Patents by Inventor In Kyu You

In Kyu You has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHOD OF FORMING GRAPHENE ELECTRODE AND CAPACITOR INCLUDING THE SAME
    Publication number: 20150109719
    Abstract: Provided is a method of forming a graphene electrode including providing a solution including graphenes on a substrate, pressing a mold having a pattern onto the substrate to fill up the solution in the pattern of the mold, applying a temperature and a pressure to the mold so that the graphenes are arranged in a vertical direction with respect to a surface of the substrate, removing the solution, and separating the mold from the substrate to form an electrode including the graphenes on the substrate.
    Type: Application
    Filed: April 29, 2014
    Publication date: April 23, 2015
    Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Ho-Gyeong YUN, In-Kyu YOU, Yong Suk YANG, Sunghoon HONG
  • METHOD OF MANUFACTURING A FLEXIBLE FLAT CABLE
    Publication number: 20140205747
    Abstract: A flexible flat cable which includes wire cores, insulation coating layers surrounding the wire cores, shield coating layers surrounding the insulation coating layers, an upper insulation plate layer formed on the shield coating layers, a lower insulation plate layer formed under the shield coating layers and opposite to the upper insulation plate layer, and a shield plate layer formed under the lower insulation plate layer.
    Type: Application
    Filed: March 26, 2014
    Publication date: July 24, 2014
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: Yong Suk YANG, In-Kyu YOU, Jae Bon KOO, Su Jae LEE, Taeyoub KIM, Soon-Won JUNG, Kang-Jun BAEG
  • Radio frequency identification tag
    Patent number: 8786441
    Abstract: Provided is a radio frequency identification (RFID) tag. The RFID tags includes: a conductive layer and a conductive line disposed above and below an insulation layer, respectively; an antenna connected to one end of the conductive line; a resistor connected to the other end of the conductive line; a first conductive plate connected to the conductive line and constituting a first capacitor in conjunction with the conductive layer and the insulation layer; and a first sensing device connected between the conductive line and the conductive layer and having an impedance changed according to a sensing of a first target material.
    Type: Grant
    Filed: November 30, 2011
    Date of Patent: July 22, 2014
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Yong Suk Yang, In-Kyu You, Jae Bon Koo
  • TERAHERTZ HEALTH CHECKER
    Publication number: 20140198195
    Abstract: Provided is a terahertz health checker. The terahertz health checker includes a terahertz wave transmitter generating terahertz waves in a terahertz band, a lens outputting the terahertz waves and receiving terahertz waves reflected from the outputted terahertz waves, an imaging chip connected to the lens, detecting the received terahertz waves, and generating a digital image signal based on the detected terahertz waves, a readout circuit reading out the digital image signal, and a transceiver outputting the read-out digital image signal to the outside.
    Type: Application
    Filed: January 16, 2014
    Publication date: July 17, 2014
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: Dong Suk JUN, Seok-Hwan MOON, In-Kyu YOU, Jae Ick CHOI
  • Flexible flat cable and manufacturing method thereof
    Patent number: 8723042
    Abstract: A flexible flat cable which includes wire cores, insulation coating layers surrounding the wire cores, shield coating layers surrounding the insulation coating layers, an upper insulation plate layer formed on the shield coating layers, a lower insulation plate layer formed under the shield coating layers and opposite to the upper insulation plate layer, and a shield plate layer formed under the lower insulation plate layer.
    Type: Grant
    Filed: February 28, 2012
    Date of Patent: May 13, 2014
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Yong Suk Yang, In-Kyu You, Jae Bon Koo, Su Jae Lee, Taeyoub Kim, Soon-Won Jung, Kang-Jun Baeg
  • PLANARIZING PRINTED ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20140076610
    Abstract: Disclosed are a method for manufacturing a planarizing printed electronic device and a planarizing printed electronic device manufactured by using the same by simply implementing a large-area embedded printed electronic device by coupling a printing process such as inkjet printing and gravure printing and a transferring process using a laminating device and particularly, solving defects due to large surface roughness and a thickness of a printed layer included in the printed electronic device, when manufacturing an embedded printed electronic device where a printed layer is embedded in a substrate.
    Type: Application
    Filed: July 3, 2013
    Publication date: March 20, 2014
    Inventors: Yong Suk YANG, In-Kyu You, Minseok Kim, Soon-Won Jung, Bock Soon Na, Sang Chul Lim
  • MOBILE E-BINDER SYSTEM
    Publication number: 20140062838
    Abstract: Provided is a mobile e-binder system including at least one display configured to display data, a docking system electrically connected to the at least one display to exchange the data using a standardized communication protocol, and a computing device configured to store and process the data and send the data to the at least one display. The at least one display may be configured to be attachable and detachable to the docking system.
