Patents by Inventor In You

In You has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240192469
    Abstract: An optical imaging system is provided. The optical imaging system includes a first lens group, a reflective member, and a second lens group arranged sequentially along an optical axis, and the first lens group may include one lens, and the second lens group includes two or more lenses, the first lens group may have positive refractive power, and the second lens group may have positive refractive power as a whole, an effective diameter of the lens included in the first lens group may be greater than an effective diameter of the lenses included in the second lens group, and 0<D1/f<0.05 may be satisfied. Here, D1 is a distance on the optical axis between an image-side surface of the lens included in the first lens group and the reflective member, and f is a total focal length of the optical imaging system.
    Type: Application
    Filed: May 18, 2023
    Publication date: June 13, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: You Jin JEONG, Jae Hyuk HUH
  • Publication number: 20240194227
    Abstract: In one example, a peripheral circuit in a die is configured to: first, receive control commands, and generate indication information according to the control commands, the control commands being used for indicating the die to determine the address of the die, the indication information being used for indicating M dies to share the same enable pin, M being a positive integer greater than or equal to 1; and then, determine the address of the die according to the indication information, and send the address of the die, the address being used for addressing an enable signal provided by the enable pin.
    Type: Application
    Filed: December 30, 2022
    Publication date: June 13, 2024
    Inventors: Yingjun Wu, Huabin Yan, Dong He, Lei You
  • Publication number: 20240194915
    Abstract: An ammonia fuel cell system capable of rapid adsorption-and-desorption switching by ammonia self-evaporation includes an ammonia decomposition reactor; an ammonia tank; a first heat exchanger; a fuel tank; a first blower; a second heat exchanger; an adsorption column device; a fuel cell; a gas circulation system; and an exhaust gas combustion system, wherein an outlet of the ammonia tank connects with an ammonia gas inlet of the ammonia decomposition reactor, wherein a decomposition gas outlet of the ammonia decomposition reactor, through the first heat exchanger, connects with an adsorption inlet of the adsorption column device, wherein a product produced by decomposition of ammonia gas in the ammonia decomposition reactor preheats a raw ammonia gas via the first heat exchanger, wherein the fuel tank connects with the ammonia decomposition reactor for feeding a fuel gas to the ammonia decomposition reactor.
    Type: Application
    Filed: December 5, 2023
    Publication date: June 13, 2024
    Applicants: Fuzhou University, FZU Zijin Hydrogen Power Technology Co., Ltd.
    Inventors: Lilong JIANG, Yu LUO, Li LIN, JIacheng YOU, Lixuan ZHANG, Qing ZHANG
  • Publication number: 20240194839
    Abstract: A micro light-emitting diode display is based on a conventional micro light-emitting diode display and includes at least one electrically conductive material layer or at least one functional material added to an encapsulation layer, so as to achieve antistatic effect. The micro light-emitting diode display solves the problem that the conventional micro light-emitting diode display is easily damaged by electrostatic breakdown.
    Type: Application
    Filed: December 14, 2022
    Publication date: June 13, 2024
    Inventors: CHIA-MING FAN, WEN-YOU LAI, HSIEN-YING CHOU, PO-LUN CHEN, CHUN-TA CHEN, PO-CHING LIN
  • Publication number: 20240194767
    Abstract: Semiconductor structures and methods of forming the same are provided. A method according to the present disclosure includes forming a stack of epitaxial layers over a substrate, forming a first fin-like structure and a second fin-like structure from the stack, forming an isolation feature between the first fin-like structure and the second fin-like structure, forming a cladding layer over the first fin-like structure and the second fin-like structure, conformally depositing a first dielectric layer over the cladding layer, depositing a second dielectric layer over the first dielectric layer, planarizing the first dielectric layer and the second dielectric layer until the cladding layer are exposed, performing an etch process to etch the second dielectric layer to form a helmet recess, performing a trimming process to trim the first dielectric layer to widen the helmet recess, and depositing a helmet feature in the widened helmet recess.
