Abstract: Provided are a method for preparing a polyetherketoneketone and a polyetherketoneketone prepared thereby, wherein, at the time of a polymerization reaction, nitrogen gas is blown into a liquid reaction medium while stirring, thereby quickly removing hydrochloric acid, which is a by-product generated during the reaction, and preventing aggregation of resin particles, thus suppressing the generation of scales.

Abstract: A hybrid communication device, an operation method thereof, and a communication system including the same are provided. The hybrid communication device includes a contact unit that includes an antenna for receiving a first communication signal and an electrode for receiving a second signal, a switch controller that includes a first switch and a second switch and controls the first switch and the second switch based on a change in capacitance of the electrode, and a signal processing unit that receives at least one of the first communication signal and the second communication signal from the contact unit via the first switch and processes the received signal. The first switch is connected to the contact unit, and the signal processing unit is connected to the first switch.

Abstract: An apparatus for continuous electric dehydration of a positive electrode active material, includes a first electrode; a transfer member on which a positive electrode active material is seated, moves to continuously transfer the positive electrode active material to the drum; and a guide device, which is disposed to surround a part or all of the drum and in which the positive electrode active material comes into close contact between the guide device and an outer circumferential surface of the drum when the transfer member moves between the guide device and the outer circumferential surface of the drum and which includes a second electrode for generating an electric field caused by a potential difference between the first electrode and the second electrode so that a cleaning solution remaining in the positive electrode active material introduced by the transfer member is dehydrated by using electrophoresis due to the electric field.

Abstract: The present disclosure discloses a substrate heat-treating apparatus including a process chamber in which a flat substrate to be heat treated is placed, the process chamber comprising a beam transmitting plate placed below the flat substrate and an infrared transmitting plate placed above the flat substrate; a beam irradiating module for irradiating a VCSEL beam having a single wavelength to a lower surface of the flat substrate through the beam transmitting plate; and an emissivity measuring configured to measure the laser beam reflected from the lower surface or an upper surface the flat substrate, thereby measuring the emissivity of the flat substrate.

Abstract: An apparatus for automatically fastening a chemical coupler to a connector of an automatic clean quick coupler (ACQC) system, includes a main body, a multi-degree of freedom (DOF) robot arm on the main body, a gripper on the multi-DOF robot arm that is configured to grip the chemical coupler, a vision sensor on the multi-DOF robot arm, and a controller connected to the gripper, the multi-DOF robot arm, and the vision sensor. The controller uses information about an environment surrounding the multi-DOF robot arm acquired by the vision sensor, to control an operation of the multi-DOF robot arm and an operation of the gripper.

Abstract: A connection structure of a stator of a drive motor is configured to allow coils to be wound in a plurality of slots provided in a stator core and to connect the coils withdrawn from the slots. The coils are wound in the slots to form first-type structures and second-type structures configured such that withdrawal directions of three-phase (U-, W- and V-phase) withdrawal lines and N-phase withdrawal lines withdrawn from the slots of the first-type structures are opposite to withdrawal directions of three-phase (U-, W- and V-phase) withdrawal lines and N-phase withdrawal lines withdrawn from the slots of the second-type structures. The first-type structures and the second-type structures are disposed symmetrically to each other with respect to a reference line formed to divide the slots in half.

Abstract: A fan-out semiconductor package includes connection pads of a semiconductor chip that are redistributed and electrically connected to connection terminals by an interconnection member. In the fan-out semiconductor package, disposition forms of vias and pads in the interconnection member are designed so that stress may be reduced, such that reliability is improved.

Abstract: A fan-out semiconductor package includes connection pads of a semiconductor chip that are redistributed and electrically connected to connection terminals by an interconnection member. In the fan-out semiconductor package, disposition forms of vias and pads in the interconnection member are designed so that stress may be reduced, such that reliability is improved.

