Patents by Inventor In-sang Song

In-sang Song has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Resistive memory device and method for driving the same
    Patent number: 9019746
    Abstract: A resistive memory device includes a plurality of memory cells, each of which is configured to store a normal data, a first reference data corresponding to a first resistance state and a second reference data corresponding to a second resistance state, a data copy unit configured to temporarily store the normal data read from a selected memory cell and generate a copied cell current based on the stored normal data, a mirroring block configured to temporarily store the first and second reference data read from the selected memory cell, and to generate a first reference current and a second reference current based on the stored first and second reference data, respectively, and a sensing unit configured to sense the stored normal data based on the copied cell current and the first reference current and the second reference current.
    Type: Grant
    Filed: March 16, 2013
    Date of Patent: April 28, 2015
    Assignee: SK Hynix Inc.
    Inventors: Hyuck-Sang Yim, Taek Sang Song
  • NEGATIVE ACTIVE MATERIAL, NEGATIVE ELECTRODE INCLUDING THE NEGATIVE ACTIVE MATERIAL, AND LITHIUM SECONDARY BATTERY INCLUDING THE NEGATIVE ELECTRODE
    Publication number: 20150111102
    Abstract: A negative active material including graphite; silicon nanowires; and silicon nanoparticles, wherein a silicon nanowire of the silicon nanowires and a silicon nanoparticle of the silicon nanoparticles are each disposed on a particle of the graphite to form a composite with the graphite.
    Type: Application
    Filed: April 8, 2014
    Publication date: April 23, 2015
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Dong-jin HAM, Jeong-kuk SHON, Min-sang SONG, Seung-sik HWANG, Jun-hwan KU, Jae-jun CHANG, Sang-min JI, Jae-man CHOI
  • POSITIVE ELECTRODE ACTIVE MATERIAL, PREPARATION METHOD THEREOF, AND LITHIUM BATTERY INCLUDING THE SAME
    Publication number: 20150111106
    Abstract: A positive electrode active material including: a lithium complex oxide represented by Formula 1; and a carbon coating layer disposed on the lithium complex oxide, wherein, in a C1s XPS spectrum of the positive electrode active material, a peak intensity of a first peak at a binding energy from about 288 eV to about 293 eV is greater than a peak intensity of a second peak at a binding energy from about 283 eV to about 287 eV, and in an O1s X-ray photoelectron spectrum of the positive electrode active material, a peak intensity of a third peak at a binding energy from about 530.5 eV to about 535 eV is greater than a peak intensity of a fourth peak at a binding energy from about 527.5 electron volts to about 530 electron volts, LiaMbM?cM?dOe.
    Type: Application
    Filed: July 1, 2014
    Publication date: April 23, 2015
    Inventors: In-hyuk SON, Min-sang SONG, In-yong SONG, Jae-man CHOI
  • Composite, method of manufacturing the composite, anode active material including the composite, anode including the anode active material, and lithium secondary battery including the anode
    Patent number: 9011713
    Abstract: Provided are a composite including a lithium titanium oxide and a bismuth titanium oxide, a method of manufacturing the composite, an anode active material including the composite, an anode including the anode active material, and a lithium secondary battery having improved cell performance by including the anode.
    Type: Grant
    Filed: March 14, 2012
    Date of Patent: April 21, 2015
    Assignee: Samsung SDI Co., Ltd.
    Inventors: Min-sang Song, Kyu-sung Park, Gue-sung Kim, Young-min Choi
  • Equalizer circuit and receiver circuit including the same
    Patent number: 9013222
    Abstract: An equalizer circuit includes an input terminal, a pull-up driving unit suitable for pull-up driving an output terminal based on a signal of the input terminal, a pull-down driving unit suitable for pull-down driving the output terminal, and a capacitor connected between the input terminal and the output terminal.
    Type: Grant
    Filed: August 19, 2013
    Date of Patent: April 21, 2015
    Assignee: SK Hynix Inc.
    Inventor: Taek-Sang Song
  • SEMICONDUCTOR PACKAGE AND METHOD OF FORMING
    Publication number: 20150102506
    Abstract: The semiconductor package includes: a package substrate comprising a bonding pad; a plurality of semiconductor chips stacked on the package substrate; and a bonding wire configured to electrically connect the semiconductor chips and the bonding pad. For at least one of the plurality of semiconductor chips: the semiconductor chip comprises: a semiconductor device; a first pad electrically connected to the semiconductor device; a conductive pattern; and a second pad electrically connected to the first pad, spaced apart from the conductive pattern, and extending over the conductive pattern; and the bonding wire is connected to the second pad.
    Type: Application
    Filed: October 9, 2014
    Publication date: April 16, 2015
    Inventors: In-sang SONG, In-Ku KANG, Joon-hee LEE, Kyung-man KIM
  • ACOUSTIC FILTER WITH SUPPRESSED NONLINEAR CHARACTERISTICS
    Publication number: 20150097638
    Abstract: An acoustic filter includes a signal input port, a ladder-type filter, a first branch ladder-type filter, a second branch ladder-type filter, and a signal output port. The first branch ladder-type filter and the second branch ladder-type filter are connected in parallel to each other. The signal input port is connected to the ladder-type filter. The ladder-type filter circuit is connected in series to the first branch ladder-type filter and the second branch ladder-type filter. The first branch ladder-type filter circuit and the second branch ladder-type filter are connected to the signal output port.