    Type: Application
    Filed: January 29, 2024
    Publication date: June 13, 2024
    Inventors: Jen-Hong Chang, Yuan-Ching Peng, Chung-Ting Ko, Kuo-Yi Chao, Chia-Cheng Chao, You-Ting Lin, Chih-Chung Chang, Yi-Hsiu Liu, Jiun-Ming Kuo, Sung-En Lin
  • Publication number: 20240194752
    Abstract: A semiconductor device includes a substrate, an active pattern disposed on the substrate and extending in a first direction, gate electrodes covering the active pattern and extending in a second direction, a gate spacer disposed on a sidewall of each of the gate electrodes, a source/drain pattern disposed between adjacent ones of the gate electrodes, an etch stop film disposed along a sidewall of the gate spacer and a profile of the source/drain pattern, an interlayer insulating film disposed between the adjacent ones of the gate electrodes with a contact trench exposing the source/drain pattern defined therein, a liner film disposed on an outer sidewall of the contact trench, and a source/drain contact disposed on the liner film and filling the contact trench, in which the source/drain contact is connected to the source/drain pattern. At least a portion of the liner film may be disposed in the source/drain pattern.
    Type: Application
    Filed: November 6, 2023
    Publication date: June 13, 2024
    Inventors: Woo Kyung YOU, Sang Koo KANG, Jun Chae LEE, Koung Min RYU, Woo Jin LEE
  • Patent number: 12004876
    Abstract: An auto-powered biosensor capable detecting a target molecule, and a method of powering the same, wherein the biosensor is fabricated with a microfluidics layer, a multimodal sensing layer comprising a biofuel cell and an electrode, and a logic circuit that may include a processor and non-transitory memory with computer executable instructions embedded thereon.
    Type: Grant
    Filed: April 22, 2021
    Date of Patent: June 11, 2024
    Assignee: California Institute of Technology
    Inventors: Wei Gao, You Yu
  • Patent number: 12005423
    Abstract: Provided are compositions for removal of a target substance from a fluid stream, the composition comprising a polyamine; and a covalently linked hydrophobic group, wherein the polyamine is covalently linked to a support material. Also provided are processes for removal of a target substance from a fluid stream comprising contacting the fluid stream with a composition comprising a polyamine; and a covalently linked hydrophobic group, wherein the polyamine is covalently linked to a support material.
    Type: Grant
    Filed: March 28, 2019
    Date of Patent: June 11, 2024
    Assignee: Puraffinity Ltd.
    Inventors: Benjamin David Reeve, Wen Li, Katharina Reeh, Amanda Yi Fen You, Henrik Hagemann
  • Patent number: 12009598
    Abstract: An electronic device and an antenna structure are provided. The electronic device includes a metal housing, and the antenna structure is disposed in the metal housing. The antenna structure includes a printed circuit board, two radiating elements, two feeding transmission lines and a connector. The two radiating elements are disposed on the printed circuit board and are close to the two slots. Projections of the two radiating elements projected onto the metal housing at least partially overlap with the two slots. The two feeding transmission line are disposed in the printed circuit board. The two feeding transmission lines are electrically connected to the two radiating elements, respectively, and lengths of the two feeding transmission lines are the same. The connector is connected to the printed circuit board and electrically connected to the two feeding transmission lines.
    Type: Grant
    Filed: November 9, 2022
    Date of Patent: June 11, 2024
    Assignee: WISTRON NEWEB CORPORATION
    Inventors: Ying-Sheng Fang, Shang-Sian You
  • Patent number: 12007523
    Abstract: The application describes a security inspection apparatus and a method of controlling the same. An example security inspection apparatus includes a body fixed in the field and an electromagnetic imaging device installed on the body. The electromagnetic imaging device includes a two-dimensional multi-input multi-output array panel, including at least one two-dimensional multi-input multi-output sub-array and a control circuit. Each two-dimensional multi-input multi-output sub-array includes transmitting antennas and receiving antennas, with the transmitting antennas and the transmitting antennas being arranged such that equivalent phase centers are arranged in a two-dimensional array. The electromagnetic imaging device further includes a signal processing device configured to reconstruct an image of an inspected object based on an echo signal received and a display device configured to display the reconstructed image of the inspected object.
    Type: Grant
    Filed: June 28, 2021
    Date of Patent: June 11, 2024
    Assignees: Tsinghua University, Nuctech Company Limited
    Inventors: Ziran Zhao, Yan You, Yuanjing Li, Xuming Ma, Jian Wu
  • Patent number: 12005019
    Abstract: Provided is a massage module and a massage device including same. The massage module may include: a procedure member including an upper finger member and a lower finger member cooperating with the upper finger member; and a cam driving part connected to the upper finger member so as to move the upper finger member in the vertical direction, so that the upper finger member and the lower finger member are away from or close to each other.
