Abstract: A pouch roll replacement system comprises a transport part, a replacement chucking part, an unwinder chucking part, a measuring part, and a control part. The transport part transports a replacement pouch roll and is capable of adjusting the central axis height of the replacement pouch roll The replacement chucking part is provided to chuck the replacement pouch roll transported through the transport part and has a predetermined chucking height The unwinder chucking part accommodates a traveling pouch roll and the measuring part measures the distance to the replacement pouch roll seated on the transport part before transporting the replacement pouch roll to the replacement chucking part. The control part controls the transport part so that the central axis height of the replacement pouch roll seated on the transport part is adjusted based on the measurement information of the measuring part and the chucking height of the replacement chucking part.

Abstract: There is provided a semiconductor device with improved product reliability. The semiconductor device includes a substrate, a structure on the substrate and including multilayer metal patterns and multilayer insulating layers, and a pad layer on the structure and including a plurality of bonding pads, wherein a plurality of uppermost patterns at an uppermost layer among the multilayer metal patterns include electrode patterns for transferring signals and alleviation patterns that do not transfer the signals, a first ratio of the alleviation patterns within a first reference shape at a first distance from an edge of the structure is greater than a second ratio of the alleviation patterns within a second reference shape at a second distance from the edge of the structure, and the first distance is greater than the second distance.

Abstract: An electronic device including a base layer including a first area and a second area, a first group of pixels in the first area and a second group of pixels in the second area, wherein each pixel from among the first group of pixels and the second group of pixels includes a pixel circuit and a light emitting element connected to the pixel circuit, and each of the data lines being connected to the pixel circuits arranged along a first direction, wherein the first area includes circuit areas and transmissive areas arranged alternately along the first direction, wherein the pixel circuits in the first group of pixels are arranged in the circuit areas, wherein the data lines include first patterns at least partially overlapping the transmissive areas and second patterns overlapping the circuit areas, wherein the first patterns and the second patterns include different materials.

Abstract: A lead supply system according to an embodiment of the present invention may supply the lead so as to be connected to an electrode tab. The lead supply system may include: a seating part on which the lead is seated; a vision sensor that photographs the lead at an upper side of the seating part; an alignment mechanism that adjusts the seating part so as to align the lead on the basis of vision data photographed by the vision sensor; and a supply device that picks up the lead from the seating part so as to supply the lead to a position at which the lead is connected to the electrode tab.

Abstract: A display device includes a plurality of first pixels disposed in a first pixel area and initialized by a voltage of a first initialization power source, a plurality of second pixels disposed in a second pixel area and initialized by a voltage of a second initialization power source different from the first initialization power source, a data driver that supplies a data signal to a plurality of data lines connected to the first pixels and the second pixels, and a scan driver that supplies a scan signal to a plurality of scan lines connected to the first pixels and the second pixels. A black data signal supplied from the data driver to the first pixels and a black data signal supplied from the data driver to the second pixels are set to the same voltage.

Abstract: A semiconductor package includes a substrate, a first semiconductor chip on the substrate, a second semiconductor chip on the first semiconductor chip so that the first semiconductor chip is vertically between the second semiconductor chip and the substrate, a first molding layer adjacent to a sidewall of the first semiconductor chip on the substrate, the first molding layer formed of a first molding material, and a second molding layer adjacent to a sidewall of the second semiconductor chip on the substrate so that the first molding layer is vertically between the second molding layer and the substrate. The second molding layer is formed of a second molding material different from the first molding material.

Abstract: A semiconductor package includes a substrate, a first semiconductor chip on the substrate, a second semiconductor chip on the first semiconductor chip so that the first semiconductor chip is vertically between the second semiconductor chip and the substrate, a first molding layer adjacent to a sidewall of the first semiconductor chip on the substrate, the first molding layer formed of a first molding material, and a second molding layer adjacent to a sidewall of the second semiconductor chip on the substrate so that the first molding layer is vertically between the second molding layer and the substrate. The second molding layer is formed of a second molding material different from the first molding material.

Abstract: A semiconductor package includes a first redistribution layer, a first semiconductor chip, and a second semiconductor chip. The first redistribution layer includes a first intervening interconnection layer and a first upper interconnection layer. The first intervening interconnection layer includes a first intervening insulating layer, a first intervening redistribution pattern, and a stress buffer pattern, which is spaced apart from the first intervening redistribution pattern and is in an electrically floated state. The first upper interconnection layer includes a first upper insulating layer, a first upper redistribution pattern, and a first test pad on the first upper redistribution pattern. An area of the stress buffer pattern is larger than an area of the first test pad.

Abstract: Disclosed herein a hydraulic supply apparatus includes a motor coupled to a modulator block including flow paths and valves for adjusting brake hydraulic pressure therein, the motor having a stator and a rotor; a sleeve coupled to the rotor to rotate together, and including an accommodating space inside and a first screw thread provided on an inner circumferential surface thereof; a screw shaft provided in the accommodating space, and including a second screw thread meshing with the first screw thread on an outer circumferential surface thereof to convert a rotational motion of the sleeve into a linear motion; and a piston connected to an end of the screw shaft; wherein a central axis of the piston is arranged eccentrically with respect to a central axis of the screw shaft.

Abstract: Disclosed are interconnection structures, semiconductor packages including the same, and methods of fabricating the same.

