyl chloride polymer having good thermal stability due to the restraint of dehydrochlorination by heat or ultraviolet rays, and a method of preparing the same. The generation of the dehydrochlorination of the vinyl chloride polymer due to heat or ultraviolet rays may be markedly restrained, the thermal stability thereof may be improved, and the discoloration thereof or the modification of the physical properties thereof may be prevented. In addition, a modifier may be introduced to a polymerization process at the end of the polymerization, and high thermal stability may be attained without generating the transformation of the vinyl chloride polymer.

Abstract: The present invention relates to a vinyl chloride-based polymer, a method of preparing the same, and a plastisol including the vinyl chloride-based polymer. The vinyl chloride-based polymer according to the present invention may exhibit high viscosity characteristics in a low shear region by having particle size distribution characteristics, in which particles having a relatively small particle diameter and particles having a relatively large particle diameter are distributed at a specific ratio, and may exhibit low viscosity characteristics in a high shear region due to small increases in viscosity and stress as shear rate increases, and thus, the vinyl chloride-based polymer may be easily used in a spray coating process. Therefore, the vinyl chloride-based polymer according to the present invention and the method of preparing the same may be easily applied to industries that need them, for example, vinyl chloride-based resin industry for paste processing.

Abstract: The present invention relates to a vinyl chloride-based polymer showing high viscosity properties in a low shear region and showing viscosity and stress decreasing properties in line with the increase of a shear rate, a method for preparing the same, and a plastisol comprising the same. Since the vinyl chloride-based polymer comprises a saponified emulsifier in a specific ratio, high viscosity properties may be shown in a low shear region, and Bingham fluid flow properties may be shown, by which viscosity and stress decrease in line with the increase of a shear rate.

Abstract: The present invention relates to a vinyl chloride-based polymer which has improved thermal stability and a method for preparing the same. The vinyl chloride-based polymer includes silicate compound derived units, and a dehydrochloric acid (dehydrochlorination) reaction due to heat or ultraviolet rays may be suppressed, and thus, thermal stability may be improved, and discoloration and deformation of physical properties may be prevented. Accordingly, the vinyl chloride-based polymer and the method for preparing the same may be readily applied to industries requiring a vinyl chloride-based polymer, for example, industries related to a vinyl chloride-based resin and molded articles thereof.

Abstract: A method for managing a temperature of a device includes determining a temperature of a circuit or a package including the circuit, and selectively operating a thermoelectric semiconductor based on the determined temperature to adjust the temperature of the circuit or the package.

Abstract: The present invention relates to a method of preparing a vinyl chloride polymer having good thermal stability by restraining a dehydrochlorination reaction due to heat or ultraviolet rays, and a vinyl chloride polymer prepared thereby. According to the preparation method, the adding point of a modifier is controlled, and a vinyl chloride polymer markedly restraining the generation of dehydrochloric acid due to heat or ultraviolet rays may be prepared. Therefore, the preparation method of the vinyl chloride polymer via the emulsion polymerization and the vinyl chloride polymer prepared thereby in the present invention may be readily applied to industries requiring the vinyl chloride polymer such as industries concerning a vinyl chloride resin and a molded article.

Abstract: A semiconductor device includes a substrate, a first semiconductor package disposed on the substrate, and a second semiconductor package spaced apart from the first semiconductor package on the substrate. The second semiconductor package includes a semiconductor chip stacked on the substrate, an adhesion part covering the semiconductor chip, and a heat-blocking structure disposed between the substrate and the semiconductor chip. Heat generated from the first semiconductor package and transmitted to the second semiconductor package through the substrate is blocked by the heat-blocking structure.

Abstract: A device includes a first board having a first area and a second area not overlapping the first area; and a thermoelectric semiconductor disposed between the first board and the second board at the first area of the first board configured to supply a voltage to the thermoelectric semiconductor; a package disposed at the second area of the first board.

Abstract: A semiconductor package includes a first package including a first substrate and a first semiconductor chip mounted on the first substrate and a second package facing and spaced apart from the first package. The second package includes a second substrate on which a second semiconductor chip is mounted. The semiconductor package also includes a connection structure electrically connecting the first and second packages to each other, a first temperature sensor connected to the first substrate, a second temperature sensor connected to the first semiconductor chip, and a third temperature sensor connected to the second semiconductor chip.

Abstract: The present invention relates to a method of preparing a vinyl chloride polymer having good thermal stability due to the restraint of dehydrochlorination by heat or ultraviolet rays, and a vinyl chloride polymer prepared thereby. In the preparation method, a modifier is introduced at the end of a polymerization process to impart the vinyl chloride polymer with high thermal stability without inducing modification. Therefore, the generation of dehydrochlorination due to heat or ultraviolet rays may be markedly restrained, thermal stability may be improved, and discoloration or the modification of physical properties may be prevented in the vinyl chloride polymer thus prepared.

