Patents by Inventor In Seung CHUNG
In Seung CHUNG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9412642Abstract: A barrier for preventing a bridge between adjacent storage node contacts is formed below a bit line located between the bit line contacts, so that a contact region between each storage node contact and an active region is increased in size. The semiconductor device includes a device isolation film defining an active region, a bit line contact coupling the active region to a bit line, and a barrier formed below the bit line located between the bit line contacts.Type: GrantFiled: April 24, 2015Date of Patent: August 9, 2016Assignee: SK HYNIX INC.Inventor: In Seung Chung
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Publication number: 20160152022Abstract: A resin dispenser for nano-imprinting includes a housing including a lower chamber in which a resin is filled, a slit defined in a lower part of the lower chamber and through which the resin is discharged, and an upper chamber in which a pressure-applying fluid is filled, and a membrane separating the lower and upper chambers from each other, and of which an edge is fixed on a middle part of the housing, where the fluid is configured to apply the pressure to the membrane and protrude the membrane toward the slit of the lower chamber.Type: ApplicationFiled: January 29, 2016Publication date: June 2, 2016Inventors: Bong-su SHIN, Dong-ouk KIM, Joon-young PARK, Sung-hoon LEE, Jae-seung CHUNG, Suk-gyu HAHM, Dae-young LEE, Gug-rae JO
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Publication number: 20160054235Abstract: Provided are a surface inspection apparatus and a surface inspection method. More particularly, disclosed are a surface inspection apparatus and a surface inspection method to allow for inspection of a foreign material on non-uniformly colored diffusive surfaces containing a metal or polymer material or the like.Type: ApplicationFiled: November 24, 2014Publication date: February 25, 2016Inventors: Hyun Woo KIM, Jeong Hwan KO, Eui Seung CHUNG
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Patent number: 9165176Abstract: Provided are a method, apparatus, and computer-readable recording medium for conveniently recognizing a fingerprint. A fingerprint recognition method according to an embodiment of the present invention includes: checking a position-state of a fingerprint sensing unit to set a flag value; collecting a plurality of fingerprint image segments sequentially acquired by the fingerprint sensing unit; and changing a matching order of the fingerprint image segments according to the flag value to perform the fingerprint recognition.Type: GrantFiled: October 29, 2013Date of Patent: October 20, 2015Assignees: Crucialtec Co., Ltd., Crucialsoft CompanyInventors: Kyoung Shik Jung, In Seung Chung
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Publication number: 20150228657Abstract: A barrier for preventing a bridge between adjacent storage node contacts is formed below a bit line located between the bit line contacts, so that a contact region between each storage node contact and an active region is increased in size. The semiconductor device includes a device isolation film defining an active region, a bit line contact coupling the active region to a bit line, and a barrier formed below the bit line located between the bit line contacts.Type: ApplicationFiled: April 24, 2015Publication date: August 13, 2015Inventor: In Seung CHUNG
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Patent number: 9048109Abstract: A barrier for preventing a bridge between adjacent storage node contacts is formed below a bit line located between the bit line contacts, so that a contact region between each storage node contact and an active region is increased in size. The semiconductor device includes a device isolation film defining an active region, a bit line contact coupling the active region to a bit line, and a barrier formed below the bit line located between the bit line contacts.Type: GrantFiled: December 18, 2012Date of Patent: June 2, 2015Assignee: SK HYNIX INC.Inventor: In Seung Chung
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Publication number: 20150108688Abstract: A resin dispenser for nano-imprinting includes a housing including a lower chamber in which a resin is filled, a slit defined in a lower part of the lower chamber and through which the resin is discharged, and an upper chamber in which a pressure-applying fluid is filled, and a membrane separating the lower and upper chambers from each other, and of which an edge is fixed on a middle part of the housing, where the fluid is configured to apply the pressure to the membrane and protrude the membrane toward the slit of the lower chamber.Type: ApplicationFiled: June 18, 2014Publication date: April 23, 2015Inventors: Bong-su SHIN, Dong-ouk KIM, Joon-young PARK, Sung-hoon LEE, Jae-seung CHUNG, Suk-gyu HAHM, Dae-young LEE, Gug-rae JO
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Patent number: 8894477Abstract: A display device including a case having a transparent window that forms one side of a first air flow path, a display unit including a display surface that faces the transparent window to form the other side of the first air flow path, a ventilator to supply air to the first air flow path, and a diffuser disposed at an exit of the first air flow path and having a cross-sectional area that is gradually increased.Type: GrantFiled: November 30, 2010Date of Patent: November 25, 2014Assignees: Samsung Electronics Co., Ltd., Hongik Industry-Academia Cooperation FoundationInventors: Yong-soo Lee, Min-soo Kim, Seung-won Shin, Ha-seung Chung, Moon-chul Lee
