Abstract: A Radio Frequency (RF) duplexer including Bulk Acoustic Wave Resonators (BAWRs) and an RF filter including BAWRs are provided. The RF duplexer may convert the received signal into a balance signal and output the balance signal via a dual-output port. The RF duplexer may also include a BAWR receiving filter unit including an input end to receive the balance signal from the dual-output port, and an output end used for dual output. The RF duplexer may also include a BAWR transmitting filter unit to transmit a transmitted signal to the antenna via a single-output port.

Abstract: A nano resonator includes a substrate, a first insulating layer disposed on the substrate, a first source disposed on the first insulating layer at a first position, a first drain disposed on the first insulating layer at a second position spaced apart from the first position so that the first drain faces the first source, a first nano-wire channel having a first end connected to the first source and a second end connected to the first drain, and having a doping type and a doping concentration that are identical to a doping type and a doping concentration of the first source and the first drain, and a second nano-wire channel disposed at a predetermined distance from the first nano-wire channel in a direction perpendicular to the substrate or a direction parallel to the substrate.

Abstract: Provided are low pass filters using a bulk acoustic wave resonator (BAWR). A low pass filter may include an input terminal configured to be connected with a first radio frequency (RF) device, an output terminal configured to be connected with a second RF device, a parallel segment including a first BAWR, a third BAWR, and a fifth BAWR that may be connected in parallel with each other to a reference potential, a first series segment having a second BAWR and a first inductor, and a second series segment having a fourth BAWR and a second inductor, and connected in series with the first series segment.

Abstract: Provided are a film for food packaging, capable of having excellent adhesion with a metal deposition layer and thus retaining moisture barrier property while having superior flexibility, transparency, and biodegradability, and a method for manufacturing the same.

Abstract: A thin film bulk acoustic resonator and a method of manufacturing the same is disclosed. The thin film bulk acoustic resonator includes an acoustic resonator including a first electrode, a second electrode, and a piezoelectric layer disposed between the first electrode and the second electrode; an air gap disposed below the acoustic resonator and above a substrate to reflect the acoustic wave; and an anchor disposed on each of both surfaces of the air gap and having the same thickness as the air gap.

Abstract: An equalizer circuit includes an input terminal, a pull-up driving unit suitable for pull-up driving an output terminal based on a signal of the input terminal, a pull-down driving unit suitable for pull-down driving the output terminal, and a capacitor connected between the input terminal and the output terminal.

Abstract: A method of fabricating a multi-band filter module is provided. The method includes forming a Film Bulk Acoustic Resonator (FBAR) on a piezoelectric substrate by forming a resonant part on the piezoelectric substrate and then an air gap recessed on a surface of the piezoelectric substrate and positioned under the resonant part; and forming a Surface Acoustic Wave (SAW) device on the piezoelectric substrate in which the steps of forming the FBAR and the SAW are concurrently performed.

Abstract: A semiconductor device includes a plurality of driving units configured to drive an output node based on an input signal and be on/off controlled based on driving force control codes, respectively, a slew rate control signal generation block configured to generate a slew rate control signal based on the driving force control codes, and a plurality of signal delay units configured to delay the input signal by respectively different delay amounts, transfer resultant signals to the plurality of driving units, and be respectively controlled in their delay amounts based on the slew rate control signal.

Abstract: A semiconductor memory apparatus includes a resistive memory cell; a data sensing unit configured to sense an output voltage, formed by a sensing current supplied to the resistive memory cell, based on a reference voltage, and output data having a value corresponding to the sensing result; and a reference voltage generation unit comprising a dummy memory cell including first and second resistors having first and second resistance values, respectively, and configured to output a voltage formed by the sensing current supplied to the dummy memory cell as the reference voltage.

Abstract: A counting circuit includes: a clock division unit configured to divide a reference clock signal at a preset division ratio and generate a divided clock signal, a counting unit configured to count the divided clock signal, and a counting control unit configured to enable the counting unit during an enable period corresponding to the division ratio.

Abstract: Disclosed is a balun including a film bulk acoustic resonator (FBAR). The balun may be implemented using the FBAR to fabricate a small sized balun. Also, the balun may be implemented using the FBAR, thereby reducing a difference in two outputs.

