Patents by Inventor In Shim

In Shim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210163717
    Abstract: The present invention relates to a method of preparing a lead-free radiation shielding sheet with excellent shielding performance not only in a high energy (100 kVp) band but also in a low energy (50 to 80 kVp) band and improved durability of the sheet. bands without containing lead. The radiation shielding sheet of the present invention uses antimony (Sb), which has a high shielding rate even in the low energy band instead of lowering the content of tungsten having a relatively lower shielding rate in the low energy band than in the high energy band, thereby increasing the shielding performance in both high energy (100 kVp) and low energy bands. Further, the radiation shielding sheet of the present invention may increase not only durability, but also elasticity, tearing strength, and tensile strength by mixing additives such as zinc oxide with the rubber.
    Type: Application
    Filed: July 25, 2019
    Publication date: June 3, 2021
    Inventors: Dong Jin AHN, Yeon Ha SHIM
  • Patent number: 11024585
    Abstract: An integrated circuit packaging system and method of manufacture thereof includes: a substrate with internal circuitry between a substrate top side, a substrate bottom side, and vertical sides; an integrated circuit coupled to the internal circuitry; a molded package body formed directly on the integrated circuit and the substrate top side of the substrate; and a conductive conformal shield structure applied directly on the molded package body, the vertical sides, and to extend below the substrate bottom side coupled to the internal circuitry.
    Type: Grant
    Filed: June 11, 2018
    Date of Patent: June 1, 2021
    Assignee: STATS ChipPAC Pte. Ltd.
    Inventors: Byung Joon Han, Il Kwon Shim, KyoungHee Park, Yaojian Lin, KyoWang Koo, In Sang Yoon, SeungYong Chai, SungWon Cho, SungSoo Kim, Hun Teak Lee, DeokKyung Yang
  • Patent number: 11023282
    Abstract: Provided is a cloud control server that controls a plurality of cloud servers, the cloud control server including a communication unit configured to transmit, to a mobile device, information about one or more cloud servers from among the plurality of cloud servers, and to receive, from the mobile device, identification information of a cloud server that is selected by a user of the mobile device and is from among the one or more cloud servers; and a controller configured to migrate a virtual machine of the mobile device to the selected cloud server from a cloud server in which the virtual machine of the mobile device is located and that is from among the plurality of cloud servers, wherein the virtual machine of the mobile device executes an application that is output from the mobile device.
    Type: Grant
    Filed: May 7, 2019
    Date of Patent: June 1, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hyo-taek Shim, Jong-ryool Kim, Hyung-jin Lim
  • Patent number: 11024561
    Abstract: A semiconductor device has a semiconductor package and an interposer disposed over the semiconductor package. The semiconductor package has a first semiconductor die and a modular interconnect unit disposed in a peripheral region around the first semiconductor die. A second semiconductor die is disposed over the interposer opposite the semiconductor package. An interconnect structure is formed between the interposer and the modular interconnect unit. The interconnect structure is a conductive pillar or stud bump. The modular interconnect unit has a core substrate and a plurality of vertical interconnects formed through the core substrate. A build-up interconnect structure is formed over the first semiconductor die and modular interconnect unit. The vertical interconnects of the modular interconnect unit are exposed by laser direct ablation. An underfill is deposited between the interposer and semiconductor package.
    Type: Grant
    Filed: May 28, 2020
    Date of Patent: June 1, 2021
    Assignee: STATS ChipPAC Pte. Ltd.
    Inventors: Il Kwon Shim, Yaojian Lin, Pandi C. Marimuthu, Kang Chen, Yu Gu
  • Patent number: 11025761
    Abstract: Disclosed herein is a mobile terminal capable of indicating the position of a force sensor arranged inside a side case using the shape of a non-conductive mold disposed between conductive members to sense pressure. For the mobile terminal, a user input unit and an antenna may be arranged to overlap each other, and a bump and a recess may be formed using a non-conductive mold that is easy to process. Accordingly, uniformity of appearance may be maintained without forming a bump and a recess on the conductive member.