Abstract: The present invention relates to a method of preparing a vinyl chloride polymer having good thermal stability due to the restraint of dehydrochlorination by heat or ultraviolet rays, and a vinyl chloride polymer prepared thereby. In the preparation method, a modifier is introduced at the end of a polymerization process to impart the vinyl chloride polymer with high thermal stability without inducing modification. Therefore, the generation of dehydrochlorination due to heat or ultraviolet rays may be markedly restrained, thermal stability may be improved, and discoloration or the modification of physical properties may be prevented in the vinyl chloride polymer thus prepared.

Abstract: This invention relates to an integrated gasification apparatus for carbonaceous fuel, wherein high-pressure steam produced during a gasification process of carbonaceous fuel is directly used to dry the carbonaceous fuel, and steam obtained through the drying process is directly used in a water gas shift process.

Abstract: The present invention relates to a method of preparing a vinyl chloride polymer having good thermal stability by restraining a dehydrochlorination reaction due to heat or ultraviolet rays, and a vinyl chloride polymer prepared thereby. According to the preparation method, the adding point of a modifier is controlled, and a vinyl chloride polymer markedly restraining the generation of dehydrochloric acid due to heat or ultraviolet rays may be prepared. Therefore, the preparation method of the vinyl chloride polymer via the emulsion polymerization and the vinyl chloride polymer prepared thereby in the present invention may be readily applied to industries requiring the vinyl chloride polymer such as industries concerning a vinyl chloride resin and a molded article.

Abstract: The present invention relates to a method of preparing a vinyl chloride polymer having good thermal stability due to the restraint of dehydrochlorination by heat or ultraviolet rays, and a vinyl chloride polymer prepared thereby. In the preparation method, a modifier is introduced at the end of a polymerization process to impart the vinyl chloride polymer with high thermal stability without inducing modification. Therefore, the generation of dehydrochlorination due to heat or ultraviolet rays may be markedly restrained, thermal stability may be improved, and discoloration or the modification of physical properties may be prevented in the vinyl chloride polymer thus prepared.

Abstract: The present invention relates to a method of preparing a vinyl chloride polymer having good thermal stability due to the restraint of dehydrochlorination by heat or ultraviolet rays, and a vinyl chloride polymer prepared thereby. In the preparation method through bulk polymerization, a modifier is introduced to a polymerization process to impart the vinyl chloride polymer with high thermal stability without inducing modification. Therefore, the preparation method via the bulk polymerization of the vinyl chloride polymer and the vinyl chloride polymer prepared thereby according to the present invention may be readily applied to industries requiring thereof such as industries concerning a vinyl chloride resin and the molded article thereof.

Abstract: The present invention relates to a vinyl chloride polymer having good thermal stability due to the restraint of dehydrochlorination by heat or ultraviolet rays, and a method of preparing the same. The generation of the dehydrochlorination of the vinyl chloride polymer due to heat or ultraviolet rays may be markedly restrained, the thermal stability thereof may be improved, and the discoloration thereof or the modification of the physical properties thereof may be prevented. In addition, a modifier may be introduced to a polymerization process at the end of the polymerization, and high thermal stability may be attained without generating the transformation of the vinyl chloride polymer.

Abstract: According to example embodiments, a semiconductor package includes a lower package, upper packages on the lower package and laterally spaced apart from each other, a lower heat exhaust part between the lower package and the upper packages, an intermediate heat exhaust part between the upper packages and connected to the lower heat exhaust part, and an upper heat exhaust part on the upper packages and connected to the intermediate heat exhaust part.

Abstract: A semiconductor device includes a substrate, a first semiconductor package disposed on the substrate, and a second semiconductor package spaced apart from the first semiconductor package on the substrate. The second semiconductor package includes a semiconductor chip stacked on the substrate, an adhesion part covering the semiconductor chip, and a heat-blocking structure disposed between the substrate and the semiconductor chip. Heat generated from the first semiconductor package and transmitted to the second semiconductor package through the substrate is blocked by the heat-blocking structure.

Abstract: A device includes a first board having a first area and a second area not overlapping the first area; and a thermoelectric semiconductor disposed between the first board and the second board at the first area of the first board configured to supply a voltage to the thermoelectric semiconductor; a package disposed at the second area of the first board.

Abstract: Provided are thermoelectric cooling packages and thermal management methods thereof. The method may include measuring a temperature of the thermoelectric cooling package including a semiconductor chip and a thermoelectric cooler, comparing the temperature of the thermoelectric cooling package with a target temperature, operating the thermoelectric cooler when the temperature of the thermoelectric cooling package is higher than the target temperature, and stopping the operation of the thermoelectric cooler when the temperature of the thermoelectric cooling package becomes lower than the target temperature.