Abstract: An absorbable periodontal tissue and bone regeneration material uses bacterial cellulose that has been exposed to radiation. The bacterial cellulose was confirmed to block the invasion of soft tissue in a calvarial defect in rat and rabbit models and to display excellent absorptiveness enough to contribute bone formation. Therefore, the bacterial cellulose can be developed as an absorbable periodontal tissue and bone regeneration material useful in the field of medical engineering by regulating biodegradability without using chemicals that are toxic to human and environment.

Abstract: Disclosed are substrates having an electronic component, including a frame having a through hole, the electronic component disposed in the through hole, a first wiring portion formed on a surface of the frame and the electronic component, a first layer formed on the first wiring portion, and a second wiring portion formed on the first layer, and the second wiring portion including an antenna layer.

Abstract: A sensor package and a method of manufacturing the same are provided. A sensor package includes a substrate on which an image sensor is mounted, an electronic component mounted on the substrate, and a transparent member coupled to the electronic component and covering the image sensor.

Abstract: A fan-out sensor package includes: a first interconnection member having a through-hole; a sensor disposed in the through-hole of the first interconnection member and having an active surface having connection pads and microlenses disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the first interconnection member and the active surface or the inactive surface of the sensor; and a second interconnection member disposed on the first interconnection member and the inactive surface or the active surface of the sensor. The first interconnection member and the second interconnection member include, respectively, redistribution layers electrically connected to the connection pads of the sensor. A camera module includes the fan-out sensor package.

Abstract: A fan-out semiconductor package includes connection pads of a semiconductor chip that are redistributed and electrically connected to connection terminals by an interconnection member. In the fan-out semiconductor package, disposition forms of vias and pads in the interconnection member are designed so that stress may be reduced, such that reliability is improved.

Abstract: A superconducting arcing induction type DC circuit breaker includes a superconducting fault current limiter and an arcing induction type DC circuit breaker connected in series to each other. The arcing induction type DC circuit breaker includes an induction member that has a through-hole, is continuously formed in a 360-degree direction, and has a certain shape and thickness, and an induction needle that protrudes from an inner surface of the induction member toward a center of the induction member. A contact point where an anode and a cathode, which are mechanical contacts, approach from opposite directions and come into contact with each other is formed in the through-hole of the induction member, and the anode and the cathode are separated in a direction far away from each other.

Abstract: An acoustic wave device includes: a substrate; an acoustic wave generating part disposed on a surface of the substrate; a ground pad disposed on the surface of the substrate; a support part spaced apart from the acoustic wave generating part on the surface of the substrate; a shielding member disposed on the support part, and spaced apart from the acoustic wave generating part; and a ground terminal disposed on the ground pad, wherein the ground pad and the shielding member are electrically connected to each other through the ground terminal.

Abstract: A fan-out semiconductor package includes a redistribution layer, an interconnection member, a semiconductor chip, and a protective layer. The interconnection member has a through hole disposed on the redistribution layer. The semiconductor chip is disposed on the redistribution layer exposed within the through hole. The protective layer is formed between the redistribution layer and the interconnection member, and coupled to the interconnection member to protect the interconnection member.

Abstract: An apparatus for manufacturing a semiconductor package module and a method of manufacturing a semiconductor package are provided. The apparatus for manufacturing a semiconductor package module includes a lower mold installed thereon with a board with at least one element mounted thereon, an upper mold, in a state of accommodating the board, provided above the board, a filler supplier disposed in at least one of the upper mold and the lower mold, and supplying a filler to a molding space between the board and the upper mold, and a pattern forming member provided in an inner surface of the upper mold that provides an uneven pattern on a molded part.

Abstract: An acoustic wave device includes a substrate comprising one surface on which an acoustic wave generator and at least one ground pad are included; a support component formed of an insulating material and disposed on the substrate along a circumference of the acoustic wave generator; and a shielding member electrically connected to the ground pad and blocking reception or emission of electromagnetic waves at the acoustic wave generator.