    Type: Application
    Filed: May 27, 2014
    Publication date: April 9, 2015
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jie Ai YU, Duck Hwan KIM, Ho Soo PARK, In Sang SONG, Jea Shik SHIN
  • Semiconductor device with air gap
    Patent number: 8999837
    Abstract: A method of fabricating a semiconductor device may include forming isolation structures that include openings, over a substrate; forming sacrificial spacers on sidewalls of the openings; forming, on the sacrificial spacers, first conductive patterns that are recessed in the openings; removing the sacrificial spacers, and defining air gaps; forming a liner layer that caps the first conductive patterns and the air gaps; forming second conductive patterns through silicidation of the liner layer; and forming third conductive patterns over the second conductive patterns.
    Type: Grant
    Filed: December 20, 2013
    Date of Patent: April 7, 2015
    Assignee: SK Hynix Inc.
    Inventors: Jong-Kook Park, Han-Sang Song, Jin-Yul Lee, Chang-Ki Lee
  • Apparatus and method for sensing temperature
    Patent number: 8987666
    Abstract: A temperature sensing apparatus and method are described to detect a change in a frequency due to a change in a temperature. An infrared light sensing apparatus and method are also provided. The temperature sensing apparatus may include an electrode to generate an electrical signal, a piezoelectric layer to convert the electrical signal into an acoustic wave, and a temperature sensitive layer formed by doping impurities in one or more structures formed on a substrate. Additionally, the infrared light sensing apparatus may convert into heat infrared light incident to an infrared light absorption layer, using an infrared light reflection layer and the infrared light absorption layer. A temperature sensitive layer may detect a change in a resonant frequency based on a change in a temperature of the heat, and may detect a change in infrared light based on the change in the resonant frequency.
    Type: Grant
    Filed: September 14, 2012
    Date of Patent: March 24, 2015
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Ho Soo Park, In Sang Song, Duck Hwan Kim, Chul Soo Kim, Sang Uk Son, Jea Shik Shin, Cui Jing
  • SEMICONDUCTOR DEVICE WITH AIR GAP
    Publication number: 20150056801
    Abstract: A method of fabricating a semiconductor device may include forming isolation structures that include openings, over a substrate; forming sacrificial spacers on sidewalks of the openings; forming, on the sacrificial spacers, first conductive patterns that are recessed in the openings; removing the sacrificial spacers, and defining air gaps; forming a liner layer that caps the first conductive patterns and the air gaps; forming second conductive patterns through silicidation of the liner layer; and forming third conductive patterns over the second conductive patterns.
    Type: Application
    Filed: December 20, 2013
    Publication date: February 26, 2015
    Applicant: SK hynix Inc.
    Inventors: Jong-Kook PARK, Han-Sang SONG, Jin-Yul LEE, Chang-Ki LEE
  • Dual input, dual output BAWR filtering apparatus including a ladder-bridge-ladder configuration
    Patent number: 8963654
    Abstract: A Dual Input, Dual Output filtering apparatus using a Bulk Acoustic Wave Resonators (BAWR), and a resonator used as the BAWR may be provided. A Dual Input, Dual Output filtering apparatus may include a plurality of BAWRs connected in series and parallel.
    Type: Grant
    Filed: July 16, 2010
    Date of Patent: February 24, 2015
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Yun Kwon Park, In Sang Song, Duck Hwan Kim, Chul Soo Kim, Jea Shik Shin
  • COUNTING CIRCUIT, DELAY VALUE QUANTIZATION CIRCUIT, AND LATENCY CONTROL CIRCUIT
    Publication number: 20150043702
    Abstract: A counting circuit includes: a clock division unit configured to divide a reference clock signal at a preset division ratio and generate a divided clock signal, a counting unit configured to count the divided clock signal, and a counting control unit configured to enable the counting unit during an enable period corresponding to the division ratio.
    Type: Application
    Filed: September 23, 2014
    Publication date: February 12, 2015
    Inventors: Dae-Han KWON, Yong-Ju KIM, Jae-Il KIM, Taek-Sang SONG
  • Flap door for vehicle
    Patent number: 8943749
    Abstract: A flap door includes a door body configured to be rotated around a longitudinal axis of a shaft by extension of a gas lift. A guide cam is fixed to a sidewall and has the shaft rotatably mounted to a center of the guide cam in a direction perpendicular to the sidewall, and a guide groove is formed in a side of the guide cam. A first arm has one end fixed to the shaft and another end extended toward the gas lift. A second arm has one end connected to the shaft so as to be rotatable around the shaft and another end connected to an end of the gas lift. A rotation transferring member transfers a rotational force from the second arm to the first arm as the rotation transferring member moves along a slot formed in the second arm and simultaneously moves along the guide groove according to rotation of the second arm.
