Patents by Inventor In Seok Hong

In Seok Hong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10715739
    Abstract: An electronic device and a method of operating the electronic device are provided. The electronic device includes an imaging device configured to obtain an image of a subject, a light source including light-emitting elements configured to emit light in different directions, and a controller configured to determine a position of the subject and a distance to the subject in the image, and control a luminance of the light-emitting elements based on the position of the subject and the distance to the subject.
    Type: Grant
    Filed: October 24, 2018
    Date of Patent: July 14, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jae-yeol Ryu, Jong-chul Choi, Ivan Panchenko, Mikhail Popov, Jae-hyoung Park, Hyun-seok Hong, Jong-tae Kim, Jin-sung Kim, Ju-hee Kim
  • Publication number: 20200201561
    Abstract: A method of controlling a first memory controller that controls a non-volatile memory device includes: the first memory controller receiving first data and a first physical address from a second memory controller via a first interface of the first memory controller; the first memory controller storing the first data in a non-volatile memory buffer of the first memory controller; and the first memory controller programming the first data stored in the non-volatile memory buffer in a first physical region of the non-volatile memory device corresponding to the first physical address.
    Type: Application
    Filed: August 19, 2019
    Publication date: June 25, 2020
    Inventors: KUI-YON MUN, SUNG-KYU PARK, BEOM-KYU SHIN, YOUNG-SEOK HONG, JAE-YONG JEONG
  • Publication number: 20200185029
    Abstract: A semiconductor system may be provided. The semiconductor system may include a phase changeable memory device. The phase changeable memory device may include a phase changeable memory cell array, the phase changeable memory cell array may include a plurality of word lines, a plurality of bit lines overlapped with the word lines and phase changeable memory cells respectively connected to overlapping points between the word lines and the bit lines, and the phase changeable memory cell may include a phase changeable material. The semiconductor system may include a controller. The controller may be configured to provide the phase changeable memory device with a command and an address for controlling the phase changeable memory device.
    Type: Application
    Filed: February 13, 2020
    Publication date: June 11, 2020
    Applicant: SK hynix Inc.
    Inventor: Yun Seok HONG
  • Publication number: 20200175714
    Abstract: A method of recognizing an object, and a device therefor are provided. The method includes obtaining first sensing data from a first sensor that senses the object, obtaining second sensing data from a second sensor that senses the object, obtaining a first object recognition reliability for the object and a second object recognition reliability for the object respectively based on the first sensing data and the second sensing data, based on the first object recognition reliability and the second object recognition reliability, matching object information of the object recognized using the second sensing data to the first sensing data, and storing the matched object information in a database of one of the first sensor and the second sensor.
    Type: Application
    Filed: February 6, 2020
    Publication date: June 4, 2020
    Inventors: Hyun-seok HONG, Sahng-gyu PARK, Bo-seok MOON, Hae-in CHUN
  • Publication number: 20200135636
    Abstract: A semiconductor package is provided. The semiconductor package includes a lower structure including an upper insulating layer and an upper pad; and a semiconductor chip provided on the lower structure and comprising a lower insulating layer and a lower pad. The lower insulating layer is in contact with and coupled to the upper insulating layer and the lower pad is in contact with and coupled to the upper pad, and a lateral side of the semiconductor chip extends between an upper side and a lower side of the semiconductor chip and comprises a recessed portion.
    Type: Application
    Filed: June 25, 2019
    Publication date: April 30, 2020
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hyuek Jae LEE, Ji Hoon KIM, Tae Hun KIM, Ji Seok HONG, Ji Hwan HWANG
  • Publication number: 20200135594
    Abstract: A semiconductor package includes a base including a first bonding structure; and a first semiconductor chip, including a second bonding structure, the second bonding structure being coupled to the first bonding structure of the base, wherein the first bonding structure includes: a test pad; a first pad being electrically connected to the test pad; and a first insulating layer, wherein the second bonding structure includes: a second pad being electrically connected to the first pad; and a second insulating layer being in contact with the first insulating layer, and wherein at least a portion of the test pad is in contact with the second insulating layer.
    Type: Application
    Filed: July 11, 2019
    Publication date: April 30, 2020
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hyuek Jae LEE, Tae Hun KIM, Ji Hwan HWANG, Ji Hoon KIM, Ji Seok HONG
  • Publication number: 20200135699
    Abstract: A semiconductor package includes a base structure having a base pad, a first semiconductor chip on the base structure, and having a first connection pad bonded to the base pad, a first bonding structure including an base insulation layer of a base structure and a first lower insulation layer of the first semiconductor chip bonded to the base insulation layer, a second semiconductor chip on the first semiconductor chip, and having a second connection pad connected to the first through-electrode, and a second bonding structure including a first upper insulation layer of the first semiconductor chip, and a second lower insulation layer of the second semiconductor chip bonded to the first upper insulation layer, and the first upper insulation layer has a dummy insulation portion extending onto the base structure around the first semiconductor chip.
