Patents by Inventor In-Yong Jung

In-Yong Jung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240203477
    Abstract: A memory device includes: a rate control circuit configured to: generate a refresh counting value based on a refresh management command and an internal target refresh command, and generate a rate control signal by comparing the refresh counting value with a target value corresponding to temperature information; and a target command issuing circuit configured to: set a target number according to the rate control signal, and issue the internal target refresh command whenever a number of inputs of a normal refresh command reaches the target number.
    Type: Application
    Filed: May 24, 2023
    Publication date: June 20, 2024
    Inventors: Chul Moon JUNG, Byeong Yong GO, Woongrae KIM
  • Publication number: 20240203651
    Abstract: A multilayer electronic component includes a body including a dielectric layer and internal electrodes alternately disposed with the dielectric layer; and external electrodes disposed on the body. The dielectric layer includes N-doped polydopamine.
    Type: Application
    Filed: April 21, 2023
    Publication date: June 20, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Yong PARK, Jong Ho LEE, Jung Jin PARK, Su Min KIM, Eun Jung LEE, Yong Min HONG, Ji Hyeon LEE, Sim Chung KANG, Min Woo KIM, Jung Tae PARK
  • Publication number: 20240200105
    Abstract: A CRISPR regulatory system is disclosed. More particularly, the CRISPR regulatory system is useful for effectively regulating expression of a target gene and contains a Cas12f1 fusion protein and an engineered Cas12f1 guide RNA Uses of the CRISPR regulatory system are also disclosed. A method of regulating expression of a target gene by using a CRISPR regulatory system containing a Cas12f1 fusion protein and an engineered Cas12f1 guide RNA is also disclosed.
    Type: Application
    Filed: April 8, 2022
    Publication date: June 20, 2024
    Applicant: GENKORE INC.
    Inventors: Yong-Sam KIM, Do Yon KIM, Hyun Jung CHIN, Dongmin JEONG, Jeong Heon KO
  • Patent number: 12011651
    Abstract: Disclosed are a virtual golf system, a virtual golf introduction image generation method, and a virtual golf player information calculation method capable of providing a separate introduction image showing two or more users so as to be comparable to each other through record information of a virtual golf game of each of a plurality of users who use the virtual golf system before the plurality of users access the system in order to play the virtual golf game, whereby it is possible to induce users' record competition in the virtual golf game and to provide the users with immersiveness and interest in the game.
    Type: Grant
    Filed: July 10, 2020
    Date of Patent: June 18, 2024
    Assignee: GOLFZON CO., LTD.
    Inventors: Kyung Yong Lee, Bong Ho Song, Min Yong Cho, Choong Hwan Kim, Joo Young Jung, Sun Woong Hur, In Jun Lee
  • Patent number: 12014938
    Abstract: Disclosed is a method for processing a substrate, comprising a liquid processing step of performing liquid processing on the substrate by supplying a processing liquid onto the substrate in a liquid processing chamber, a transfer step of transferring the substrate from the liquid processing chamber to a drying chamber, and a drying step of drying the substrate in the drying chamber. In the drying step, the substrate is dried while an edge region of the substrate other than a central region of the substrate is supported by a support unit, and in the liquid processing step, the liquid processing is performed on the substrate such that a height of the processing liquid remaining on the edge region of the substrate is greater than a height of the processing liquid remaining on the central region of the substrate when the liquid processing is completed in the liquid processing chamber.
    Type: Grant
    Filed: September 28, 2022
    Date of Patent: June 18, 2024
    Assignee: SEMES CO., LTD.
    Inventors: Yong Hee Lee, Young Hun Lee, Jinwoo Jung, Eui Sang Lim
  • Publication number: 20240196528
    Abstract: A printed circuit board includes: a first metal layer; an organic insulating layer covering at least a portion of the first metal layer and having a via hole exposing at least a portion of an upper surface of the first metal layer; a first seed metal layer disposed on an upper surface of the organic insulating layer; a second seed metal layer disposed on the first seed metal layer and extending onto a wall surface of the via hole and the exposed upper surface of the first metal layer; and a second metal layer disposed on the second seed metal layer and filling at least a portion of the via hole, wherein the first seed metal layer includes a first sputtering layer including titanium (Ti), and the second seed metal layer includes an electroless plating layer.
    Type: Application
    Filed: April 25, 2023
    Publication date: June 13, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sangik CHO, Mi Jung PARK, Mi Geum KIM, Yong Su LEE, Sung HAN, Jong Eun PARK
  • Publication number: 20240190307
    Abstract: A reclining device for a vehicle seat includes a rotary bracket having a center portion rotatably connected to a first frame and having a first locking section and a second locking section connected to the first locking section, and a cam configured to rotate about a center portion connected to the first frame and having a locking portion provided at one end thereof and positioned in the first locking section or the second locking section so as to be locked.