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Patent number: 8828697Abstract: A method of producing lycopene, with high productivity by means of a recombinant bacterial strain includes preparing the recombinant vector containing genes encoding proteins, which are required for lycopene biosynthesis. The genes involved in lycopene biosynthesis are crtE with the nucleotide SEQ ID NO: 8, crtB with the nucleotide SEQ ID NO: 3 and crtI with the nucleotide SEQ ID NO: 5 of the Sequence List. The said recombinant vector is transformed into Escherichia coli (hereafter E. coli). The E. coli transformant is cultured to recover lycopene from the culture medium.Type: GrantFiled: June 28, 2012Date of Patent: September 9, 2014Assignee: AmicogenInventors: Nahm Ryune Cho, Min Soo Park, Dong Hyun Lee, Ho Seung Chung, Jong Keun Kim
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Publication number: 20140119620Abstract: Provided are a method, apparatus, and computer-readable recording medium for conveniently recognizing a fingerprint. A fingerprint recognition method according to an embodiment of the present invention includes: checking a position-state of a fingerprint sensing unit to set a flag value; collecting a plurality of fingerprint image segments sequentially acquired by the fingerprint sensing unit; and changing a matching order of the fingerprint image segments according to the flag value to perform the fingerprint recognition.Type: ApplicationFiled: October 29, 2013Publication date: May 1, 2014Applicants: CRUCIALSOFT COMPANY, CRUCIALTEC CO., LTD.Inventors: Kyoung Shik JUNG, In Seung CHUNG
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Patent number: 8655142Abstract: A method for displaying a record in an initial driving state of a record displaying apparatus is disclosed. The method includes searching execution/non-execution file descriptors of recorded multimedia files, and extracting record files not played back, and outputting a record file alarming message when a record file not played back is extracted. The record displaying apparatus is also disclosed. Execution/non-execution file descriptors of record files are searched upon system initialization of a broadcast receiver. When there is a new record or a record not played back, a record file alarming message is output in a state of being overlaid on a broadcast signal received. Accordingly, the user can access the record file list simultaneously with viewing a broadcast, without using any additional means.Type: GrantFiled: April 16, 2007Date of Patent: February 18, 2014Assignee: LG Electronics Inc.Inventors: Joon Yong Hong, Han Seung Chung
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Publication number: 20130256785Abstract: A barrier for preventing a bridge between adjacent storage node contacts is formed below a bit line located between the bit line contacts, so that a contact region between each storage node contact and an active region is increased in size. The semiconductor device includes a device isolation film defining an active region, a bit line contact coupling the active region to a bit line, and a barrier formed below the bit line located between the bit line contacts.Type: ApplicationFiled: December 18, 2012Publication date: October 3, 2013Applicant: SK HYNIX INC.Inventor: In Seung CHUNG
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Patent number: 8466008Abstract: A stacked semiconductor package technique applicable to semiconductor chips having pins short enough that the semiconductor chips cannot be directly bonded together is provided. A printed circuit board (PCB) is inserted into a space between pins of an upper semiconductor chip and the exterior of bodies of stacked semiconductor chips. The PCB includes a plurality of conductive patterns at locations corresponding to the respective pins. The respective conductive patterns and the corresponding respective pins of the upper and lower semiconductor chips are bonded together. The PCB includes a plurality of recess patterns on one side, the recess patterns having the same pitch as the pins of the semiconductor chips. The PCB is disposed across the pins of the lower semiconductor chip, and thereby easily arranged with the stacked semiconductor chips.Type: GrantFiled: August 9, 2012Date of Patent: June 18, 2013Assignee: Polystak, Inc.Inventor: Tae Seung Chung
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Publication number: 20120322201Abstract: A stacked semiconductor package technique applicable to semiconductor chips having pins short enough that the semiconductor chips cannot be directly bonded together is provided. A printed circuit board (PCB) is inserted into a space between pins of an upper semiconductor chip and the exterior of bodies of stacked semiconductor chips. The PCB includes a plurality of conductive patterns at locations corresponding to the respective pins. The respective conductive patterns and the corresponding respective pins of the upper and lower semiconductor chips are bonded together. The PCB includes a plurality of recess patterns on one side, the recess patterns having the same pitch as the pins of the semiconductor chips. The PCB is disposed across the pins of the lower semiconductor chip, and thereby easily arranged with the stacked semiconductor chips.Type: ApplicationFiled: August 9, 2012Publication date: December 20, 2012Inventor: Tae Seung CHUNG
