Abstract: A three-dimensional semiconductor device includes: a peripheral circuit structure disposed on a lower substrate, and including an internal peripheral pad portion; an upper substrate disposed on the peripheral circuit structure; a stack structure disposed on the upper substrate, and including gate horizontal patterns; a vertical channel structure passing through the stack structure in a first region on the upper substrate; a first vertical support structure passing through the stack structure in a second region on the upper substrate; and an internal peripheral contact structure passing through the stack structure and the upper substrate, and electrically connected to the internal peripheral pad portion, wherein an upper surface of the first vertical support structure is disposed on a different level from an upper surface of the vertical channel structure, and is coplanar with an upper surface of the internal peripheral contact structure.

Abstract: Disclosed is a partial dismantling device of a photovoltaic module capable of classifying and collecting the photovoltaic module for recycling the photovoltaic module which includes: a transfer unit for transferring a photovoltaic module; a grind unit provided with a plurality of grinders in multiple levels, to grind the element layers of a grinding region into particles of collectible forms; and a suction unit provided with a plurality of inhalers respectively corresponding to the plurality of grinders, to classify the particles pulverized by the grind unit and to inhale the same.

Abstract: A three-dimensional semiconductor device includes: a peripheral circuit structure disposed on a lower substrate, and including an internal peripheral pad portion; an upper substrate disposed on the peripheral circuit structure; a stack structure disposed on the upper substrate, and including gate horizontal patterns; a vertical channel structure passing through the stack structure in a first region on the upper substrate; a first vertical support structure passing through the stack structure in a second region on the upper substrate; and an internal peripheral contact structure passing through the stack structure and the upper substrate, and electrically connected to the internal peripheral pad portion, wherein an upper surface of the first vertical support structure is disposed on a different level from an upper surface of the vertical channel structure, and is coplanar with an upper surface of the internal peripheral contact structure.

Abstract: The present invention is applied to the skin care cosmetic field and relates to an antioxidant complex that exhibits excellent antioxidant capacity within cells. An antioxidant complex according to an embodiment of the present invention may comprise flavonoid having an antioxidant efficacy, and a solubilizer solubilizing the flavonoid.

Abstract: A method for fabricating a thin film transistor substrate includes forming a buffer layer including at least one film on a base substrate, planarizing a surface of the buffer layer, and forming a thin film transistor on the buffer layer.

Abstract: A three-dimensional semiconductor device includes: a peripheral circuit structure disposed on a lower substrate, and including an internal peripheral pad portion; an upper substrate disposed on the peripheral circuit structure; a stack structure disposed on the upper substrate, and including gate horizontal patterns; a vertical channel structure passing through the stack structure in a first region on the upper substrate; a first vertical support structure passing through the stack structure in a second region on the upper substrate; and an internal peripheral contact structure passing through the stack structure and the upper substrate, and electrically connected to the internal peripheral pad portion, wherein an upper surface of the first vertical support structure is disposed on a different level from an upper surface of the vertical channel structure, and is coplanar with an upper surface of the internal peripheral contact structure.

Abstract: The present invention provides a light source module for a vehicle comprising: a plate-like heat sink; substrates provided on both sides of the heat sink, respectively; light emitting devices provided on the substrates, respectively; a hole for transmitting light emitted from the light emitting devices; and a pair of bases coupled to the outside of the substrates, wherein the light emitting device includes a first light emitting device and a second light emitting device which are arranged diagonally, and a blocking member is disposed at a lower end of the second light emitting device. As such, it is possible to increase the heat dissipation efficiency by increasing the contact between the heat sink and the substrates.

Abstract: A display device includes a display panel including: a plurality of pixels; and a signal controller which generates, on a frame-by-frame basis, a display signal based on an input image signal and a control signal from an outside. The signal controller includes a memory which stores a preset image signal, a receiver which receives the control signal, a clock signal modulator which generates an internal clock signal having a first frequency during a blank period, which is determined based on the control signal in a frame period, and a data processor which reads the preset image signal from the memory in response to the internal clock signal for an image processing.

Abstract: A solar cell module disassembling device is disclosed. The device of present invention comprises a frame unit, wherein a laminated panel having a first panel and a second panel is mounted on the frame unit, and wherein the first and second panels are stacked and bonded; a guide module, being elongated in a forward and backward direction; a scraper unit, being movably coupled to the guide module, having a blade module, wherein the blade module moves in the forward and backward direction and presses the laminated panel and disassembles the laminated panel; and a transfer unit, being coupled to the scraper unit, delivering a driving force to the scraper unit, transferring the scraper unit.

Abstract: A high tension coil spring structure for a bed mattress includes spring bodies and exposed wiring portions which absorb an external load. Diameter-increasing portions (A) are formed on at least one of upper and/or lower end wiring portions (14, 14?) of body wiring portions (12), and provide spaces in which upper and/or lower exposure start wiring portions (16-5, 16-5?) move upward and downward. Rigid support ends (18) are formed on at least one of the body wiring portions (12) and upper and lower exposed wiring portions (16, 16?), and absorb a compressive load. The diameter-increasing portions and the rigid ends of the coil spring structure fundamentally prevent noise caused by friction between the exposed wiring portions and surrounding wiring portions when the exposed wiring portions are compressed and significantly increase the elasticity of the exposed wiring portions.