    Type: Grant
    Filed: March 19, 2013
    Date of Patent: February 3, 2015
    Assignee: Hyundai Motor Company
    Inventor: Ja Sang Song
  • Method for fabricating capacitor
    Patent number: 8946047
    Abstract: A method for fabricating a capacitor includes: forming a storage node contact plug over a substrate; forming an insulation layer having an opening exposing a surface of the storage node contact plug over the storage contact plug; forming a conductive layer for a storage node over the insulation layer and the exposed surface of the storage node contact plug through two steps performed at different temperatures; performing an isolation process to isolate parts of the conductive layer; and sequentially forming a dielectric layer and a plate electrode over the isolated conductive layer.
    Type: Grant
    Filed: June 4, 2010
    Date of Patent: February 3, 2015
    Assignee: SK Hynix Inc.
    Inventors: Jin-Hyock Kim, Seung-Jin Yeom, Ki-Seon Park, Han-Sang Song, Deok-Sin Kil, Jae-Sung Roh
  • Memory device and fabricating method thereof
    Patent number: 8937370
    Abstract: The present disclosure provides a memory device and a fabricating method thereof. The memory device includes a substrate including a first metal layer formed therein, the first metal layer having at least a first surface with at least a first exposed portion of the first surface exposed at a lateral surface of the substrate, at least a first semiconductor chip formed on a top surface of the substrate, and a second metal layer surrounding the first semiconductor chip and extending to lateral surfaces of the substrate, at least a first portion of the second metal layer contacting the exposed surface of the first metal layer.
    Type: Grant
    Filed: March 26, 2012
    Date of Patent: January 20, 2015
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: In-Sang Song, Sang-Sub Song
  • Semiconductor packaging for a memory device and a fabricating method thereof
    Patent number: 8928129
    Abstract: A semiconductor device includes a substrate, a semiconductor chip, a first molding member and a metal layer. The substrate includes a first ground pad formed therein, the first ground pad having a first exposed surface exposed at a first surface of the substrate. The semiconductor chip is formed on the first surface of the substrate. The first molding member is formed on the first surface of the substrate and covers the semiconductor chip while not covering the first exposed surface. The metal layer covers the first molding member and extends to lateral surfaces of the substrate while contacting the first exposed surface.
    Type: Grant
    Filed: July 16, 2012
    Date of Patent: January 6, 2015
    Assignee: Samsung Electronics Co., Ltd.
    Inventor: In-Sang Song
  • Buffer control circuit and integrated circuit including the same
    Patent number: 8922251
    Abstract: A buffer control circuit includes a current supply unit configured to supply current and adjust the current in response to codes, an amplifying buffer configured to operate using the current and output a value obtained by comparing a reference potential and the reference potential, a second buffer configured to buffer an output of the first buffer, and a code generation unit configured to generate the codes in response to an output of the second buffer.
    Type: Grant
    Filed: December 21, 2011
    Date of Patent: December 30, 2014
    Assignee: Hynix Semiconductor Inc.
    Inventors: Taek-Sang Song, Dae-Han Kwon
  • SHRINKABLE FILM AND METHOD FOR MANUFACTURING SAME
    Publication number: 20140377547
    Abstract: Provided are a film for food packaging, capable of having excellent adhesion with a metal deposition layer and thus retaining moisture barrier property while having superior flexibility, transparency, and biodegradability, and a method for manufacturing the same.
    Type: Application
    Filed: September 10, 2014
    Publication date: December 25, 2014
    Applicant: KOLON INDUSTRIES, INC.
    Inventors: Dong Jin KIM, Si Min KIM, Yun Jo KIM, Gi Sang SONG
  • System for transmitting/receiving multi-band radio frequency signal using dual input, dual output filter
    Patent number: 8918063
    Abstract: A system for transmitting/receiving a multi-band Radio Frequency (RF) signal using a Dual Input, Dual Output filter is provided. The system may include a Single-Input Single-Output (SISO) filter and the Dual Input, Dual Output filter. The system for transmitting/receiving a multi-band Radio Frequency (RF) may be implemented in a Radio Frequency (RF) region, which includes an area from an end of an antenna to an end of a mixer in a mobile communication.
    Type: Grant
    Filed: July 16, 2010
    Date of Patent: December 23, 2014
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: In Sang Song, Duck Hwan Kim, Chul Soo Kim, Yun Kwon Park, Jea Shik Shin
  • FLIP-FLOP CIRCUIT AND DUTY RATIO CORRECTION CIRCUIT USING THE SAME
    Publication number: 20140368248
    Abstract: A flip-flop circuit includes a first unit configured to receive a reference clock signal and a reset signal, and a second unit configured to change an output node to a first level in response to the reference clock signal and change the output node to a second level by precharging the output node in response to a signal output from the first unit according to the reset signal.
    Type: Application
    Filed: August 28, 2014
    Publication date: December 18, 2014
    Inventors: Dae-Kun YOON, Taek-Sang SONG