    Type: Application
    Filed: July 19, 2013
    Publication date: March 6, 2014
    Inventors: In-Kyu YOU, Seok-Hwan Moon, Yong-Suk Yang, Soon-Won Jung
  • ACTIVE CLICHE FOR LARGE-AREA PRINTING, MANUFACTURING METHOD OF THE SAME, AND PRINTING METHOD USING THE SAME
    Publication number: 20140063124
    Abstract: Provided are a large-area nano-scale active printing device, a fabricating method of the same, and a printing method using the same. The printing device may include a substrate, first interconnection lines extending along a first direction, on the substrate, an interlayered dielectric layer provided on the first interconnection lines to have holes partially exposing the first interconnection lines, second interconnection lines provided adjacent to the holes in the interlayered dielectric layer to cross the first interconnection lines, and wedge-shaped electrodes provided at intersections with the first and second interconnection lines and connected to the first interconnection lines. The wedge-shaped electrodes protrude upward at centers of the holes.
    Type: Application
    Filed: August 14, 2013
    Publication date: March 6, 2014
    Inventors: Yong Suk Yang, In-Kyu You, Soon-Won Jung, Bock Soon Na, Seok-Hwan Moon
  • Offset printer
    Patent number: 8656836
    Abstract: Provided is an offset printer configured to increase or maximize productivity and yield. The offset printer includes a printing roller, a coating unit configured to apply a printing substance to the printing roller, a patterning unit configured to pattern the printing substance applied to the printing roller from the coating unit, a printing unit configured to transfer the patterned printing substance to a printing medium, and a cleaning unit configured to clean the printing substance remaining on the printing roller by a dry cleaning method.
    Type: Grant
    Filed: November 11, 2011
    Date of Patent: February 25, 2014
    Assignee: Intellectual Discovery Co., Ltd.
    Inventors: Jae Bon Koo, In-Kyu You, Minseok Kim, Taeyoub Kim
  • Transferred thin film transistor and method for manufacturing the same
    Patent number: 8653631
    Abstract: Provided are a transferred thin film transistor and a method of manufacturing the same. The method includes: forming a source region and a drain region that extend in a first direction in a first substrate and a channel region between the source region and the drain region; forming trenches that extend in a second direction in the first substrate to define an active layer between the trenches, the second direction intersecting the first direction; separating the active layer between the trenches from the first substrate by performing an anisotropic etching process on the first substrate inside the trenches; attaching the active layer on a second substrate; and forming a gate electrode in the first direction on the channel region of the active layer.
    Type: Grant
    Filed: February 25, 2013
    Date of Patent: February 18, 2014
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Jae Bon Koo, Jong-Hyun Ahn, Seung Youl Kang, Hasan Musarrat, In-Kyu You, Kyoung Ik Cho
  • MULTI-LAYER INTERCONNECTION STRUCTURE
    Publication number: 20130292160
    Abstract: Provided are a multi-layer interconnection structure and a manufacturing method thereof. The multi-layer interconnection structure includes a substrate; a first wiring on the substrate; an interlayer insulation layer on the first wiring; a second wiring on the interlayer insulation layer; and a via contact including at least one conductive filament penetrating through the interlayer insulation layer between the second wiring and the first wiring to be electrically connected to the first wiring and the second wiring.
    Type: Application
    Filed: July 11, 2013
    Publication date: November 7, 2013
    Inventors: Yong Suk YANG, In-Kyu YOU, Jae Bon KOO, Yong-Young NOH
  • Method of making a multi-layer interconnecting structure
    Patent number: 8516689
    Abstract: Provided are a multi-layer interconnection structure and a manufacturing method thereof. The multi-layer interconnection structure includes a substrate; a first wiring on the substrate; an interlayer insulation layer on the first wiring; a second wiring on the interlayer insulation layer; and a via contact including at least one conductive filament penetrating through the interlayer insulation layer between the second wiring and the first wiring to be electrically connected to the first wiring and the second wiring.
    Type: Grant
    Filed: January 7, 2010
    Date of Patent: August 27, 2013
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Yong Suk Yang, In-Kyu You, Jae Bon Koo, Yong-Young Noh
  • METHOD FOR MANUFACTURING FLEXIBLE ELECTRODE SUBSTRATE
    Publication number: 20130108777
    Abstract: Provided is a method for manufacturing a flexible electrode substrate. The method includes forming a microlens array under a film, forming a transparent electrode layer on the film so as to oppose the microlens array, and forming a grid electrode between the film and the transparent electrode layer or on the transparent electrode layer. Herein, the grid electrode and the microlens array are formed on the both sides of the film by performing at least one of an inkjet printing process, a roll-to-roll printing process, a screen printing process, and a stamping printing process.
    Type: Application
    Filed: July 20, 2012
    Publication date: May 2, 2013
    Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Jae Bon KOO, In-Kyu YOU, Yong Suk YANG, Minseok KIM
  • CABLE, METHOD OF MANUFACTURING THE SAME, AND APPARATUS FOR DEPOSITING DIELECTRIC LAYER
    Publication number: 20130092415
    Abstract: The inventive concept provides cables, methods of manufacturing the same, and apparatuses for depositing a dielectric layer. The cable may include a first electrode, a second electrode spaced apart from the first electrode, and a dielectric layer disposed between the first and second electrodes and including a polymer having xylene as a monomer.
