Abstract: This invention relates to an integrated gasification apparatus for carbonaceous fuel, wherein high-pressure steam produced during a gasification process of carbonaceous fuel is directly used to dry the carbonaceous fuel, and steam obtained through the drying process is directly used in a water gas shift process.

Abstract: Provided is a semiconductor module. The semiconductor module includes a substrate including a first surface and a second surface opposite to the first surface. A semiconductor device is disposed on the first surface of the substrate. An airflow guide is disposed on the second surface of the substrate. The airflow guide includes a plate including an end portion distantly from the second surface.

Abstract: A semiconductor package usable with a mobile device includes a circuit board including conductive wirings therein and contact terminals on a rear surface thereof, an integrated circuit chip positioned on a front surface of the circuit board and electrically connected to the conductive wirings, a cover including at least an opening, and to cover the integrated circuit chip such that a flow space is provided around the integrated circuit chip and the opening communicates with the flow space, and an air flow generator positioned on the cover to generate a compulsory air flow through the flow space and the opening, thereby dissipating heat out of the semiconductor package from the integrated circuit chip by the compulsory air flow.

Abstract: According to example embodiments, a semiconductor package includes a lower package, upper packages on the lower package and laterally spaced apart from each other, a lower heat exhaust part between the lower package and the upper packages, an intermediate heat exhaust part between the upper packages and connected to the lower heat exhaust part, and an upper heat exhaust part on the upper packages and connected to the intermediate heat exhaust part.

Abstract: Provided is a protection coordination system. The system includes a current limiter arranged on a line between a first relay and a second relay to limit a fault current generated to within a predetermined scope.

Abstract: A semiconductor package includes a first package including a first substrate and a first semiconductor chip mounted on the first substrate and a second package facing and spaced apart from the first package. The second package includes a second substrate on which a second semiconductor chip is mounted. The semiconductor package also includes a connection structure electrically connecting the first and second packages to each other, a first temperature sensor connected to the first substrate, a second temperature sensor connected to the first semiconductor chip, and a third temperature sensor connected to the second semiconductor chip.

Abstract: According to example embodiments, a semiconductor package may include a first package substrate, a first semiconductor chip on the first package substrate, and a thermistor array film on the first semiconductor chip. The thermistor array film may include a variable resistive film that covers the first semiconductor chip, and an array of electrode patterns that are connected to the variable resistive film. The array of electrode patterns may be connected to at least one of the upper and lower surfaces of the variable resistive film.

Abstract: Provided are thermoelectric cooling packages and thermal management methods thereof. The method may include measuring a temperature of the thermoelectric cooling package including a semiconductor chip and a thermoelectric cooler, comparing the temperature of the thermoelectric cooling package with a target temperature, operating the thermoelectric cooler when the temperature of the thermoelectric cooling package is higher than the target temperature, and stopping the operation of the thermoelectric cooler when the temperature of the thermoelectric cooling package becomes lower than the target temperature.

Abstract: A semiconductor package usable with a mobile device includes a circuit board including conductive wirings therein and contact terminals on a rear surface thereof, an integrated circuit chip positioned on a front surface of the circuit board and electrically connected to the conductive wirings, a cover including at least an opening, and to cover the integrated circuit chip such that a flow space is provided around the integrated circuit chip and the opening communicates with the flow space, and an air flow generator positioned on the cover to generate a compulsory air flow through the flow space and the opening, thereby dissipating heat out of the semiconductor package from the integrated circuit chip by the compulsory air flow.

Abstract: Provided is a semiconductor module. The semiconductor module includes a substrate including a first surface and a second surface opposite to the first surface. A semiconductor device is disposed on the first surface of the substrate. An airflow guide is disposed on the second surface of the substrate. The airflow guide includes a plate including an end portion distantly from the second surface.

Abstract: Provided is a protection coordination system, the system includes a current limiter arranged on a line between a first and a relays to limit a fault current generated to within a predetermined scope.

Abstract: The present invention is related to a hybrid fault current limiter comprising a switching unit detaching a moving contact located on a cable and transmitting a trip signal if a fault current is flowed at an electric power system, a semiconductor switching unit connected in series with the switching unit and configured to be turned off to limit the flow of the fault current when the trip signal is transmitted, and a circuit breaking unit connected in parallel to the switching unit and the semiconductor switching unit and configured to limit the fault current detoured from the switching unit and the semiconductor switching unit. The present invention provides rapid treatment for the fault current problem by applying the algorithm sensing the occurrence of the fault current and the algorithm limiting the fault current simultaneously.

