Patents by Inventor In Nam Kang
In Nam Kang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11331416Abstract: Provided is a method for manufacturing a stent, including: coating a coating material on a stent; and drying the stent at a temperature in the range of from 40° C. to 150° C., and the coating and the drying are simultaneously performed.Type: GrantFiled: May 27, 2019Date of Patent: May 17, 2022Assignee: OSSTEM CARDIOTEC CO., LTD.Inventors: Chang Hun Kum, Kwang Soo Kim, Bunam Chang, Jae Hwa Cho, Sung Nam Kang, Gyu Hyun Jin, Hye Young Kwon, Ji Seon Hong, Saet Byeol Kim
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Publication number: 20210308340Abstract: Provided is a method for manufacturing a stent, including: coating a coating material on a stent; and drying the stent at a temperature in the range of from 40° C. to 150° C., and the coating and the drying are simultaneously performed.Type: ApplicationFiled: May 27, 2019Publication date: October 7, 2021Inventors: Chang Hun KUM, Kwang Soo KIM, Bunam CHANG, Jae Hwa CHO, Sung Nam KANG, Gyu Hyun JIN, Hye Young KWON, Ji Seon HONG, Saet Byeol KIM
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Publication number: 20210143105Abstract: A semiconductor device includes a shielding wire formed across a semiconductor die and an auxiliary wire supporting the shielding wire, thereby reducing the size of a package while shielding the electromagnetic interference generated from the semiconductor die. In one embodiment, the semiconductor device includes a substrate having at least one circuit device mounted thereon, a semiconductor die spaced apart from the circuit device and mounted on the substrate, a shielding wire spaced apart from the semiconductor die and formed across the semiconductor die, and an auxiliary wire supporting the shielding wire under the shielding wire and formed to be perpendicular to the shielding wire. In another embodiment, a bump structure is used to support the shielding wire. In a further embodiment, an auxiliary wire includes a bump structure portion and wire portion and both the bump structure portion and the wire portion are used to support the shielding wire.Type: ApplicationFiled: January 22, 2021Publication date: May 13, 2021Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Jun Ho JEON, Kyeong Sool SEONG, Seok Ho NA, Jeong Il KIM, Young Kyu KIM, Sung Ho JEON, Deok In LIM, Sung Moo HONG, Sung Jung KIM, Sung Han RYU, Kyung Nam KANG, Seong Hak YOO
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Publication number: 20210130928Abstract: The present invention provides a method for selective recovery of a valuable metal from a waste denitrification catalyst through alkali fusion, the method comprising the steps of: (a) adding an alkali metal to a waste denitrification catalyst, followed by mixing and alkali fusion, to generate a calcination product; (b) subjecting the calcination product to water-leaching to recover an alkali leachate and a residue; (c) adding a precipitator to the alkali leachate, followed by stirring, to recover calcium metavanadate (Ca(VO3)2) or calcium tungstate (CaWO4) through precipitation; and (d) subjecting the recovered calcium tungstate to acid decomposition to prepare tungstic acid. Therefore, vanadium and tungsten can be recovered at high efficiency by a method in which a precipitator is added to a leachate, which is obtained by adding an excess amount of an alkali metal to a waste denitrification catalyst and carrying out calcination and water-leaching, and then a reaction rate is controlled.Type: ApplicationFiled: July 27, 2018Publication date: May 6, 2021Applicant: Korea Institute Of Geoscience And Mineral ResourcesInventors: Jin-Young LEE, Jung-Shin KANG, Hee-Nam KANG
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Patent number: 10943871Abstract: A semiconductor device includes a shielding wire formed across a semiconductor die and an auxiliary wire supporting the shielding wire, thereby reducing the size of a package while shielding the electromagnetic interference generated from the semiconductor die. In one embodiment, the semiconductor device includes a substrate having at least one circuit device mounted thereon, a semiconductor die spaced apart from the circuit device and mounted on the substrate, a shielding wire spaced apart from the semiconductor die and formed across the semiconductor die, and an auxiliary wire supporting the shielding wire under the shielding wire and formed to be perpendicular to the shielding wire. In another embodiment, a bump structure is used to support the shielding wire. In a further embodiment, an auxiliary wire includes a bump structure portion and wire portion and both the bump structure portion and the wire portion are used to support the shielding wire.Type: GrantFiled: October 18, 2018Date of Patent: March 9, 2021Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Jun Ho Jeon, Kyeong Sool Seong, Seok Ho Na, Jeong Il Kim, Young Kyu Kim, Sung Ho Jeon, Deok In Lim, Sung Moo Hong, Sung Jung Kim, Sung Han Ryu, Kyung Nam Kang, Seong Hak Yoo