Abstract: A sensor package and a method of manufacturing the same are provided. A sensor package includes a substrate on which an image sensor is mounted, an electronic component mounted on the substrate, and a transparent member coupled to the electronic component and covering the image sensor.

Abstract: An acoustic wave device includes an acoustic wave generator spaced apart from a support layer and disposed on a substrate; a protective member coupled to the support layer and spaced apart from the acoustic wave generator by a predetermined distance; and a sealing component sealing the protective member.

Abstract: An electronic device module and method thereof include a first device, a rewiring part, and second devices. The first device is mounted on a surface of a board. The rewiring part is formed along the surface of the board and a contour of the first device. The second devices are mounted on the rewiring part.

Abstract: An apparatus for manufacturing a semiconductor package module and a method of manufacturing a semiconductor package are provided. The apparatus for manufacturing a semiconductor package module includes a lower mold installed thereon with a board with at least one element mounted thereon, an upper mold, in a state of accommodating the board, provided above the board, a filler supplier disposed in at least one of the upper mold and the lower mold, and supplying a filler to a molding space between the board and the upper mold, and a pattern forming member provided in an inner surface of the upper mold that provides an uneven pattern on a molded part.

Abstract: A board assembly includes: a circuit board; a shield member coupled to the circuit board to face the circuit board; and at least one socket for a storage medium which is mounted on the circuit board. The shield member includes an opening that exposes the entirety of the socket to the outside. The board assembly forms an opening in a dual recess structure to accommodate the socket. Thus, the board assembly may contribute to the reduction of the thickness of an electronic device while being stacked with a battery. Further, the entire socket is exposed to the outside of the shield member, the storage medium may be easily removed.

Abstract: An absorbable periodontal tissue and bone regeneration material uses bacterial cellulose that has been exposed to radiation. The bacterial cellulose was confirmed to block the invasion of soft tissue in a calvarial defect in rat and rabbit models and to display excellent absorptiveness enough to contribute bone formation. Therefore, the bacterial cellulose can be developed as an absorbable periodontal tissue and bone regeneration material useful in the field of medical engineering by regulating biodegradability without using chemicals that are toxic to human and environment.

Abstract: Wireless power transmitting and receiving apparatuses are described, using a superconducting coil for a resonant coil, and wireless power charging systems using the same. Wireless power charging systems described include a power source, a wireless power transmitter connected with the power source, a wireless power receiver, and a battery connected with the wireless power receiver. The wireless power transmitter includes a source coil connected with the power source, a superconducting transmitting coil into which electricity is induced by a magnetic field generated when electricity flows through the source coil, and a first conductive cooling device connected with the superconducting transmitting coil.

Abstract: The present invention relates to a liquid crystal display device in which the light sources of a backlight unit are independently driven as a plurality of separate regions, and to a drive method for the same. In situations where there is a substantial variation in the brightness (luminance) of regions being displayed on the liquid crystal display device, the present invention can improve the visibility of boundaries due to differences in luminance in images displayed within the regions of the backlight unit emitting light at different levels of luminance as a result.

Abstract: The present invention relates to a method for separating collagen from jellyfish by using radiation. More precisely, acid-soluble collagen and attelo collagen were prepared in this invention by using the method combining irradiation technique and chemical treatment. This method of the invention is expected to be useful for the separation of collagen from jellyfish with low costs but high yield.

Abstract: The present invention provides a three-dimensional nanofibrous scaffold for tissue regeneration, which is increased in porosity and thickness to enlarge the surface area thereof, thereby enabling cell adhesion at a high density, and a method for fabricating the same. The method for fabricating a three-dimensional nanofibrous scaffold for tissue regeneration includes the steps of: (a) preparing a polymer solution; (b) preparing a nanofiber matrix, in which a plurality of nanofibers is entangled with each other, from the polymer solution prepared in step (a) using electrospinning; and (c) immersing the prepared nanofiber matrix in a solution and subjecting the solution to ultrasonication, thereby increasing the thickness and porosity of the nanofiber matrix.