    Type: Grant
    Filed: March 17, 2020
    Date of Patent: June 1, 2021
    Assignee: LG ELECTRONICS INC.
    Inventors: Hongjo Shim, Sunwon Yoo, Jungwhan Kim, Hyunwoo Kim
  • Patent number: 11025091
    Abstract: A hierarchical power control system associated with a cloud server includes a first microgrid cell, a second microgrid cell, a third microgrid cell, a middleware server, and an integrated control system. The first microgrid cell includes a first energy storage system (ESS) having an uninterruptible power supply (UPS) structure and a first load having a power state managed by the first energy storage system (ESS). The second microgrid cell includes a second load and a second energy storage system (ESS) for managing a power state of the second load. The third microgrid cell includes a third load. The middleware server communicates with the first to third microgrid cells. The integrated control system receives power supply-demand state information of the first to third microgrid cells through the middleware server, and establishes an integrated operation schedule based on the received power supply-demand state information of the first to third microgrid cells.
    Type: Grant
    Filed: March 13, 2020
    Date of Patent: June 1, 2021
    Assignee: LSIS CO., LTD.
    Inventors: Jae-Seong Shim, Myung-Hwan Lee, Yong-Hark Shin
  • Patent number: 11022804
    Abstract: A head-mounted display (HMD) includes a frame configured to be fixated to a head, a light-transmissive display unit fixated to the frame and outputting a VR image in a VR mode and an AR image in an AR mode, a light transmission control layer having changed transmittance, a lens unit having a refractive index changed in the VR mode and the AR mode, and a controller control the light transmission control layer to increase transmittance in the AR mode and decrease transmittance in the VR mode.
    Type: Grant
    Filed: July 20, 2017
    Date of Patent: June 1, 2021
    Assignee: LG ELECTRONICS INC.
    Inventors: Hongjo Shim, Mihyun Park, Hyunok Lee, Youngho Sohn
  • Patent number: 11024638
    Abstract: A three-dimensional semiconductor device includes a first substrate, a second substrate on the first substrate, the second substrate including pattern portions and a plate portion covering the pattern portions, the plate portion having a width greater than a width of each of the pattern portions and being connected to the pattern portions, a lower structure between the first substrate and the second substrate, horizontal conductive patterns on the second substrate, the horizontal conductive patterns being stacked while being spaced apart from each other in a direction perpendicular to an upper surface of the second substrate, and a vertical structure on the second substrate and having a side surface opposing the horizontal conductive patterns.
    Type: Grant
    Filed: May 22, 2019
    Date of Patent: June 1, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sun Il Shim, Kyung Dong Kim, Ju Hak Song, Jee Hoon Han
  • Patent number: 11026065
    Abstract: A server according to an embodiment of the disclosure may include at least one processor and storage, wherein the at least one processor may be configured to receive beacon information including information on at least one website from the electronic device, collect data from a first website of the at least one website based on the beacon information, generate content having a structured document format based on at least a part of the collected data, and transmit the generated content to the electronic device.
    Type: Grant
    Filed: November 22, 2017
    Date of Patent: June 1, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Ji Yeon Kim, Ki Hong Kwon, Kwang Sub Kim, Sang Hyun Park, Jae Min Seo, Tae Jung Shim, Byung Woo Lee, Sei Jin Lee, Chang Ho Lee
  • Publication number: 20210155558
    Abstract: A method of producing a melt infiltrated ceramic matrix composite (CMC) article that includes the steps of: forming a ceramic fiber preform; optionally, rigidizing the ceramic fiber preform with a fiber interphase coating via a Chemical Vapor Infiltration (CVI) process, infiltrating a ceramic slurry into the porous body or preform, conducting one or more secondary operations, and finally, melt infiltrating the preform with molten silicon or a silicon alloy to form the CMC article. The infiltration of a ceramic slurry into a ceramic fiber preform to form a green body is performed along with the use of convection and/or conduction as heat transfer mechanisms, such that the ceramic slurry does not require the incorporation of a pre-gelation material in order for the slurry to remain within the green body during subsequent processing steps.