Abstract: A hybrid air mobility vehicle can make a long-distance flight through an efficient operation of an engine and a battery, and can reduce discomfort by reducing noise according to flight surroundings. The hybrid air mobility vehicle includes: an engine and a generator; a battery and a drive motor electrically connected to the generator; a first propeller connected to the drive motor and a second propeller connected to the generator through a clutch; and a controller that controls driving of the engine, the clutch, and the drive motor, based on a flight factor including at least one of a flight mode, a required power, a battery charging amount, or a surrounding flight environment of the hybrid air mobility vehicle.

Abstract: Disclosed herein a hydraulic pressure supply apparatus of an electronic brake system includes a motor coupled to a modulator block having a flow path and a valve for adjusting braking hydraulic pressure therein, the motor having a stator and a rotor disposed to be spaced apart from an inner circumferential surface of the stator; a first gear configured to receive a rotational force from the rotor and rotating together with the rotor; a second gear provided with a piston on one side thereof and concentrically connected with the first gear in a ball screw manner to convert a rotational motion of the first gear into a linear motion; and an anti-rotation unit configured to prevent the second gear from rotating together with the first gear.

Abstract: A semiconductor package including a first device layer including first semiconductor devices, a first cover insulating layer, and first through-electrodes passing through at least a portion of the first device layer, a second device layer second semiconductor devices, a second cover insulating layer, and second through-electrodes passing through at least a portion of the second device layer, the second semiconductor devices vertically overlapping the first semiconductor devices, respectively, the second cover insulating layer in contact with the first cover insulating layer a third device layer including an upper semiconductor chip, the upper semiconductor chip vertically overlapping both at least two of first semiconductor devices and at least two of the second semiconductor devices, and device bonded pads passing through the first and second cover insulating layers, the device bonded pads electrically connecting the first and second through-electrodes to the upper semiconductor chip may be provided.

Abstract: A method for measuring blood sugar that is performed by an apparatus for measuring blood is provided. The method includes calculating color data from multiple skin regions of interest in a skin image, classifying a user's meal state into a pre-meal state or a post-meal state through analysis of acquired user information, estimating blood sugar by applying the calculated color data to a blood sugar regression linear equation corresponding to the classified user's meal state, and measuring robust blood sugar by weighted averaging the estimated blood sugar.

Abstract: Disclosed are an easily manufacturable stator for an axial flux motor, and a method of manufacturing the same. A stator includes a core, a bobbin having a hollow portion into which the core is inserted, and a winding wound around the bobbin. A radial outer corner portion of the core is formed to have a cross-sectional shape bent at least twice.

Abstract: An air-cooled battery cooling system for an air mobility vehicle may ensure the cooling performance for batteries using air flows during the flight of the air mobility vehicle, since the cooling of the batteries is performed using an air flow in the top-bottom direction due to the hovering of the air mobility vehicle and an air flow in the front and rear direction due to the cruising of the air mobility vehicle, the efficient cooling performance for the batteries is ensured in a variety of flight modes. Furthermore, the batteries are securely fixed while being cooled by air flows via the heat transfer pads within the battery packs.

Abstract: In an air mobility vehicle, an engine operates as required to provide mechanical driving force or electric energy. A battery is charged with the electric energy from the engine. Main rotors operate using the electric energy of the battery and electric power generated by the engine to perform takeoff, landing, and cruising. Auxiliary rotors are disposed at or adjacent to the center of gravity of a vehicle body and mechanically connected to the engine via a clutch. The auxiliary rotors perform the takeoff, the landing, or the cruising by receiving the mechanical driving force from the engine when the clutch is in an engaged position. A controller monitors the states of the battery and the main rotors and controls the operations of the engine and the clutch.

Abstract: In an air mobility vehicle, an engine operates as required to provide mechanical driving force or electric energy. A battery is charged with the electric energy from the engine. Main rotors operate using the electric energy of the battery and electric power generated by the engine to perform takeoff, landing, and cruising. Auxiliary rotors are disposed at or adjacent to the center of gravity of a vehicle body and mechanically connected to the engine via a clutch. The auxiliary rotors perform the takeoff, the landing, or the cruising by receiving the mechanical driving force from the engine when the clutch is in an engaged position. A controller monitors the states of the battery and the main rotors and controls the operations of the engine and the clutch.

Abstract: A semiconductor package includes a base structure having a base pad, a first semiconductor chip on the base structure, and having a first connection pad bonded to the base pad, a first bonding structure including an base insulation layer of a base structure and a first lower insulation layer of the first semiconductor chip bonded to the base insulation layer, a second semiconductor chip on the first semiconductor chip, and having a second connection pad connected to the first through-electrode, and a second bonding structure including a first upper insulation layer of the first semiconductor chip, and a second lower insulation layer of the second semiconductor chip bonded to the first upper insulation layer, and the first upper insulation layer has a dummy insulation portion extending onto the base structure around the first semiconductor chip.

Abstract: A semiconductor package includes a base including a first bonding structure; and a first semiconductor chip, including a second bonding structure, the second bonding structure being coupled to the first bonding structure of the base, wherein the first bonding structure includes: a test pad; a first pad being electrically connected to the test pad; and a first insulating layer, wherein the second bonding structure includes: a second pad being electrically connected to the first pad; and a second insulating layer being in contact with the first insulating layer, and wherein at least a portion of the test pad is in contact with the second insulating layer.