Abstract: A semiconductor package and method of manufacture are provided. The semiconductor package may include a package substrate, a semiconductor chip, a molding member and a grounding member. The package substrate may include a ground pad and a signal pad. The semiconductor chip may be arranged on an upper surface of the package substrate. The semiconductor chip may be electrically connected with the signal pad of the package substrate. The molding member may be formed on the upper surface of the package substrate to cover the semiconductor chip. The grounding member may be arranged on a surface of the molding member. The grounding member may be electrically connected with the ground pad.

Abstract: A semiconductor memory apparatus includes a resistive memory cell; a data sensing unit configured to sense an output voltage, formed by a sensing current supplied to the resistive memory cell, based on a reference voltage, and output data having a value corresponding to the sensing result; and a reference voltage generation unit comprising a dummy memory cell including first and second resistors having first and second resistance values, respectively, and configured to output a voltage formed by the sensing current supplied to the dummy memory cell as the reference voltage.

Abstract: A duty ratio correction circuit includes a duty cycle ratio controlling unit configured to generate an internal clock signal having a duty cycle ratio defined according to a first reference clock signal and a reset signal and a reset signal generating unit configured to generate the reset signal in response to a second reference clock signal and the internal clock signal fed back thereto.

Abstract: An electronic apparatus includes a main board, a semiconductor package, an upper conductive EMI shield member, and a lower conductive EMI shield member. The main board includes a first ground pad. The semiconductor package is spaced apart from and electrically connected to the main board. The upper conductive EMI shield member covers a top surface and a sidewall of the semiconductor package. The lower conductive EMI shield member surrounds a space between the main board and the semiconductor package, and is electrically connected to the upper conductive EMI shield member and the first ground pad.

Abstract: A resistive memory apparatus includes a sensing voltage generation unit and a memory cell. The sensing voltage generation unit configured to drive a sensing node to a voltage with a predetermined level in response to a reference voltage and a voltage of the sensing node. The memory cell is connected with the sensing node and configured to change a magnitude of current flowing through the sensing node according to a resistance value thereof.

Abstract: Methods of forming a storage node in a semiconductor device are provided. The method includes forming an interlayer insulation layer on a substrate, forming an etch stop layer and a first sacrificial layer on the interlayer insulation layer, patterning the first sacrificial layer and the etch stop layer to form a first sacrificial layer pattern and an etch stop layer pattern that define a storage node contact hole, forming a recessed first storage node conductive pattern that conformally covers a lower sidewall and a bottom surface of the storage node contact hole, forming a second storage node conductive pattern that includes a first portion surrounded by the recessed first storage node conductive pattern and a second portion conformally covering an upper sidewall of the storage node contact hole, and removing the first sacrificial layer pattern. The recessed first storage node conductive pattern and the second storage node conductive pattern constitute a storage node.

Abstract: Provided is a structure and disposing method of a radio frequency (RF) layered module using three dimensional (3D) vertical wiring. A first wafer in the RF layered module having the 3D vertical wiring may include a first RF device and at least one first via-hole. A second wafer may include a second RF device and at least one second via-hole disposed at a location corresponding to the at least one first via-hole. A vertical wiring may connect the at least one first via-hole and the at least one second via-hole. The vertical wiring may be configured to be connected to an external device through a bottom surface of the at least one first via-hole or a top surface of the at least one second via-hole.

Abstract: This disclosure relates to a film for a tire inner liner including a base film layer including a copolymer or a mixture of 50 wt % to 95 wt % of a polyamide-based resin and 5 wt % to 50 wt % of a polyether-based resin, and an adhesive layer including a resorcinol-formalin-latex (RFL)-based adhesive formed on at least one side of the base film layer, wherein a difference between a maximum thickness and an average thickness of the base film layer and a difference between a minimum thickness and the average thickness of the base film layer are respectively 6% or less of the base film, and a method for manufacturing the same. According to the present invention, an excellent gas barrier property may be achieved with a thin thickness, and thus the weight of a tire may become light and the mileage of automobiles may be improved, and as the inner liner film may have a uniform thickness, excellent forming stability and a tire having excellent durability may be provided.

Abstract: An opening and closing device of an air vent for a vehicle is provided for raising or lowering the air vent so as to open or close a ventilating part. The opening and closing device includes first and second link parts rotatably provided at both sides of the ventilating part, a hydraulic cylinder part having one side fixed to the air vent and the other side connected to the first link part, a piston rod part having one side connected to the second link part and the other side slidably coupled to the hydraulic cylinder part, and an adjusting part fixing the piston rod part to not slide into the hydraulic cylinder part or release the piston rod part to be slidable.