Abstract: The present disclosure is related to a fault current limiter comprising, a current limiting unit configured to limit a fault current according to a reactance value by increasing the reactance value if the fault current is generated, and a driving unit configured to increases an inductance of the current limiting unit by generating a repulsive force by means of the fault current when the fault current is received and the driving unit is connected to the front end of the current limiting unit.

Abstract: The present disclosure relates to a fault current limiter, comprising: a trigger device dividing a fault current to a path on which a normal current flows and to a path on which the fault current flows when the fault current is generated; a first switch connected in series to a rear end of the trigger device; a fixation unit for fixing an open/close state of the first switch; a driver for opening a contact point contacted by the first switch by repulsive force generated by the fault current in a case the fault current divided by the trigger device is inputted; and a control module for driving the fixation unit in order to fix the open/close state of the first switch in a case the fault current is generated.

Abstract: A semiconductor module includes a semiconductor package generating thermal energy, a heat collecting member transferring thermal energy from the semiconductor package to a heat collection area in the heat collecting member, a heat radiating member transferring thermal energy received from the heat collecting member and package to the outside, and a thermoelectric device transferring thermal energy through the heat collection area to the heat radiating member via the thermoelectric effect. The heat collecting member and heat radiating member may be otherwise insulated so thermal energy is transferred and controlled by the thermoelectric device. The package may be a dynamic random access memory (DRAM), microprocessor, central processing unit (CPU), graphic processing unit (GPU), or flash memory. The heat radiating member may be an external case of a solid state disk (SSD), and the thermoelectric device may be a Peltier cooler controlled through a power line.

Abstract: The present disclosure is related to a peak current limiting apparatus of the present disclosure comprising a trigger element serially connected between a power supply source and the load, diverting a fault current to other paths connected in parallel when the fault current exceeding a threshold is generated, a main contact switch serially connected between the trigger element and a load, a driving coil connected in parallel with the trigger element, and generating a repulsive force in response to the fault current to detach a contact point of the main contact switch, and a peak limiting impedance element serially connected between a connection node between the trigger element and the main contact switch and the driving coil, and limiting a first peak level of the fault current flowing through the driving coil to a predetermined level.

Abstract: The present invention is related to a hybrid fault current limiter comprising a switching unit detaching a moving contact located on a cable and transmitting a trip signal if a fault current is flowed at an electric power system, a semiconductor switching unit connected in series with the switching unit and configured to be turned off to limit the flow of the fault current when the trip signal is transmitted, and a circuit breaking unit connected in parallel to the switching unit and the semiconductor switching unit and configured to limit the fault current detoured from the switching unit and the semiconductor switching unit. The present invention provides rapid treatment for the fault current problem by applying the algorithm sensing the occurrence of the fault current and the algorithm limiting the fault current simultaneously.

Abstract: A semiconductor module includes a semiconductor package generating thermal energy, a heat collecting member transferring thermal energy from the semiconductor package to a heat collection area in the heat collecting member, a heat radiating member transferring thermal energy received from the heat collecting member and package to the outside, and a thermoelectric device transferring thermal energy through the heat collection area to the heat radiating member via the thermoelectric effect. The heat collecting member and heat radiating member may be otherwise insulated so thermal energy is transferred and controlled by the thermoelectric device. The package may be a dynamic random access memory (DRAM), microprocessor, central processing unit (CPU), graphic processing unit (GPU), or flash memory. The heat radiating member may be an external case of a solid state disk (SSD), and the thermoelectric device may be a Peltier cooler controlled through a power line.

Abstract: The present disclosure relates to a fault current limiter, comprising: a trigger device dividing a fault current to a path on which a normal current flows and to a path on which the fault current flows when the fault current is generated; a first switch connected in series to a rear end of the trigger device; a fixation unit for fixing an open/close state of the first switch; a driver for opening a contact point contacted by the first switch by repulsive force generated by the fault current in a case the fault current divided by the trigger device is inputted; and a control module for driving the fixation unit in order to fix the open/close state of the first switch in a case the fault current is generated.

Abstract: The present disclosure is related to a fault current limiter comprising, a current limiting unit configured to limit a fault current according to a reactance value by increasing the reactance value if the fault current is generated, and a driving unit configured to increases an inductance of the current limiting unit by generating a repulsive force by means of the fault current when the fault current is received and the driving unit is connected to the front end of the current limiting unit.