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Publication number: 20120295322Abstract: A method of producing lycopene, with high productivity by means of a recombinant bacterial strain includes preparing the recombinant vector containing genes encoding proteins, which are required for lycopene biosynthesis. The genes involved in lycopene biosynthesis are crtE, crtB and crtI, and at least one of the said three genes (crtE, crtB and crtI) is selected from the group consisting of crtE with the SEQ ID NO:1, crtB with the SEQ ID NO:3 and crtI with the SEQ ID NO:5, of the Sequence List. The said recombinant vector is transformed into Escherichia coli (hereafter E. coli). The E. coli transformant is cultured to recover lycopene from the culture medium.Type: ApplicationFiled: June 28, 2012Publication date: November 22, 2012Applicant: AMICOGEN CO., LTD.Inventors: Nahm Ryune Cho, Min Soo Park, Dong Hyun Lee, Ho Seung Chung, Jong Keun Kim
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Patent number: 8310041Abstract: A stacked semiconductor package technique applicable to semiconductor chips having pins short enough that the semiconductor chips cannot be directly bonded together is provided. A printed circuit board (PCB) is inserted into a space between pins of an upper semiconductor chip and the exterior of bodies of stacked semiconductor chips. The PCB includes a plurality of conductive patterns at locations corresponding to the respective pins. The respective conductive patterns and the corresponding respective pins of the upper and lower semiconductor chips are bonded together. The PCB includes a plurality of recess patterns on one side, the recess patterns having the same pitch as the pins of the semiconductor chips. The PCB is disposed across the pins of the lower semiconductor chip, and thereby easily arranged with the stacked semiconductor chips.Type: GrantFiled: November 24, 2010Date of Patent: November 13, 2012Assignee: Polystak, Inc.Inventor: Tae Seung Chung
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Patent number: 8232083Abstract: A method of producing lycopene with high productivity by means of a recombinant bacterial strain includes preparing the recombinant vector containing genes encoding proteins, which are required for lycopene biosynthesis. The genes involved in lycopene biosynthesis are crtE, crtB and crtI, and at least one of the said three genes (crtE, crtB and crtI) is selected from the group consisting of crtE with the nucleotide Sequence 1, crtB with the nucleotide Sequence 3 and crtI with the nucleotide Sequence 5, of the Sequence List. The said recombinant vector is transformed into Escherichia coli.Type: GrantFiled: May 6, 2008Date of Patent: July 31, 2012Assignee: Amicogen Co., Ltd.Inventors: Nahm Ryune Cho, Min Soo Park, Dong Hyun Lee, Ho Seung Chung, Jong Keun Kim
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Publication number: 20120038062Abstract: A stacked semiconductor package technique applicable to semiconductor chips having pins short enough that the semiconductor chips cannot be directly bonded together is provided. A printed circuit board (PCB) is inserted into a space between pins of an upper semiconductor chip and the exterior of bodies of stacked semiconductor chips. The PCB includes a plurality of conductive patterns at locations corresponding to the respective pins. The respective conductive patterns and the corresponding respective pins of the upper and lower semiconductor chips are bonded together. The PCB includes a plurality of recess patterns on one side, the recess patterns having the same pitch as the pins of the semiconductor chips. The PCB is disposed across the pins of the lower semiconductor chip, and thereby easily arranged with the stacked semiconductor chips.Type: ApplicationFiled: November 24, 2010Publication date: February 16, 2012Applicant: Polystak, Inc.Inventor: Tae Seung CHUNG
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Patent number: 8042308Abstract: A system for releasably attaching a panel to a wall. The panel is provided with a front surface intended to be visible to an observer once the panel has been installed upon the wall at a rear surface opposite the front surface supporting a plurality of magnets. A corresponding plurality of brackets are attached to the wall and positioned such that when the panel is properly positioned upon the wall, the panel is releasably secured thereto by causing the plurality of magnets to be secured to the plurality of brackets. The panels can abut one another to create a variety of useful surfaces such as pegboard, corkboard, chalkboard, fabric and magnetic bulletin boards. The brackets can be oriented to obscure them from a viewer and can also be reoriented to provide a releasable attachment means for a frame to surround the panels for a more finished, aesthetic appearance.Type: GrantFiled: September 9, 2006Date of Patent: October 25, 2011Assignee: Williams-Sonoma, Inc.Inventors: Scott L. Sullivan, Hee-seung Chung
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Publication number: 20110162831Abstract: A display device including a case having a transparent window that forms one side of a first air flow path, a display unit including a display surface that faces the transparent window to form the other side of the first air flow path, a ventilator to supply air to the first air flow path, and a diffuser disposed at an exit of the first air flow path and having a cross-sectional area that is gradually increased.Type: ApplicationFiled: November 30, 2010Publication date: July 7, 2011Inventors: Yong-soo LEE, Min-soo KIM, Seung-won SHIN, Ha-seung CHUNG, Moon-chul LEE