Abstract: A semiconductor package substrate, in which a base substrate having an upper surface and a lower surface and formed of a conductive material is filled with resin formed of an insulating material, includes a die pad formed of the conductive material on the upper surface and a lead arranged on the upper surface by being electrically separated from the die pad and comprising a bonding pad that is a wire bonding area. A protrusion protruding toward the lower surface is formed in a central area of the bonding pad. A central thickness of the bonding pad is greater than a peripheral thickness of the bonding pad.

Abstract: A method of manufacturing a semiconductor package substrate includes forming a trench in one surface of a base substrate formed of a conductive material, performing a first filling operation of filling the trench with resin, performing a first curing operation of semi-curing the resin filled in the first filling operation, performing a second filling operation of additionally filling resin on a semi-cured resin, performing a second curing operation of fully curing the resin, removing the resin exposed from the trench, and etching an opposite surface of the base substrate to expose at least part of the resin filling the trench.

Abstract: Provided are a semiconductor package substrate and a manufacturing method thereof having improved pattern accuracy and product reliability with simple manufacturing processes. The semiconductor package substrate includes a base substrate having a conductive material, and including a first area, on which chips are mounted, including first recesses or first trenches in a surface, and a second area contacting the first area and including dummy recesses or dummy trenches in a surface; and a resin filled in the first recesses or the first trenches and the dummy recesses or the dummy trenches.

Abstract: A semiconductor package substrate, in which a base substrate having an upper surface and a lower surface and formed of a conductive material is filled with resin formed of an insulating material, includes a die pad formed of the conductive material on the upper surface and a lead arranged on the upper surface by being electrically separated from the die pad and comprising a bonding pad that is a wire bonding area. A protrusion protruding toward the lower surface is formed in a central area of the bonding pad. A central thickness of the bonding pad is greater than a peripheral thickness of the bonding pad.

Abstract: A computing system is provided. The computing system includes a host device and a plurality of interface devices. The plurality of interface devices is configured to communicate with the host device through a host bus. Each of the plurality of interface devices is configured to perform an interfacing operation between the host device and a memory device. The interfacing operation includes a serial interfacing operation and a parallel interfacing operation.

Abstract: Provided are a method of manufacturing a semiconductor package substrate, a semiconductor package substrate manufactured using the method of manufacturing a semiconductor package substrate, a method of manufacturing a semiconductor package, and a semiconductor package manufactured using the method of manufacturing a semiconductor package. The method of manufacturing a semiconductor package substrate includes forming first grooves or first trenches in a bottom surface of a base substrate having a top surface and the bottom surface and formed of a conductive material; filling the first grooves or trenches with resin; curing the resin; removing exposed portions of the resin overfilled in the first grooves or trenches; etching the top surface of the base substrate to expose at least portions of the resin filled in the first grooves or trenches; and forming a second groove or a second trench in the bottom surface of the base substrate.

Abstract: Provided are a semiconductor package substrate and a manufacturing method thereof having improved pattern accuracy and product reliability with simple manufacturing processes. The semiconductor package substrate includes a base substrate having a conductive material, and including a first area, on which chips are mounted, including first recesses or first trenches in a surface, and a second area contacting the first area and including dummy recesses or dummy trenches in a surface; and a resin filled in the first recesses or the first trenches and the dummy recesses or the dummy trenches.

Abstract: A method of manufacturing a semiconductor package substrate includes forming a trench and a post by etching an upper surface of a base substrate including a conductive material, filling the trench with a resin, removing the resin exposed to outside of the trench such that an upper surface of the post and an upper surface of the resin are at same level, forming a conductive layer on an entire area of the upper surface of the post and the upper surface of the resin, and forming a circuit wiring including an upper circuit wiring and a lower circuit wiring by simultaneously patterning the conductive layer and a lower surface of the base substrate.

Abstract: A semiconductor package substrate, in which a base substrate having an upper surface and a lower surface and formed of a conductive material is filled with resin formed of an insulating material, includes a die pad formed of the conductive material on the upper surface and a lead arranged on the upper surface by being electrically separated from the die pad and comprising a bonding pad that is a wire bonding area. A protrusion protruding toward the lower surface is formed in a central area of the bonding pad. A central thickness of the bonding pad is greater than a peripheral thickness of the bonding pad.

Abstract: An image signal processing system includes a first processor and a memory. The memory is coupled to the first processor through a first memory interface and a second memory interface. The memory includes a first memory area and a second memory area. The first memory area stores image data outputted from the first processor through the first memory interface during an image processing operation of the first processor. The second memory area stores image data outputted from the first processor through the second memory interface.