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Patent number: 10663469Abstract: A method for diagnosing lung cancer in a subject by using a complex biomarker group is provided. The method includes steps of: (a) a computing system (1) acquiring a model M by using expression level data by individual biomarkers in the complex biomarker group and then (2) acquiring expression level data by the individual biomarkers measured from a biological specimen of the subject or their processed data Bk; and (b) the computing system determining whether lung cancer is detected in the subject by using the acquired data of the subject by referring to the model M; wherein the complex biomarker group includes CEA, HE4, ApoA2, TTR, sVCAM-1 and RANTES.Type: GrantFiled: February 10, 2017Date of Patent: May 26, 2020Assignee: BioInfra Life Science Inc.Inventors: Chul Woo Kim, Yong Dai Kim, Yong Sung Shin, Eun Hee Yeon, Kyung Nam Kang, Ho Sang Shin, Oh Ran Kwon
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Patent number: 10602956Abstract: The present invention relates to a radiation amount estimating method, and more particularly, to a radiation amount estimating method of an MRI based composite image using a lookup table. To this end, the object of the present invention is to provide a radiation dose estimating method of an MRI based composite image using a lookup table including: generating a lookup table representing a linear attenuation coefficient of a region of interest from a CT image (S100); photographing at least two of a T1 image, a T2 image, and a PETRA image of a patient from MRI equipment (S120); generating a composite image by superimposing the photographed images (S140); representing a border line of the region of interest in the composite image to distinguish the region of interest (S160); designating the linear attenuation coefficient of the lookup table in the distinguished region of interest (S180); and estimating a radiation dose based on the composite image to which the linear attenuation coefficient is designated (S200).Type: GrantFiled: March 23, 2017Date of Patent: March 31, 2020Assignee: Catholic University Industry-Academic Cooperation FoundationInventors: Young-Nam Kang, Shin-Wook Kim, Jina Kim, Hun-joo Shin, Hyeong-Wook Park, Chul-Seung Kay, Ki-jun Kim, Jin-Sol Shin
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Publication number: 20190318266Abstract: A computing device of the present invention estimates an unknown parameter ? of a model formula when distributed sample data is acquired, wherein when an estimated quantity of ? is acquired, a function g is estimated using a random forest model, such that when an estimated quantity of g is acquired, the estimated quantity of g and the estimated quantity of ? are used so as estimate a function G as a prediction formula for new data corresponding to a specific item such that an estimated quantity of G is acquired, and thus new data xnew is received, thereby enabling the class of the specific item to be classified from the calculated value.Type: ApplicationFiled: November 9, 2017Publication date: October 17, 2019Inventors: Chul Woo KIM, Yong Dai KIM, Kyung Nam KANG, Oh Ran KWON
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Publication number: 20190269346Abstract: The present invention relates to a radiation amount estimating method, and more particularly, to a radiation amount estimating method of an MRI based composite image using a lookup table. To this end, the object of the present invention is to provide a radiation dose estimating method of an MRI based composite image using a lookup table including: generating a lookup table representing a linear attenuation coefficient of a region of interest from a CT image (S100); photographing at least two of a T1 image, a T2 image, and a PETRA image of a patient from MRI equipment (S120); generating a composite image by superimposing the photographed images (S140); representing a border line of the region of interest in the composite image to distinguish the region of interest (S160); designating the linear attenuation coefficient of the lookup table in the distinguished region of interest (S180); and estimating a radiation dose based on the composite image to which the linear attenuation coefficient is designated (S200).Type: ApplicationFiled: March 23, 2017Publication date: September 5, 2019Applicant: CATHOLIC UNIVERSITY INDUSTRY-ACADEMIC COOPERATION FOUNDATIONInventors: Young-Nam Kang, Shin-Wook Kim, Jina Kim, Hun-joo Shin, Hyeong-Wook Park, Chul-Seung Kay, Ki-jun Kim, Jin-Sol Shin
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Publication number: 20190051616Abstract: A semiconductor device includes a shielding wire formed across a semiconductor die and an auxiliary wire supporting the shielding wire, thereby reducing the size of a package while shielding the electromagnetic interference generated from the semiconductor die. In one embodiment, the semiconductor device includes a substrate having at least one circuit device mounted thereon, a semiconductor die spaced apart from the circuit device and mounted on the substrate, a shielding wire spaced apart from the semiconductor die and formed across the semiconductor die, and an auxiliary wire supporting the shielding wire under the shielding wire and formed to be perpendicular to the shielding wire. In another embodiment, a bump structure is used to support the shielding wire. In a further embodiment, an auxiliary wire includes a bump structure portion and wire portion and both the bump structure portion and the wire portion are used to support the shielding wire.Type: ApplicationFiled: October 18, 2018Publication date: February 14, 2019Applicant: AMKOR TECHNOLOGY INC.Inventors: Jun Ho JEON, Kyeong Sool SEONG, Seok Ho NA, Jeong Il KIM, Young Kyu KIM, Sung Ho JEON, Deok In LIM, Sung Moo HONG, Sung Jung KIM, Sung Han RYU, Kyung Nam KANG, Seong Hak YOO