    Type: Application
    Filed: October 1, 2019
    Publication date: April 30, 2020
    Inventors: Ji Hwan HWANG, Ji Hoon KIM, Ji Seok HONG, Tae Hun KIM, Hyuek Jae LEE
  • Publication number: 20200135698
    Abstract: A die stack structure may include a base die having base contact pads insulated by a base protection patterns and a flat side surface, a die stack bonded to the base die and having a plurality of component dies on the base die such that each of the component dies includes component contact pads insulated by a corresponding component protection pattern, and a residual mold unevenly arranged on a side surface of the die stack such that the component dies are attached to each other by the residual mold.
    Type: Application
    Filed: August 6, 2019
    Publication date: April 30, 2020
    Inventors: Ji-Seok HONG, Ji-Hoon KIM, Tae-Hun KIM, Hyuek-Jae LEE, Ji-Hwan HWANG
  • Publication number: 20200117924
    Abstract: An electronic apparatus and a control method thereof are provided. The control method includes: receiving video data; acquiring a plurality of feature information representing an object from the received video data using a plurality of filters; detecting the object included in the video data using feature information, among the plurality of feature information, acquired by at least two of the plurality of filters; and providing information on the detected object. As a result, the electronic apparatus can accurately detect surrounding vehicles and pedestrians even under a general road condition, dark road conditions (such as at night time and bad weather), or the like.
    Type: Application
    Filed: December 11, 2019
    Publication date: April 16, 2020
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Tae-gyu LIM, Yeong-rok LEE, Hyun-seok HONG, Seung-hoon HAN, Bo-seok MOON
  • Publication number: 20200111763
    Abstract: A semiconductor package includes: a lower semiconductor chip including a first semiconductor substrate, which includes a first semiconductor device on an active surface thereof and a protrusion defined by a recess region on an inactive surface thereof opposite to the active surface, a plurality of external connecting pads on a bottom surface of the first semiconductor substrate, and a plurality of through-electrodes electrically connected to the plurality of external connecting pads; and at least one upper semiconductor chip stacked on the protrusion of the lower semiconductor chip and electrically connected to the plurality of through-electrodes, the at least one upper semiconductor chip including a second semiconductor substrate which includes a second semiconductor device on an active surface thereof.
    Type: Application
    Filed: June 19, 2019
    Publication date: April 9, 2020
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Ji-seok HONG, Ji-hoon KIM
  • Patent number: 10607563
    Abstract: A display device includes a timing controller, a driver, and a display panel. The timing controller outputs a first clock signal having first rising time during an active section and a second clock signal having second rising time during a blank section adjacent to the active section. The driver generates a data signal based on the first clock signal and the second clock signal and to output the data signal. The display panel displays an image based on the data signal. The first rising time is shorter than the second rising time.
    Type: Grant
    Filed: February 14, 2017
    Date of Patent: March 31, 2020
    Assignee: Samsung Display Co., Ltd.
    Inventors: Dong In Kim, Jin Kyu Park, Yo Han Lee, Ki Hoon Choi, Hyun Seok Hong
  • Patent number: 10605354
    Abstract: A button-type transmission control device includes: a button portion which includes a first area and a second area different from the first area; a hinge disposed under the button portion; and a substrate which is disposed under the hinge. The substrate includes a first terminal placed under the first area and a second terminal placed under the second area. When pressure is applied to the first area, the button portion is inclined such that the first area descends with respect to the hinge, so that the first area contacts the first terminal, and a gear shift position corresponding to the first terminal is selected. When pressure is applied to the second area, the button portion is inclined such that the second area descends with respect to the hinge, so that the second area contacts the second terminal, and a gear shift position corresponding to the second terminal is selected.
    Type: Grant
    Filed: June 26, 2018
    Date of Patent: March 31, 2020
    Assignee: KYUNG CHANG INDUSTRIAL CO., Ltd.
    Inventors: Dong Won Kim, Hyeong Seok Hong, Min Sik Choo
  • Patent number: 10607666
    Abstract: A data transfer device may include: a global input/output (GIO) driver configured for driving input data and outputting the driven data to a first GIO line, and configured for using a second supply voltage lower than a first supply voltage as a source voltage to drive the input data; and a repeater configured for amplifying data applied to the first GIO line, outputting the amplified data to a second GIO line, and shifting the data applied to the first GIO line to a level of the first supply voltage. The repeater may drive the data applied to the first GIO line to a first node, drive an output of the first node to the second GIO line, and reset the first node to the level of the first supply voltage based on a reset signal before a read operation.
    Type: Grant
    Filed: September 5, 2018
    Date of Patent: March 31, 2020
    Assignee: SK hynix Inc.
    Inventor: Yun Seok Hong
  • Patent number: 10607697
    Abstract: A semiconductor system may be provided. The semiconductor system may include a phase changeable memory device. The phase changeable memory device may include a phase changeable memory cell array, the phase changeable memory cell array may include a plurality of word lines, a plurality of bit lines overlapped with the word lines and phase changeable memory cells respectively connected to overlapping points between the word lines and the bit lines, and the phase changeable memory cell may include a phase changeable material. The semiconductor system may include a controller. The controller may be configured to provide the phase changeable memory device with a command and an address for controlling the phase changeable memory device.