    Type: Application
    Filed: November 28, 2023
    Publication date: June 13, 2024
    Inventors: Han Yun CHOI, Jong Su KIM, Cheolhwan YOON, Sai Youn JUNG, Hwa Young MUN, Gwon Hwa BOK, Jae Yong JANG, Junsik HWANG
  • Publication number: 20240194894
    Abstract: Disclosed herein are an electrode with a three-dimensional structure comprising two or more layers of nanowire array layer in which first and second nanowires of different materials, and imaginary third nanowires composed of air, are arranged side by side, in which nanowires in one layer are crossed by nanowires in an adjacent layer, a method of manufacturing the electrode, an anode for a solid oxide fuel cell having the structure described above, and a solid oxide fuel cell including the anode.
    Type: Application
    Filed: July 1, 2023
    Publication date: June 13, 2024
    Applicants: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY, KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Seung Yong LEE, Hyoungchul KIM, Jong Min KIM, Yeon Sik JUNG
  • Publication number: 20240188424
    Abstract: The present disclosure relates to an organic electroluminescent compound, a plurality of host materials, and an organic electroluminescent device comprising the same. By comprising the organic electroluminescent compound according to the present disclosure or by comprising a specific combination of compounds according to the present disclosure as a plurality of host materials, it is possible to produce an organic electroluminescent device having improved luminous efficiency, and/or lifetime properties compared to the conventional organic electroluminescent devices.
    Type: Application
    Filed: October 13, 2023
    Publication date: June 6, 2024
    Inventors: Su-Hyun LEE, Kyung-Hoon CHOI, So-Young JUNG, Chi-Sik KIM, Soo-Yong LEE, Sang-Hee CHO, Young-Jun CHO, Young-Gil KIM, Bitnari KIM, Young-Jae KIM, Hyo-Nim SHIN
  • Publication number: 20240186059
    Abstract: A coil component includes a body having a first surface and a second surface opposing each other in a first direction, a support member disposed in the body, the support member having a first surface and a second surface opposing each other, a coil disposed on the support member, a pad portion disposed on the first surface of the support member to be connected to the coil, an external electrode disposed on the first surface of the body, and a via electrode connecting the pad portion and the external electrode to each other.
    Type: Application
    Filed: June 8, 2023
    Publication date: June 6, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Mi Geum KIM, Jong Eun PARK, Sang Ik CHO, Mi Jung PARK, Yong Su LEE
  • Publication number: 20240181943
    Abstract: An embodiment luggage gap cover device for a rear seat of a vehicle is provided. The rear seat includes an interlocking frame connecting a seatback of the rear seat to a seat cushion for a dive operation, and the luggage gap cover device includes a foldable cover mat on a rear surface of the seatback configured to cover a gap between the seatback and a floor plate of a luggage compartment and a support protrusion on the interlocking frame, the support protrusion being configured to push and support the cover mat in a direction of covering the gap between the seatback and the floor plate.
    Type: Application
    Filed: May 2, 2023
    Publication date: June 6, 2024
    Inventors: Mu Young Kim, Jun Young Yun, Han Kyeol Cho, Ho Suk Jung, Sang Do Park, Chan Ho Jung, Jun Hwan Lee, Dong Jin Kim, Hee Won Kwon, Jung Eun Kwon, Soo Yong Kim, Ye Eun Song, Jeong Su Yoon
  • Patent number: 12002402
    Abstract: An embodiment provides a latch circuit which outputs, to a digital analog converter (DAC), a digital signal including grayscale data, the latch circuit including a first latch configured to store the digital signal and a second latch configured to output the digital signal by controlling first timing at which a level of a first signal included in the digital signal becomes an enable level, based on a center grayscale. The grayscale data includes first grayscale data and second grayscale data.
    Type: Grant
    Filed: December 19, 2022
    Date of Patent: June 4, 2024
    Assignee: LX SEMICON CO., LTD.
    Inventors: Gi Baek Choi, Jong Hwi Park, Yong Jung Kwon, Jung Bae Yun
  • Publication number: 20240166663
    Abstract: A novel pyrimidine compound of the following formula I, a solvate, a stereoisomer or a pharmaceutically acceptable salt thereof are disclosed. Compositions containing the pyrimidine compound, solvate, stereoisomer or pharmaceutically acceptable salt thereof and methods of preventing or treating tyrosine kinase domain mutant EGFR-overexpression-associated diseases are disclosed.
    Type: Application
    Filed: March 11, 2022
    Publication date: May 23, 2024
    Applicant: ONCOBIX CO., LTD.
    Inventors: Sung Eun KIM, Sun Ho LEE, Yong Hyup LEE, Yun Jeong KONG, Min Seo BAEK, Min Jung KIM, Hye Min JEON
  • Publication number: 20240170764
    Abstract: An energy storage device is equipped with an intake and exhaust integrated duct. The intake and exhaust integrated duct is capable of achieving a uniform cooling effect in a plurality of battery modules by distributing air to each cell module of a battery.
