Abstract: The disclosure provides an array substrate of a thin film transistor including an oxide semiconductor pattern, and a display device using the same. The thin film transistor array substrate includes a substrate including an active area and a non-active area disposed around the active area, and a first thin film transistor disposed on the substrate. The first thin film transistor includes a first oxide semiconductor pattern disposed on the substrate, a first gate electrode disposed under the first oxide semiconductor pattern while overlapping with the first oxide semiconductor pattern, a first source electrode and a first drain electrode disposed on the first oxide semiconductor pattern and connected to the first oxide semiconductor pattern, and a first light shielding pattern disposed over the first oxide semiconductor pattern and electrically connected to one of the first source electrode and the first drain electrode while overlapping with the first oxide semiconductor pattern.

Abstract: A display apparatus is provided. The display apparatus may include a light-emitting device and a pixel driving circuit electrically connected to the light-emitting device. The pixel driving circuit may supply a driving current corresponding to a data signal to the light-emitting device according to a gate signal. For example, the pixel driving circuit may include at least one thin film transistor. The thin film transistor may include an active pattern comprising an oxide semiconductor. A source region of the active pattern overlaps a source semiconductor pattern, and a drain region of the active pattern overlaps a drain semiconductor pattern. The source semiconductor pattern and the drain semiconductor pattern may include n-type impurities. A channel region of the active pattern may be outside the source semiconductor pattern and the drain semiconductor pattern. Thus, in the display apparatus, reliability of the pixel driving circuit may be improved.

Abstract: In an embodiment an apparatus includes a processor configured to generate a feature extraction module using a dataset in which an attribute for each object is defined, receive an image obtained by a camera, extract an attribute of an object of interest from the image using the learned feature extraction module, identify an object re-identification candidate group based on the extracted attribute of the object of interest and re-identify the object of interest based on the identified object re-identification candidate group.

Abstract: An electrostatic discharge (ESD) protection device includes a pad, a diode, a gate ground NMOS (GGNMOS) transistor and a thyristor. The diode includes an anode connected with the pad. The GGNMOS transistor is connected between a cathode of the diode and a ground terminal. The thyristor is formed between the diode and the ground terminal when an ESD current may flow from the pad.

Abstract: The present invention relates to a conductive concentrated resin composition including (a) 100 parts by weight of a base resin including 50 to 95% by weight of a polyamide resin, 2.5 to 20% by weight of a polar polymer, and 2.5 to 30% by weight of a non-polar polymer, (b) 10 to parts by weight of a carbon nanofibril, (c) 0.5 to 5 parts by weight of a carbon nanoplate, and (d) 0.5 to 4 parts by weight of nanoclay; a conductive polyamide resin composition including the conductive concentrated resin composition; a method of preparing the conductive concentrated resin composition; and a molded article including the conductive polyamide resin composition.

Abstract: A flexible display device is provided. A flexible display device according to one embodiment of the present invention comprises a body, a moving plate, a first pulley, a second pulley, a driving track and a flexible display. The flexible display is coupled to outer surfaces of the moving plate and the driving track, and the driving track forms a continuous track shape by itself or together with the moving plate. Therefore, provided is the flexible display device in which a constant tension can be maintained over the entire section of the driving track while the moving plate and the driving track support the flexible display, the occurrence of spring back in the flexible display can be minimized, and damage caused by unevenness of the flexible display, and the like, can be prevented.

Abstract: The present disclosure relates to an electrode stack for a lithium secondary battery, in which one or more positive electrodes and one or more negative electrodes are alternatingly stacked with a separator therebetween and insulation layers are formed on the outermost positive electrodes of the electrode stack. The insulation layers have an average thickness of 1 ?m to 8 ?m. The positive electrodes include a positive electrode collector; a positive electrode active material layer; and a protective layer including an inorganic compound. The protective layer is disposed between the positive electrode collector and the positive electrode active material layer. Additionally, an electrode assembly and a lithium secondary battery which include the electrode stack are also disclosed.

Abstract: A semiconductor device includes an active pattern on a substrate, the active pattern extending in a first direction, a gate electrode on the active pattern, the gate electrode extending in a second direction intersecting the first direction and including a first portion and a second portion arranged along the second direction, a first contact plug on the gate electrode, the first contact plug being connected to a top surface of the second portion of the gate electrode, a source/drain region in the active pattern on a sidewall of the gate electrode, and a source/drain contact on the source/drain region, a height of a top surface of the source/drain contact being higher than a top surface of the first portion of the gate electrode and lower than the top surface of the second portion of the gate electrode.

