Abstract: A silicon-containing structure including: a silicon composite including a porous silicon secondary particle and a first carbon flake on a surface of the porous silicon secondary particle; a carbonaceous coating layer on the porous silicon composite, the carbonaceous coating layer comprising a first amorphous carbon; and the silicon composite comprises a second amorphous carbon and has a density that is equal to or less than a density of the carbonaceous coating layer, wherein the porous silicon secondary particle includes an aggregate of silicon composite primary particles, each including silicon, a silicon suboxide on a surface of the silicon, and a second carbon flake on a surface of the silicon suboxide.

Abstract: A semiconductor package includes a lower substrate, a connection substrate coupled to the lower substrate, the connection substrate having a lateral portion surrounding a cavity, and a first conductive pattern on a top surface of the lateral portion, a lower semiconductor chip on the lower substrate, the lower semiconductor chip being in the cavity of the connection substrate, and the lower semiconductor chip including a second conductive pattern on a top surface of the lower semiconductor chip, a bonding member connecting the first conductive pattern and the second conductive pattern to each other, and a top package on the first conductive pattern and the second conductive pattern.

Abstract: A display apparatus includes a window member, a display panel and a support member. The window member includes a window flat portion, and a window bent portion which extends bent from the window flat portion. The display panel includes an upper flat portion overlapping with the window flat portion, an upper bent portion extending bent from the upper flat portion to extend along the window bent portion, and a lower bent portion extending from the upper bent portion and bent toward a center of the upper flat portion. The support member disposes the display panel between the window member and the support member and extends along the lower bent portion of the display panel. Each of the upper flat portion and the upper bent portion is a display area of the display panel, and the lower bent portion is a non-display area of the display panel.

Abstract: A walking assistance method may include receiving at least one abnormal gait type selected from a plurality of abnormal gait types, and differently controlling a walking assistance apparatus based on the at least one abnormal gait type.

Abstract: The present disclosure relates to a 5G or pre-5G communication system for supporting a higher data transmission rate than a 4G communication system such as LTE. A method for transmitting and receiving data comprises the steps of: receiving a first synchronization block over a first narrow band; identifying whether an indicator indicating that the first narrow band is not allocated to a terminal is included in the first synchronization block; and performing synchronization in the first narrow band if the indicator indicating that the first narrow band is not allocated to the terminal is not included in the first synchronization block.

Abstract: A plasma etching method and a semiconductor device fabrication method, the plasma etching method including providing a source power having a first single pulse to an electrostatic chuck in order to generate a plasma on a substrate; providing a first bias power having a burst pulse different from the first single pulse to concentrate the plasma on the substrate; and providing a second bias power having a second single pulse the same as the first single pulse to accelerate the plasma toward the substrate.

Abstract: An organic light emitting display panel includes a first sub-pixel, a second sub-pixel, and a third sub-pixel for respectively emitting differently colored lights, each of the sub-pixels including a switching transistor connected to a data line, and having a gate electrode configured to receive a scan signal, a driving transistor connected to the switching transistor, an emission control transistor connected to the driving transistor, and having a gate electrode configured to receive an emission control signal, an emission control line connected to the gate electrode of the emission control transistor, an organic light emitting diode connected the emission control transistor, and coupling capacitor including a first electrode including a portion of the emission control line, and a second electrode including an anode of the organic light emitting diode overlapping the portion of the emission control line, wherein capacitances of a first capacitor including the coupling capacitor of the first sub-pixel and a se

Abstract: A program method of a nonvolatile memory device that performs a plurality of program loops is provided. At least one of the plurality of program loops includes dividing a channel of a selected cell string into a first side channel and a second side channel during a first interval and a second interval, turning off a string selection transistor of the selected cell string by applying a string select line voltage of a first level during the first interval, and boosting a first voltage of the first side channel and a second voltage of the second side channel, and turning on the string selection transistor by applying the string select line voltage of a second level different from the first level during the second interval, and performing a hot carrier injection (HCI) program operation on a selected memory cell corresponding to the first side channel or the second side channel.

Abstract: An image sensor package includes an image sensor chip on a package substrate, a logic chip on the package substrate and perpendicularly overlapping the image sensor chip, and a memory chip on the package substrate and perpendicularly overlapping the image sensor chip and logic chip. The logic chip processes a pixel signal output from the image sensor chip. The memory chip is electrically connected to the image sensor chip through a conductive wire and stores at least one of the pixel signal from the image sensor chip or a pixel signal processed by the logic chip. The memory chip receives the pixel signal output from the image sensor chip through the conductive wire and receives the pixel signal processed by the logic chip through the image sensor chip and the conductive wire.