Abstract: A light emitting device including a substrate, a light emitting structure disposed on the substrate and having a first light emitting region, a second light emitting region, and a third light emitting region, and an insulation layer to block unintended electrical connection between the first light emitting region and the second light emitting region, or between the second light emitting region and the third light emitting region, in which each of the first light emitting region, the second light emitting region, and the third light emitting region comprises a first conductivity type semiconductor layer, an active layer, and a second conductivity type semiconductor layer, and a center of the first light emitting region overlaps a center of the second light emitting region and a center of the third light emitting region.

Abstract: A hazardous gas purification device with a built-in purification system is disclosed.

Abstract: A method for providing an augmented reality service using an AR sticker comprises: a step where a mobile terminal requests, from a server, an AR sticker template enabling a user to edit an AR sticker, and the server transmits the AR sticker template; a step where the mobile terminal directly edits the AR sticker image using the AR sticker template and creates AR content corresponding to the AR sticker image; a step where the server receives the AR sticker image and the AR content from the mobile terminal and stores same in an AR database, and creates an AR sticker including the AR sticker image and the AR content; a step where the mobile terminal receives the AR sticker, transmits the AR sticker to a printer, and requests printing of the AR sticker; and a step where the printer prints the AR sticker and conveys the printed AR sticker.

Abstract: A haptic device includes: a housing; a magnetic field generation unit disposed in the housing; an elastic support unit connected to the housing; a vibration unit which is connected to the elastic support unit, and which includes an elastic material in which magnetic particles are dispersed in a matrix; and a control unit for transmitting a signal to the magnetic field generation unit.

Abstract: Provided are a composition for blocking radon and a method for preparing the same, and more particularly, to a composition for blocking radon including ethylene vinyl acetate (EVA); one or more polymer resins selected from the group consisting of polyurethane (PU) and silicone resin; and anionic surfactants, and a method for preparing a composition for blocking radon including irradiating radiation to the composition for blocking radon.

Abstract: Disclosed are substrates having an electronic component, including a frame having a through hole, the electronic component disposed in the through hole, a first wiring portion formed on a surface of the frame and the electronic component, a first layer formed on the first wiring portion, and a second wiring portion formed on the first layer, and the second wiring portion including an antenna layer.

Abstract: A fan-out semiconductor package includes connection pads of a semiconductor chip that are redistributed and electrically connected to connection terminals by an interconnection member. In the fan-out semiconductor package, disposition forms of vias and pads in the interconnection member are designed so that stress may be reduced, such that reliability is improved.

Abstract: A power train for a vehicle may include a differential case; a differential ring gear aligned to be concentric to the differential case, and provided in a relatively rotatable state therebetween; and a connection/disconnection mechanism provided to connect or disconnect the differential ring gear and the differential case in a state where power is transferred thereto.

Abstract: A semiconductor package includes a semiconductor chip; a connection member having a first surface on which the semiconductor chip is disposed and a second surface opposing the first surface, an encapsulant disposed on the first surface of the connection member and encapsulating the semiconductor chip, a passivation layer on the second surface of the connection member; and an UBM layer partially embedded in the passivation layer, wherein the UBM layer includes an UBM via embedded in the passivation layer and connected to the redistribution layer of the connection member and an UBM pad connected to the UBM via and protruding from a surface of the passivation layer, and a width of a portion of the UBM via in contact with the UBM pad is narrower than a width of a portion of the UBM via in contact with the redistribution layer.

Abstract: A fan-out semiconductor package includes connection pads of a semiconductor chip that are redistributed and electrically connected to connection terminals by an interconnection member. In the fan-out semiconductor package, disposition forms of vias and pads in the interconnection member are designed so that stress may be reduced, such that reliability is improved.

Abstract: A light emitting device including a substrate, a light emitting structure disposed on the substrate and having a first light emitting region, a second light emitting region, and a third light emitting region, and an insulation layer to block unintended electrical connection between the first light emitting region and the second light emitting region, or between the second light emitting region and the third light emitting region, in which each of the first light emitting region, the second light emitting region, and the third light emitting region comprises a first conductivity type semiconductor layer, an active layer, and a second conductivity type semiconductor layer, and a center of the first light emitting region overlaps a center of the second light emitting region and a center of the third light emitting region.