    Type: Application
    Filed: August 28, 2020
    Publication date: May 27, 2021
    Inventors: Camila S. Bortoluzzi, Sungbo Shim
  • Publication number: 20210153654
    Abstract: Disclosed herein is a smart wall including a frame structure including a mounting cell, an electronic appliance disposed in the mounting cell, a first moving art wall positioned in front of the mounting cell and configured to move in a thickness direction, a second moving art wall positioned in front of the mounting cell and configured to move in a vertical direction, a horizontal driver configured to drive the first moving art wall, and a vertical driver configured to drive the second moving art wall. The smart wall may be equipped with multimedia devices, such as a display device and an audio devices, and household appliances, such as an air cleaner and a humidifier, on a wall, thereby minimizing the exposure of the home appliances.
    Type: Application
    Filed: January 10, 2020
    Publication date: May 27, 2021
    Applicant: LG ELECTRONICS INC.
    Inventors: Yunjoo KIM, Kisang Jung, Jaemyo Shim, Hyunki Kim, Juyoung Choi, Hwasuk Shim
  • Publication number: 20210157366
    Abstract: Provided is an electronic apparatus including a flexible display disposed such that a size of the display exposed on a first surface of the electronic apparatus is changed, and a controller configured to identify a first input that is input to at least one of the first surface and the second surface and control the size of the display exposed on the first surface based on the first input.
    Type: Application
    Filed: January 3, 2020
    Publication date: May 27, 2021
    Applicant: LG ELECTRONICS INC.
    Inventors: Hongjo SHIM, Seounghwan SEOL
  • Publication number: 20210154607
    Abstract: Fibrous filtration media and methods of making and using the same are provided whereby the media includes a wet-laid nonwoven fibrous web having from about 20 wt. % to about 80 wt. %, based on total weight of fibrous web, of bicomponent staple fibers, and from about 10 wt. % to about 50 wt. %, based on total weight of the fibrous web, of fibrillated lyocell staple fibers. The fibrous web exhibits a wet burst strength of greater than 3 bar, for example between about 3 bar to about 6 bar and is especially suitable for use in filtering process fluids (e.g., water) associated with wire electron discharge machining (WEDM).
    Type: Application
    Filed: April 16, 2019
    Publication date: May 27, 2021
    Applicant: Ahlstrom-Munksjö Oyj
    Inventors: Jesse SHIM, Melissa KANG, Jun KIM, Xiling ZENG, Kauter LIU
  • Patent number: 11015164
    Abstract: A cell printing apparatus of the present disclosure comprises a nozzle configured to discharge a heat-sensitive cell printing composition; and a heating unit for transferring heat to the upper side of the heat-sensitive cell printing composition which is discharged from the nozzle to be laminated. A predetermined space is formed between the heating unit and the nozzle so that the heating unit does not contact with the nozzle.
    Type: Grant
    Filed: July 6, 2018
    Date of Patent: May 25, 2021
    Assignees: T&R BIOFAB CO., LTD., KOREA POLYTECHNIC UNIVERSITY INDUSTRY ACADEMIC COOPERATION FOUNDATION
    Inventors: Geunseon Ahn, Jinhyung Shim, Kyunghyun Min, Wonsoo Yun, Songwan Jin
  • Patent number: 11018067
    Abstract: In one example, a semiconductor device can comprise (a) an electronic device comprising a device top side, a device bottom side opposite the device top side, and a device sidewall between the device top side and the device bottom side, (b) a first conductor comprising, a first conductor side section on the device sidewall, a first conductor top section on the device top side and coupled to the first conductor side section, and a first conductor bottom section coupled to the first conductor side section, and (c) a protective material covering the first conductor and the electronic device. A lower surface of the first conductor top section can be higher than the device top side, and an upper surface of the first conductor bottom section can be lower than the device top side. Other examples and related methods are also disclosed herein.