Abstract: A computing system may be provided. The computing system may include a host device and a plurality of interface devices. The plurality of interface devices may be configured to communicate with the host device through a host bus. Each of the plurality of interface devices may be configured to perform an interfacing operation between the host device and a memory device. The interfacing operation may include a serial interfacing operation and a parallel interfacing operation.

Abstract: The present invention provides Thermococcus onnurineus MC02 strain (accession no. KCTC12511BP) having increased hydrogen production ability, wherein the expression of rchA gene of the strain increases. Also, the present invention provides a method for producing the strain belonged to the genus Thermococcus having increased hydrogen production ability comprising, increasing the expression of rchA gene of the strain, and hydrogen production method using the strain.

Abstract: A shell having a cylindrical body, a pair of tube sheets installed to divide the inside of the shell and provided with a plurality tube insertion holes formed therethrough so as to face each other, and a plurality of tubes respectively welded to the tube insertion holes facing each other to connect the tube sheets, and further including a plurality of tube joint members having the same diameter as that of the tubes and respectively inserted into the tube insertion holes of the tube sheets, and a plurality of ring wires manufactured by cutting a welding wire having a long length into pieces having a designated length and bending the pieces into a ring shape and inserted into the outer circumferences of both ends of the tubes, wherein ring-shaped tube sheet grooves spaced from the tube insertion holes by a designated distance in the outer circumferential surface are formed on each of facing surfaces of the tube sheets so as to form joint parts, both ends of the tubes are inserted into the tube insertion holes o

Abstract: A method of manufacturing a semiconductor package substrate has a simplified process and an upper and lower pattern alignment problem is solved. A semiconductor package substrate is manufactured by the method. The method of manufacturing a semiconductor package substrate includes forming a first groove in one surface of a base substrate of a conductive material, filling the first groove with resin, and etching another surface of the base substrate to expose the resin filling the first groove.

Abstract: There is provided a lead frame including a plurality of plating layers formed on both an upper surface and a lower surface of a base material including a metal, wherein an upper outermost plating layer of an upper part of the lead frame is a silver plating layer including silver, and a lower outermost plating layer of a lower part of the lead frame is a gold plating layer including gold.

Abstract: A method of manufacturing a semiconductor package substrate has a simplified process and an upper and lower pattern alignment problem is solved. A semiconductor package substrate is manufactured by the method. The method of manufacturing a semiconductor package substrate includes forming a first groove in one surface of a base substrate of a conductive material, filling the first groove with resin, and etching another surface of the base substrate to expose the resin filling the first groove.

Abstract: The present invention relates to an excreta detecting sensor for detecting excrement/urine from people who are unable to control their own urination, such as elderly individuals, disabled individuals, patients and infants, and relates to an excreta detecting apparatus which automatically notifies a carer of the urination. The excreta detecting sensor according to the present invention includes a conductive fiber having elasticity and absorbent polymer having the characteristic of expanding upon absorbing moisture such as moisture absorbent used in diaper. The excreta detecting apparatus according to the present invention wirelessly notifies the user of the excreta detection information resulting from the defecation or the urination from diaper in which the excreta detecting sensor is mounted.

Abstract: The present invention provides Thermococcus onnurineus MC02 strain (accession no. KCTC12511BP) having increased hydrogen production ability, wherein the expression of rchA gene of the strain increases. Also, the present invention provides a method for producing the strain belonged to the genus Thermococcus having increased hydrogen production ability comprising, increasing the expression of rchA gene of the strain, and hydrogen production method using the strain.

Abstract: There is provided a lead frame including a plurality of plating layers formed on both an upper surface and a lower surface of a base material including a metal, wherein an upper outermost plating layer of an upper part of the lead frame is a silver plating layer including silver, and a lower outermost plating layer of a lower part of the lead frame is a gold plating layer including gold.

Abstract: The present invention relates to a hyperthermophilic DNA polymerase and a preparation method thereof. The invention provides a novel hyperthermophilic DNA polymerase isolated from a Thermococcus sp. strain, a functional equivalent thereof, a protein having the amino acid sequence thereof, and a preparation method thereof. The DNA polymerase according to the invention is a DNA polymerase, which is hyperthermophilic and has an elongation ability and fidelity higher than those of prior commercial DNA polymerases. Thus, the DNA polymerase according to the invention will be useful in precision analysis, precision diagnosis, identification and the like, which require accurate PCR.