Abstract: A three-dimensional semiconductor memory device is provided. The memory device includes a substrate with a cell array region and a connection region adjacent to the cell array region, the connection region including a first pad region and a second pad region; an electrode structure including electrodes stacked on the substrate, the electrode structure including an upper portion forming an upper staircase structure; a first dummy structure laterally spaced apart from the upper portion of the electrode structure and provided on the first pad region; and a second dummy structure laterally spaced apart from the upper portion of the electrode structure and provided on the second pad region. Each of the first dummy structure and the second dummy structure includes a dummy staircase structure, and the first dummy structure is located at higher level than the second dummy structure.

Abstract: A method of performing diagnostic communication with a vehicle using a diagnostic device includes: acquiring a certificate revocation list (CRL) corresponding to a certificate of the diagnostic device from an external device, verifying a validity of the certificate using the acquired CRL, performing authentication with the vehicle when the validity of the certificate is verified, and starting diagnostic communication between the diagnostic device and the vehicle when the authentication is performed.

Abstract: Integrated circuit devices and methods of forming the same are provided. The devices may include a substrate including a cell region and an extension region and conductive layers stacked on the cell region in a vertical direction. The conductive layers may extend onto the extension region and may have a stair-step structure on the extension region. The devices may also include vertical structures on the substrate. Each of the vertical structures may extend in the vertical direction, and the vertical structures may include a first vertical structure on the cell region and a second vertical structure on the extension region. The first vertical structure may extend through the conductive layers and may include a first channel layer, the second vertical structure may be in the stair-step structure and may include a second channel layer, and the second channel layer may be spaced apart from the substrate in the vertical direction.

Abstract: A three-dimensional semiconductor device includes: a peripheral circuit structure disposed on a lower substrate, and including an internal peripheral pad portion; an upper substrate disposed on the peripheral circuit structure; a stack structure disposed on the upper substrate, and including gate horizontal patterns; a vertical channel structure passing through the stack structure in a first region on the upper substrate; a first vertical support structure passing through the stack structure in a second region on the upper substrate; and an internal peripheral contact structure passing through the stack structure and the upper substrate, and electrically connected to the internal peripheral pad portion, wherein an upper surface of the first vertical support structure is disposed on a different level from an upper surface of the vertical channel structure, and is coplanar with an upper surface of the internal peripheral contact structure.

Abstract: The present technology relates to an anti-stripping agent for an asphalt mixture, which includes a refined slowly-cooled slag obtained by processing slag, generated in ironmaking and steelmaking processes, using a specific method, and to a method for preparing the same, an asphalt mixture including the same, and a method for preparing the asphalt mixture. The refined slowly-cooled slag may include 55 to 65 mass % of CaO, 5 to 10 mass % of SiO2, 1 to 5 mass % of Al2O3, and 1 to 5 mass % of MgO.

Abstract: The present disclosure provides a vehicle controller area network (CAN) communication attack detection method and apparatus. The apparatus includes: a learning module, a profiling module, and a detection module. The learning module identifies a CAN identifier (ID) upon receiving a predefined CAN packet and generates learning statistical information expressed as bits with respect to a data field corresponding to the identified CAN ID. The profiling module maintains the learning statistical information received and a precollected attack type, and the detection module extracts a CAN ID and a bit stream of a data field from a real-time input CAN packet. In addition, the detection module configures a neural network by acquiring the learning statistical information from the profiling module, inputs the extracted bit stream to the configured neural network, and determines whether attack is detected, based on an output value of the neural network.

Abstract: A method for fabricating a thin film transistor substrate includes forming a buffer layer including at least one film on a base substrate, planarizing a surface of the buffer layer, and forming a thin film transistor on the buffer layer.

Abstract: The present disclosure relates to a method of managing a controller with reliability and, more particularly, to authentication and data exchange during installation/use/removal of a vehicle controller, a gateway and a tester using an encryption algorithm. A method of authenticating a controller by a gateway in a vehicle includes: transmitting a first message including a first random number to the controller when a first condition is satisfied; receiving, from the controller, a second message including the first random number to which an electronic signature has been attached through a private key of the controller; decrypting the first random number having the electronic signature attached thereto using a public key of the controller; and transmitting, to the controller, a symmetric key encrypted using the public key of the controller when the decryption has been successfully performed.

Abstract: A method of authenticating a controller by a gateway in a vehicle may include transmitting a first symmetric key to the controller; generating a first one-time authentication value (OTAV), encrypting the first OTAV with the first symmetric key and delivering the encrypted first OTAV to the controller; sending a request for authentication using the first OTAV to the controller; and receiving a hash value from the controller in response to the request.

Abstract: A vital signal measuring watch is provided, the vital signal measuring watch including a watch module having a shape of a wrist watch, wherein the watch module includes a device receiving portion at one side of the watch module and a communication port in the device receiving portion; and a vital signal sensor connected to or disconnected from the device receiving portion, connected to the communication port when being connected to the device receiving portion, and configured to transmit biometric data obtained by measuring vital signals to the communication port, wherein the vital signal sensor is configured to generate an interrupt plug-in event to transmit the event to the watch module when being connected to the communication port, and the watch module is configured to count a number of interrupts of the transmitted interrupt plug-in event, automatically recognize a communication protocol supported by the vital signal sensor according to the number of interrupts, and dynamically activate a communication i