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Patent number: 10141269Abstract: A semiconductor device includes a shielding wire formed across a semiconductor die and an auxiliary wire supporting the shielding wire, thereby reducing the size of a package while shielding the electromagnetic interference generated from the semiconductor die. In one embodiment, the semiconductor device includes a substrate having at least one circuit device mounted thereon, a semiconductor die spaced apart from the circuit device and mounted on the substrate, a shielding wire spaced apart from the semiconductor die and formed across the semiconductor die, and an auxiliary wire supporting the shielding wire under the shielding wire and formed to be perpendicular to the shielding wire. In another embodiment, a bump structure is used to support the shielding wire. In a further embodiment, an auxiliary wire includes a bump structure portion and wire portion and both the bump structure portion and the wire portion are used to support the shielding wire.Type: GrantFiled: December 3, 2016Date of Patent: November 27, 2018Assignee: Amkor Technology, Inc.Inventors: Jun Ho Jeon, Kyeong Sool Seong, Seok Ho Na, Jeong Il Kim, Young Kyu Kim, Sung Ho Jeon, Deok In Lim, Sung Moo Hong, Sung Jung Kim, Sung Han Ryu, Kyung Nam Kang, Seong Hak Yoo
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Patent number: 10086880Abstract: A battery support structure of a vehicle includes a number of battery support members installed on a bottom surface of a rear floor of a vehicle body to support a battery unit. The battery support members include cross members for battery support extending in a widthwise direction of the vehicle body. A pair of side sills is installed on opposite sides of the rear floor. A rear cross member is installed on the bottom surface of the rear floor. At least one of the plurality of cross members for battery support is connected to the rear cross member and the side sill.Type: GrantFiled: May 29, 2017Date of Patent: October 2, 2018Assignees: Hyundai Motor Company, Kia Motors CorporationInventors: Kyung Hoon Son, Ki Hwan Kim, Ki Nam Kang
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Patent number: 10077331Abstract: A polyurethane filter foam is provided herein. The polyurethane filter foam may have improved permeability by having both a small cell and a large cell in a range for maximizing the opening property of the foam. In some instance, this is achieved by specifically configuring and foaming a composition of polyether polyol and methylene diphenyl diisocyanate (MDI) to manufacture the polyurethane foam. The polyurethane foam of the present invention can be manufactured without performing a reticulation process.Type: GrantFiled: December 27, 2016Date of Patent: September 18, 2018Assignee: Hyundai Motor CompanyInventors: Byung Guk Lim, Sang Do Park, Dong Woo Jeong, Seok Nam Kang, Hoon Bok Lee, Kug Hun Han, Sang Ho Kim, Kwon Yong Choi, Soon Joon Jung, Sung Hoon Lee, Mu Young Kim, Kyung Sam Kim, Yoo Kon Cho, Sung Il Lee
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Publication number: 20180134324Abstract: A battery support structure of a vehicle includes a number of battery support members installed on a bottom surface of a rear floor of a vehicle body to support a battery unit. The battery support members include cross members for battery support extending in a widthwise direction of the vehicle body. A pair of side sills is installed on opposite sides of the rear floor. A rear cross member is installed on the bottom surface of the rear floor. At least one of the plurality of cross members for battery support is connected to the rear cross member and the side sill.Type: ApplicationFiled: May 29, 2017Publication date: May 17, 2018Applicants: Hyundai Motor Company, Kia Motors CorporationInventors: Kyung Hoon Son, Ki Hwan Kim, Ki Nam Kang
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Patent number: 9943212Abstract: A dust suction device includes: a housing having a plurality of inlets for the inflow of impurities formed thereon and an inner region of which is independently divided; and resilient actuating members, provided inside the inlets, for opening or closing the inlets by pressure applied from the outside.Type: GrantFiled: October 4, 2012Date of Patent: April 17, 2018Assignee: TESTONIC CO., LTD.Inventor: Ok Nam Kang