    Type: Application
    Filed: September 14, 2012
    Publication date: April 18, 2013
    Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Yong Suk YANG, In-Kyu YOU, Jae Bon KOO, Soon-Won JUNG
  • Touch screen and method of operating the same
    Patent number: 8421610
    Abstract: Provided are a touch screen and a method of operating the same. The touch screen includes a detecting part, a control part, and a tactile feedback part. The detecting part detects object's approach or contact. The control part receives a signal of the detecting part to output a feedback signal. The tactile feedback part receives the feedback signal of the control part to provide a tactile feedback to a contact position using a magnetic force. The tactile feedback uses the magnetic force of a magnetic dipole.
    Type: Grant
    Filed: August 3, 2009
    Date of Patent: April 16, 2013
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Seongdeok Ahn, In-Kyu You, Jiyoung Oh, Chul Am Kim, Jae Bon Koo, Sang Seok Lee, Kyung Soo Suh, Kyoung Ik Cho
  • Transferred thin film transistor and method for manufacturing the same
    Patent number: 8404532
    Abstract: Provided are a transferred thin film transistor and a method of manufacturing the same. The method includes: forming a source region and a drain region that extend in a first direction in a first substrate and a channel region between the source region and the drain region; forming trenches that extend in a second direction in the first substrate to define an active layer between the trenches, the second direction intersecting the first direction; separating the active layer between the trenches from the first substrate by performing an anisotropic etching process on the first substrate inside the trenches; attaching the active layer on a second substrate; and forming a gate electrode in the first direction on the channel region of the active layer.
    Type: Grant
    Filed: May 18, 2010
    Date of Patent: March 26, 2013
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Jae Bon Koo, Jong-Hyun Ahn, Seung Youl Kang, Hasan Musarrat, In-Kyu You, Kyoung Ik Cho
  • ORGANIC LIGHT EMITTING DIODE AND METHOD OF FABRICATING THE SAME
    Publication number: 20130056713
    Abstract: The inventive concept provides organic light emitting diodes and methods of fabricating the same. The method may include forming an insulating layer on a substrate, coating a metal ink on the insulating layer, thermally treating the substrate to permeate the metal ink into the insulating layer, thereby forming an assistant electrode layer the insulating layer and the metal ink embedded in the insulating layer, and sequentially forming a first electrode, an organic light emitting layer, a second electrode on the assistant electrode layer.
    Type: Application
    Filed: July 5, 2012
    Publication date: March 7, 2013
    Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Jae Bon KOO, In-Kyu YOU, Yong Suk YANG, Tae-Youb KIM, Minseok KIM
  • Method of manufacturing thin film transistor and thin film transistor substrate
    Patent number: 8378421
    Abstract: A thin film transistor substrate. The thin film transistor substrate includes a substrate, an adhesive layer on the substrate, and a semiconductor layer having a first doped region, a second doped region and a channel region on the adhesive layer. The thin film transistor substrate further includes a first dielectric layer on the semiconductor layer, a gate electrode overlapping the channel region, a second dielectric layer on the first dielectric layer and the gate electrode, a source electrode disposed on the second insulating layer, and a drain electrode spaced apart from the source electrode on the source electrode. The channel region is disposed between the first doped region and the second doped region, and has a transmittance higher than those of the first doped region and the second doped region.
    Type: Grant
    Filed: January 13, 2012
    Date of Patent: February 19, 2013
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Jae Bon Koo, In-Kyu You, Seongdeok Ahn, Kyoung Ik Cho
  • Composition for an organic dielectric
    Patent number: 8362467
    Abstract: A composition for an organic dielectric, includes a compound represented by Formula 1 below; and a cross-linking agent, wherein, in Formula 1, R1 is any one of hydrogen, hydroxyl group, ester group, amide group, or alkyl group or alkoxy group of a carbon number of 1 to 12, R2 is selected from electrolytic functional groups, each of a and b is a positive integer, and the ratio of b to a (b/a) is larger than 0 and smaller than 99,
    Type: Grant
    Filed: April 28, 2010
    Date of Patent: January 29, 2013
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Yong-Young Noh, In-Kyu You, Jae Bon Koo, Soon Won Jung
  • ORGANIC THIN FILM TRANSISTORS AND METHODS OF FORMING THE SAME
    Publication number: 20130005079
    Abstract: Provided is an organic thin film transistor, method of forming the same, and a memory device employing the same. The organic thin film transistor includes a substrate, a source electrode and a drain electrode on the substrate, an active layer on the substrate between the source electrode and the drain electrode, a gate electrode controlling the active layer, and an organic dielectric layer between the active layer and the gate electrode. The organic dielectric layer includes nanoparticles, a hydrophilic polymer surrounding the nanoparticles, and a hydrophobic polymer.
    Type: Application
    Filed: September 14, 2012
    Publication date: January 3, 2013
    Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Yong-Young NOH, In-Kyu You, Jae Bon Koo