    Type: Grant
    Filed: May 22, 2019
    Date of Patent: May 25, 2021
    Assignee: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
    Inventors: Kyeong Tae Kim, Yi Seul Han, Jae Beom Shim, Tae Yong Lee
  • Patent number: 11019421
    Abstract: An acoustic device that includes a housing, a nozzle portion, a speaker hole, a first microphone hole, a speaker, a first microphone, and a processor configured to output a first signal through the speaker, receive a second signal corresponding to the first signal through the first microphone, output a third signal through the speaker when a magnitude of a first frequency band component of the second signal is greater than a first value, receive a fourth signal corresponding to the third signal through the first microphone, and determine that the protruding end surface of the nozzle portion is blocked and the acoustic device is not worn in a user's ear when a magnitude of a second frequency band component of the fourth signal is greater than a second value.
    Type: Grant
    Filed: April 1, 2020
    Date of Patent: May 25, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jeock Lee, Hwan Shim, Seonmi Kim, Hangil Moon, Kyoungho Bang, Byeongmin Lee, Juhee Chang, Seeyoun Kwon, Hochul Hwang
  • Patent number: 11018699
    Abstract: A method and an apparatus for controlling an interleaving depth are provided. The interleaving depth controlling method includes performing a modulo operation on an interleaving depth selected to be less than or equal to a maximum interleaving depth and a total number of codewords to obtain a number of remaining codewords; and comparing the total number of the codewords to the interleaving depth, when the number of the remaining codewords excludes “0”, to control the interleaving depth.
    Type: Grant
    Filed: May 27, 2020
    Date of Patent: May 25, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Chang Soon Park, Youngsoo Kim, Jaewook Shim, Young Jun Hong, Hyosun Hwang
  • Patent number: 11015163
    Abstract: A cell printing apparatus according to the present disclosure comprises: a nozzle through which a liquid cell substance is discharged; a container in which the liquid cell substance discharged through the nozzle is laminated into a three-dimensional structure; and a supply unit for supplying the liquid heated to a predetermined temperature to the container.
    Type: Grant
    Filed: July 6, 2018
    Date of Patent: May 25, 2021
    Assignees: T&R BIOFAB CO., LTD., KOREA POLYTECHNIC UNIVERSITY INDUSTRY ACADEMIC COOPERATION FOUNDATION
    Inventors: Geunseon Ahn, Jinhyung Shim, Kyunghyun Min, Wonsoo Yun, Songwan Jin
  • Patent number: 11019286
    Abstract: A pixel driving circuit of an image sensor includes a first transistor to transmit an output signal of the photodiode to a floating diffusion node, a second transistor to reset a voltage of the floating diffusion node to a pixel voltage, a third transistor to output charges in the floating diffusion node, a fourth transistor to pre-charge an output node of the third transistor, a fifth transistor to transmit the charges in the floating diffusion node to a first node, a sixth transistor to transmit the pixel voltage to a second node, a seventh transistor to output charges in the second node, an eighth transistor to output an output signal of the seventh transistor to a column line, and a ninth transistor to output an output signal of the third transistor to the column line.
    Type: Grant
    Filed: June 12, 2019
    Date of Patent: May 25, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hee Sung Shim, Kyung Ha Kim, Mi Ra Lee, Woong Joo
  • Patent number: 11013656
    Abstract: A motion assistance apparatus including a proximal support configured to support a proximal part of a user, a first drive link and a second drive link configured to perform translational motions with respect to the proximal support at different velocities, a support link with both ends rotatably connected to the first drive link and the second drive link, respectively, the support link having a variable length, and a distal support connected to the support link, the distal support configured to support a distal part of the user is provided.
    Type: Grant
    Filed: March 23, 2018
    Date of Patent: May 25, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jeonghun Kim, Hyun Do Choi, Se-Gon Roh, Youngbo Shim, Minhyung Lee, Youn Baek Lee, Jongwon Lee