    Type: Grant
    Filed: April 28, 2017
    Date of Patent: March 31, 2020
    Assignee: SK hynix Inc.
    Inventor: Yun Seok Hong
  • Patent number: 10600197
    Abstract: A method of recognizing an object, and a device therefor are provided. The method includes obtaining first sensing data from a first sensor that senses the object, obtaining second sensing data from a second sensor that senses the object, obtaining a first object recognition reliability for the object and a second object recognition reliability for the object respectively based on the first sensing data and the second sensing data, based on the first object recognition reliability and the second object recognition reliability, matching object information of the object recognized using the second sensing data to the first sensing data, and storing the matched object information in a database of one of the first sensor and the second sensor.
    Type: Grant
    Filed: December 13, 2017
    Date of Patent: March 24, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hyun-seok Hong, Sahng-gyu Park, Bo-seok Moon, Hae-in Chun
  • Publication number: 20200075544
    Abstract: A semiconductor package including a first device layer including first semiconductor devices, a first cover insulating layer, and first through-electrodes passing through at least a portion of the first device layer, a second device layer second semiconductor devices, a second cover insulating layer, and second through-electrodes passing through at least a portion of the second device layer, the second semiconductor devices vertically overlapping the first semiconductor devices, respectively, the second cover insulating layer in contact with the first cover insulating layer a third device layer including an upper semiconductor chip, the upper semiconductor chip vertically overlapping both at least two of first semiconductor devices and at least two of the second semiconductor devices, and device bonded pads passing through the first and second cover insulating layers, the device bonded pads electrically connecting the first and second through-electrodes to the upper semiconductor chip may be provided.
    Type: Application
    Filed: March 27, 2019
    Publication date: March 5, 2020
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Ji-seok HONG, Jin-woo PARK
  • Patent number: 10576021
    Abstract: A system for medicine management includes: a terminal including an input unit for receiving the input of the types and quantities of medicines, a communication unit for transmitting the inputted information on the types and quantities of medicines to an electronic balance smart safe, a display unit for displaying the information on the types and quantities of medicines, and a control unit for controlling the overall operation; an electronic balance smart safe comprising a plurality of sensor units for sensing the weight of a medicine case, a communication unit for receiving the information on the types and quantities of medicines and transmitting to a server, a display unit for displaying the information on the types and quantities of the medicine cases, a control unit for controlling the opening and closing of the door; and a server for managing the electronic balance smart safe.
    Type: Grant
    Filed: November 9, 2018
    Date of Patent: March 3, 2020
    Assignee: IDEASTUDIO CO., LTD.
    Inventors: Yong Seok Hong, Woong Suk Park, Seok Je Kim
  • Publication number: 20200064148
    Abstract: A vehicle driving assistance device includes: a sensing unit configured to capture a front image of a running vehicle; a processor configured to detect a lane by using the front image and estimate the lane by detecting objects around a road, on which the vehicle is running, by using the sensing unit; and an output unit configured to output the estimated lane.
    Type: Application
    Filed: January 19, 2018
    Publication date: February 27, 2020
    Inventors: Sahng-gyu PARK, Hyun-seok HONG, Myung-sik KIM
  • Patent number: 10558870
    Abstract: An electronic apparatus and a control method thereof are provided. The control method includes: receiving video data; acquiring a plurality of feature information representing an object from the received video data using a plurality of filters; detecting the object included in the video data using feature information, among the plurality of feature information, acquired by at least two of the plurality of filters; and providing information on the detected object. As a result, the electronic apparatus can accurately detect surrounding vehicles and pedestrians even under a general road condition, dark road conditions (such as at night time and bad weather), or the like.
    Type: Grant
    Filed: November 8, 2017
    Date of Patent: February 11, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Tae-gyu Lim, Yeong-rok Lee, Hyun-seok Hong, Seung-hoon Han, Bo-seok Moon
  • Publication number: 20200012868
    Abstract: A device and method for recognizing an object included in an input image are provided, the device for recognizing the object included in the input image includes a memory in which at least one program is stored; a camera configured to capture an environment around the device; and at least one processor configured to execute the at least one program to recognize an object included in an input image, wherein the at least one program includes instructions to: obtain the input image by controlling the camera; obtain information about the environment around the device that obtains the input image; determine, based on the information about the environment, a standard for using a plurality of feature value sets in a combined way, the plurality of feature value sets being used to recognize the object in the input image; and recognize the object included in the input image, by using the plurality of feature value sets based on the determined standard for using the plurality of feature value sets in the combined way.
    Type: Application
    Filed: January 17, 2018
    Publication date: January 9, 2020
    Inventors: Hyun-seok HONG, Sahng-gyu PARK, Seung-hoon HAN, Bo-seok MOON