Abstract: Discussed is a display device, including a semiconductor light emitting device and a substrate having a receiving groove in which the semiconductor light emitting device is accommodated, wherein the semiconductor light emitting device includes a first conductive semiconductor layer, a second conductive semiconductor layer disposed on an upper portion of the first conductive semiconductor layer, a first conductive electrode disposed on the first conductive semiconductor layer and a second conductive electrode disposed on the second conductive semiconductor layer, and spaced apart from the first conductive electrode along a horizontal direction of the semiconductor light emitting device, wherein the first conductive semiconductor layer has a symmetrical shape with respect to at least one direction of the semiconductor light emitting device so that the first conductive electrode and the second conductive electrode are arranged at preset positions when the semiconductor light emitting device is accommodated into

Abstract: A display apparatus includes: a display module in which a folding area foldable with respect to a virtual folding axis on a plane and first and second non-folding areas adjacent to both sides of the folding area are defined and which is configured to display an image; a support plate below the display module; and an adhesion film between the display module and the support plate. The support plate includes a first support plate bonded to the adhesion film on the first non-folding area, and a second support plate bonded to the adhesion film on the second non-folding area. The first support plate includes a plurality of first protrusions protruding toward the second support plate, the second support plate includes a plurality of second protrusions protruding toward the first support plate, and the first and second protrusions are alternately arranged with respect to each other.

Abstract: A display apparatus includes: a display; a communication device configured to communicate with a user terminals; and a processor configured to control the display to display a UI, which includes items corresponding to content to be shared by users, in response to inputs of the users received through the user terminals, and control the display to display, on the UI, reproduction control states of the content to be distinguishable according to the respective users.

Abstract: The present invention relates to an Agathobaculum sp. strain having prophylactic or therapeutic effects on autism spectrum disorders, and use thereof. When the intestinal microorganism Agathobaculum sp. strain of the present invention was orally administered to valproic acid (VPA)-induced autism model mice and BTBR autism model mice, the effects of remarkably improving autism spectrum disorders including repetitive behaviors, hyperactivity, social deficiency and cognitive/memory dysfunction of the mice were observed, as compared with a non-treated control. Accordingly, it may be usefully applied to foods, drugs, or feeds for preventing or treating autism spectrum disorders, and thus is very useful in the relevant industries.

Abstract: A display substrate includes a base substrate and a plurality of insulating layers disposed on a surface of the base substrate. A groove is defined in the insulating layers in a non-display area of the display substrate. An end portion of an alignment layer is disposed in the groove. The groove is capable of controlling a flow of a liquid alignment material to prevent the liquid alignment material from overflowing to an edge of the base substrate. The groove is formed simultaneously in a process of forming contact holes in a display area of the display substrate. Accordingly, a structure corresponding to the end portion of the alignment layer to control the flow of the liquid alignment material is formed without increasing the number of masks.

Abstract: The present invention is a printing device using multiple inks and a printing method using thereof, and more specifically, relates to a three-dimensional printing method of a printed product with a cross-sectional pattern comprising a step of providing different inks into each partitioned spaces and applying the same pressure condition to the inks retained in the ink-receiving part, thereby extruding the inks into a single extruding port to prepare and print an extruded ink product, using the printing device comprising an ink extruding member comprising an ink-receiving part receiving the multiple inks in each partitioned space, and an ink-extruding part equipped with a single passage in which the multiple inks received in the ink-receiving part are passed together.

Abstract: A motion assistance apparatus includes a proximal support configured to support a proximal part of a user, a first drive link and a second drive link configured to perform translational motions with respect to the proximal support at different velocities, a support joint rotatably connected to the second drive link, a support body connecting the first drive link and the support joint, the support body configured to simultaneously perform a translational motion and a rotational motion with respect to the proximal support, a distal support connected to the support body, the distal support configured to support a distal part of the user, and a torque providing device configured to provide a torque to rotate the support joint.

Abstract: The present invention relates to a semiconductor package and a method of manufacturing the same. In a semiconductor package which electrically connects a semiconductor chip and a printed circuit board using a solder ball, the semiconductor package further includes a thermal buffer layer which is positioned on a semiconductor chip, absorbs and disperse heat generated by the semiconductor chip, increases a distance between the semiconductor chip and a printed circuit board to decrease a deviation of a heat conduction process, and has a thickness ranging from 7.5 to 50% of a diameter of a solder ball.

Abstract: A semiconductor manufacturing device includes a plasma chamber, a source power supply, and first and second bias power supplies. The source power supply applies a first source voltage to the plasma chamber at a first time and a second source voltage to the plasma chamber at a second time. The first bias power supply applies a first turn-on voltage to the plasma chamber at the first time and a first turn-off voltage to the plasma chamber at the second time. The second bias power supply applies a second turn-off voltage to the plasma chamber at the first time and a second turn-on voltage to the plasma chamber at the second time. The plasma chamber forms plasmas of different conditions from a gas mixture in the plasma chamber based on the source, turn-on, and turn-off voltages.

Abstract: A powertrain may include an input shaft; a drive pulley and a driven pulley engaged to each other by a belt; a forward/backward switching mechanism provided to selectively switch a direction of power from the input shaft to the drive pulley by a plurality of friction members and transmit the power; a gear train provided to transmit the power of the input shaft to a rotation shaft of the driven pulley without passing through the drive pulley; and another friction member provided to interrupt a power transmission path of the gear train.

Abstract: A semiconductor package includes a first semiconductor chip, a second semiconductor chip attached to an upper surface of the first semiconductor chip, a silicon heat-dissipation body thermally connected to at least one of the first semiconductor chip and the second semiconductor chip, and a molding member configured to surround the first semiconductor chip and the second semiconductor chip and exposing an upper surface of the silicon heat-dissipation body.