    Type: Application
    Filed: November 17, 2023
    Publication date: May 23, 2024
    Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION, Duck Yang Industry Co., Ltd.
    Inventors: Sun Jun Kim, Hyung Seok Choi, Hee Jun Do, In Mook Park, Jae Yong Lee, Ki Won Jung
  • Publication number: 20240166799
    Abstract: The present exemplary embodiments may provide a latent curing agent including an imidazole-based compound protected by a Diels-Alder reaction between a diene and a dienophile.
    Type: Application
    Filed: December 15, 2022
    Publication date: May 23, 2024
    Inventors: Jaewoo KIM, Sungmin JUNG, Yong Seok CHOI, Jong Hyuk PARK, Min PARK, Jun Woo JEON, Yong Chae JUNG, YOONSANG KIM, Han Gyeol JANG, Jun Young JO
  • Patent number: 11990708
    Abstract: An electrical connector includes: an insulating body defining a mating space; and a terminal module assembled to the insulating body and having a circuit board and plural mating terminals mounted on the circuit board, wherein: each of the mating terminals has a contact portion extending obliquely backward, a bending portion bent backward from a front end of the contact portion, a connecting portion extending rearward from a rear end of the bending portion, and a mounting portion vertically extending from a rear end of the connecting portion for mounting on the circuit board; and a front end of the circuit board extends forward into the mating space.
    Type: Grant
    Filed: March 23, 2022
    Date of Patent: May 21, 2024
    Assignees: FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD., FOXCONN INTERCONNECT TECHNOLOGY LIMITED
    Inventors: Sheng-Pin Gao, Yong-Chun Xu, Hung-Chi Yu, Chih-Ching Hsu, Jie Zhang, Chin-Jung Wu
  • Patent number: 11981924
    Abstract: Provided are a composition for culturing NK cells, and a method of culturing NK cells using the same. According to an aspect, in culturing NK cells from peripheral blood mononuclear cells, when NK cells are cultured in a medium including the composition for culturing NK cells, the composition including IL-15, IL-18, and IL-27, the NK cells may proliferate in large quantities and activation of NK cells may be promoted. Therefore, when the NK cells are used, cancer cell apoptosis or cancer cell-killing ability may be promoted. Accordingly, the NK cells may be used as an effective adoptive immune cell therapy product in cancer prevention or treatment.
    Type: Grant
    Filed: July 17, 2023
    Date of Patent: May 14, 2024
    Assignee: SUNGKWANG MEDICAL FOUNDATION
    Inventors: Hee Jung An, Yeon Ho Choi, Eun Jin Lim, Yong Wha Moon, Se Wha Kim
  • Publication number: 20240153792
    Abstract: An apparatus and method for processing a substrate can reduce the concentration of process by-products in a chemical solution.
    Type: Application
    Filed: November 7, 2023
    Publication date: May 9, 2024
    Applicants: SEMES CO., LTD., SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Min Jung KIM, Jin Ah HAN, Hee Hwan KIM, Yong Hoon HONG, Kyoung Suk KIM, Jong Hyeok PARK, Jin Hyung PARK, Dae Hyuk CHUNG, Ji Hoon CHA
  • Publication number: 20240153848
    Abstract: A semiconductor device may include an upper interlayer insulating film on a lower wiring structure and an upper wiring structure in an upper wiring trench of the upper interlayer insulating film. The lower wiring structure may include a lower filling film and a lower capping film including a capping opening exposing a portion of the lower filling film. The upper wiring structure may contact the lower filling film. The upper wiring structure may include an upper liner between an upper barrier film and an upper filling film. A sidewall portion of the upper liner may include cobalt doped with ruthenium. A bottom portion of the upper liner may not include cobalt doped with ruthenium. A sidewall portion of the upper barrier film may include tantalum nitride doped with ruthenium (Ru). A sidewall portion of the upper barrier film may not be in contact with the lower capping film.
    Type: Application
    Filed: July 13, 2023
    Publication date: May 9, 2024
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Seung Yong YOO, Eun-Ji JUNG
  • Patent number: 11978795
    Abstract: A semiconductor device and a method of manufacturing the same. The semiconductor device has a substrate in which recess regions are formed and semiconductor regions acting as a source region or a drain region is defined between the recess regions; a gate insulating layer disposed on an inner surface of each recess region; a recess gate disposed on the gate insulating layer in each recess region; an insulating capping layer disposed above the recess gate in each recess region; a metallic insertion layer disposed between a side surface of the recess gate and a side surface of the insulating capping layer and facing with a side surface of the source region or the drain region; and an intermediate insulating layer disposed between the metallic insertion layer and the recess gate to electrically insulate the metallic insertion layer from the recess gate.
    Type: Grant
    Filed: September 21, 2021
    Date of Patent: May 7, 2024
    Assignees: SK hynix Inc., KOREA UNIVERSITY RESEARCH AND BUSINESS FOUNDATION
    Inventors: Hyun-Yong Yu, Seung Geun Jung, Mu Yeong Son