Abstract: An embodiment battery module includes a plurality of battery cells provided as a pouch type, a plurality of cartridges, each of the cartridges holding the battery cells that are adjacent to each other and form a pair, a sensing block coupled to a lateral side of the plurality of cartridges to bind the plurality of cartridges to each other, the sensing block including a first connector configured to electrically connect the plurality of battery cells and a second connector configured to measure voltage of the plurality of battery cells, and a lateral cover coupled to an outward side of the sensing block to bind the sensing block and the plurality of cartridges to each other, the lateral cover including a first opening that exposes the first connector to an outside and a second opening that exposes the second connector to the outside.

Abstract: A battery storage device for an electric vehicle includes a reinforcing panel that reduces impact energy and is disposed between a case and a battery module, whereby, when a car collision occurs, the battery module is protected from impact by the reinforcing panel, damage to the battery module is reduced, stability of the vehicle is secured, and manufacturing costs are reduced.

Abstract: A processor-implemented method includes: obtaining a plurality of image frames acquired for a scene within a predetermined time; determining loss values respectively corresponding to the plurality of image frames; determining a reference frame among the plurality of image frames based on the loss values; and generating a final image of the scene based on the reference frame.

Abstract: A wafer processing apparatus includes a rotating chuck rotatably installed on a driver, a vacuum chuck which is disposed on the rotating chuck and on which a wafer is seated, a chuck module installed in the rotating chuck to fix the wafer to the vacuum chuck, and a moving module configured to move the vacuum chuck or the chuck module to increase a gap between adjacent dies of the wafer.

Abstract: A fingerprint sensor package includes a first substrate having a core insulating layer with a first surface and a second surface, and a through-hole passing through the first surface and the second surface, a first bonding pad disposed on the second surface of the core insulating layer, and an external connection pad, a second substrate disposed in the through-hole of the core insulating layer and including a plurality of first sensing patterns, a plurality of second sensing patterns, and a second bonding pad, a conductive wire connecting the first bonding pad and the second bonding pad to each other, a controller chip disposed on the second substrate, and a molding layer disposed on the second surface of the core insulating layer, filling the through-hole, covering the second substrate and the first bonding pad, and spaced apart from the external connection pad.

Abstract: The present specification relates to a heterocyclic compound represented by Chemical Formula 1, and an organic light emitting device comprising the same.

Abstract: A wafer processing apparatus includes a rotating chuck rotatably installed on a driver, a vacuum chuck which is disposed on the rotating chuck and on which a wafer is seated, a chuck module installed in the rotating chuck to fix the wafer to the vacuum chuck, and a moving module configured to move the vacuum chuck or the chuck module to increase a gap between adjacent dies of the wafer.

Abstract: A semiconductor package includes an upper substrate having a first surface and a second surface which are opposite to each other, a semiconductor chip on the first surface of the upper substrate, a buffer layer on the second surface of the upper substrate, a mold layer between the second surface of the upper substrate and the buffer layer, a plurality of through-electrodes penetrating the upper substrate and the mold layer, an interconnection layer between the first surface of the upper substrate and the semiconductor chip and configured to electrically connect the semiconductor chip to the plurality of through-electrodes, and a plurality of bumps disposed on the buffer layer, spaced apart from the mold layer, and electrically connected to the plurality of through-electrodes. The mold layer includes an insulating material of which a coefficient of thermal expansion is greater than that of the upper substrate.

Abstract: Systems, methods, computer program products, and apparatuses to determine, by a neural network based on training data related to wireless signals exchanged by a device and a plurality of wireless access points in an environment, a respective distance between the device and each wireless access point, receive location data related to a respective location of each wireless access point of the plurality of wireless access points, determine a geometric cost of the neural network based on a geometric cost function, the respective distances, and the received location data, and train a plurality of values of the neural network based on a backpropagation and the determined geometric cost.

Abstract: A semiconductor package comprising a main semiconductor chip having a first thickness, at least one semiconductor device on one side of the main semiconductor chip and having a second thickness less than the first thickness, a first molding layer that covers the main semiconductor chip and the semiconductor device so as to expose a top surface of the semiconductor device and to expose a top surface and a portion of a lateral surface of the main semiconductor chip, a first redistribution substrate below the first molding layer, a second redistribution substrate on the first molding layer, and a mold via that penetrates the first molding layer and connects the first redistribution substrate to the second redistribution substrate.

Abstract: A current interrupt device, which may be included in a battery module, includes first and second connection parts each having one surface on which an inclined surface is formed; wherein the inclined surface of the first connection part and the inclined surface of the second connection part contact each other to form a contact interface, the first connection part and the second connection part are electrically connected to each other, and when an external force equal to or greater than a predetermined force is applied to the inclined surface of the first connection part or the inclined surface of the second connection part, the inclined surface of the first connection part and the inclined surface of the second connection part are dislocated with respect to each other on the contact interface to interrupt electrical connection between the first connection part and the second connection part.