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Publication number: 20180067118Abstract: A method for diagnosing lung cancer in a subject by using a complex biomarker group is provided. The method includes steps of: (a) a computing system (1) acquiring a model M by using expression level data by individual biomarkers in the complex biomarker group and then (2) acquiring expression level data by the individual biomarkers measured from a biological specimen of the subject or their processed data Bk; and (b) the computing system determining whether lung cancer is detected in the subject by using the acquired data of the subject by referring to the model M; wherein the complex biomarker group includes CEA, HE4, ApoA2, TTR, sVCAM-1 and RANTES.Type: ApplicationFiled: February 10, 2017Publication date: March 8, 2018Inventors: Chul Woo Kim, Yong Dai Kim, Yong Sung Shin, Eun Hee Yeon, Kyung Nam Kang, Ho Sang Shin, Oh Ran Kwon
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Publication number: 20180057630Abstract: A polyurethane filter foam is provided herein. The polyurethane filter foam may have improved permeability by having both a small cell and a large cell in a range for maximizing the opening property of the foam. In some instance, this is achieved by specifically configuring and foaming a composition of polyether polyol and methylene diphenyl diisocyanate (MDI) to manufacture the polyurethane foam. The polyurethane foam of the present invention can be manufactured without performing a reticulation process.Type: ApplicationFiled: December 27, 2016Publication date: March 1, 2018Applicant: Hyundai Motor CompanyInventors: Byung Guk LIM, Sang Do PARK, Dong Woo JEONG, Seok Nam KANG, Hoon Bok LEE, Kug Hun HAN, Sang Ho KIM, Kwon Yong CHOI, Soon Joon JUNG, Sung Hoon LEE, Mu Young KIM, Kyung Sam KIM, Yoo Kon CHO, Sung Il LEE
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Patent number: 9805626Abstract: The present invention relates to a respiration mimic device, and includes a chamber having an interior space filled with fluid, a lung mimic, to be contracted or expanded, accommodated at the interior space in the chamber; a lung copying unit including a tumor mimic distributed in the lung mimic; a driving unit for copying motion patterns of the lung according to actual respiration and contracting or expanding the lung mimic; and an abdomen copying unit for elevating vertically according to contraction or expansion of the lung mimic and copying an abdomen.Type: GrantFiled: November 16, 2014Date of Patent: October 31, 2017Assignee: THE CATHOLIC UNIVERSITY OF KOREA INDUSTRY-ACADEMIC COOPERATION FOUNDATIONInventors: Young Nam Kang, Hong Seok Jang, Ja Choon Koo, Ji Na Kim, Hun Joo Shin, Young Kyu Lee, Jae Choon Lee, Hyoung Wook Park, Hyuk Jin Lee, Hae Jin Lee
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Publication number: 20170263568Abstract: A semiconductor device includes a shielding wire formed across a semiconductor die and an auxiliary wire supporting the shielding wire, thereby reducing the size of a package while shielding the electromagnetic interference generated from the semiconductor die. In one embodiment, the semiconductor device includes a substrate having at least one circuit device mounted thereon, a semiconductor die spaced apart from the circuit device and mounted on the substrate, a shielding wire spaced apart from the semiconductor die and formed across the semiconductor die, and an auxiliary wire supporting the shielding wire under the shielding wire and formed to be perpendicular to the shielding wire. In another embodiment, a bump structure is used to support the shielding wire. In a further embodiment, an auxiliary wire includes a bump structure portion and wire portion and both the bump structure portion and the wire portion are used to support the shielding wire.Type: ApplicationFiled: December 3, 2016Publication date: September 14, 2017Applicant: Amkor Technology, Inc.Inventors: Jun Ho JEON, Kyeong Sool SEONG, Seok Ho NA, Jeong Il KIM, Young Kyu KIM, Sung Ho JEON, Deok In LIM, Sung Moo HONG, Sung Jung KIM, Sung Han RYU, Kyung Nam KANG, Seong Hak YOO
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Patent number: 9725590Abstract: Provided are an alkoxysilylated epoxy compound, a composite of which exhibits good heat resistance properties, particularly low CTE and increased glass transition temperature, and a cured product thereof exhibits good flame retardancy and composition of which does not require additional silane coupling agent, a method for preparing the same and a composition and a cured product including the same. An alkoxysilylated epoxy compound including at least one alkoxysilyl group and at least two epoxy groups, a method for preparing the same by epoxide ring-opening reaction of starting material and alkoxysilylation, an epoxy composition including the epoxy compound, and a cured product and a use of the composition are provided. Since chemical bonds may be formed between alkoxysilyl group and filler and between alkoxysilyl groups, chemical bonding efficiency of the composite may be improved. Thus, the composite exhibits good heat resistance properties and the cured product exhibits good flame retardancy.Type: GrantFiled: September 17, 2013Date of Patent: August 8, 2017Assignee: KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGYInventors: Hyun-Aee Chun, Yun-Ju Kim, Su-Jin Park, Sang-Yong Tak, Sung-Hwan Park, Kyung-Nam Kang, Sook-Yeon Park