    Type: Grant
    Filed: August 10, 2018
    Date of Patent: June 11, 2024
    Assignee: BODYFRIEND CO., LTD.
    Inventors: Sung Chan Choi, Cheul Kyu Jin, Myeong Jin You, Gi Won Um, Jong Sick Park
  • Patent number: 12010826
    Abstract: A semiconductor structure includes a first transistor comprising a first gate structure over a first active region in a substrate. The semiconductor structure further includes a second active region in the substrate. The semiconductor structure further includes a first butted contact. The first butted contact includes a first portion extending in a first direction and overlapping the second active region, and a second portion extending from the first portion, wherein the second portion directly contacts each of a top surface and a sidewall of the first gate structure.
    Type: Grant
    Filed: March 15, 2023
    Date of Patent: June 11, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: You Che Chuang, Chih-Ming Lee, Hsin-Chi Chen, Hsun-Ying Huang
  • Patent number: 12008937
    Abstract: An infinitely expandable display apparatus includes a set board outputting image data having a first resolution and a plurality of display circuits connected to one another through an interface circuit based on a cascading scheme to display the image data, each of the plurality of display circuits including an application specific integrated circuit (ASIC) embedded therein, wherein each of the plurality of display circuits includes a plurality of slave display circuits generating unit arrangement coordinate information based on a connection of the interface circuit and a master display circuit scaling the image data having the first resolution based on the unit arrangement coordinate information and transferring the scaled image data to the plurality of slave display circuits.
    Type: Grant
    Filed: November 9, 2021
    Date of Patent: June 11, 2024
    Assignee: LG Display Co., Ltd.
    Inventors: Dong Jun You, Min Hoi Kim
  • Patent number: 12009931
    Abstract: An uplink transmission method and a communications apparatus, the method including when transmitting, in a subframe in which an autonomous uplink transmission resource is configured, uplink data by using a first hybrid automatic repeat request (HARQ) process, considering that a new data indicator (NDI) for the first HARQ process is toggled, where the first HARQ process is a HARQ process that can be used for autonomous uplink transmission, and before the subframe, there is no uplink grant for the first HARQ process delivered to a HARQ entity, and performing new uplink data transmission in the subframe by using the first HARQ process.
    Type: Grant
    Filed: August 12, 2021
    Date of Patent: June 11, 2024
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Li Zhao, Qinghai Zeng, Mingzeng Dai, Chunhua You
  • Patent number: 12009546
    Abstract: The present application relates to a battery module and a battery pack, the battery module including a battery cell arrangement structure, bus bars and a fixing plate, where the battery cell arrangement structure includes a plurality of battery cells; the plurality of battery cells are electrically connected by means of a plurality of the bus bars to form a first output electrode of the battery module and a second output electrode of the battery module, and the first output electrode of the battery module and the second output electrode of the battery module are arranged at a same end of the battery module along a horizontal direction; the fixing plate is provided with an insulating portion, and at least a part of the insulating portion is located between the first output electrode of the battery module and the second output electrode of the battery module.
    Type: Grant
    Filed: December 17, 2020
    Date of Patent: June 11, 2024
    Assignee: CONTEMPORARY AMPEREX TECHNOLOGY CO., LIMITED
    Inventors: Xingdi Chen, Kaijie You, Yu Tang, Yuepan Hou, Ziyuan Li, Jun Ma
  • Patent number: 12009265
    Abstract: A method of forming an integrated circuit structure includes forming a first source/drain contact plug over and electrically coupling to a source/drain region of a transistor, forming a first dielectric hard mask overlapping a gate stack, recessing the first source/drain contact plug to form a first recess, forming a second dielectric hard mask in the first recess, recessing an inter-layer dielectric layer to form a second recess, and forming a third dielectric hard mask in the second recess. The third dielectric hard mask contacts both the first dielectric hard mask and the second dielectric hard mask.
    Type: Grant
    Filed: December 19, 2022
    Date of Patent: June 11, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Lin-Yu Huang, Li-Zhen Yu, Sheng-Tsung Wang, Jia-Chuan You, Chia-Hao Chang, Tien-Lu Lin, Yu-Ming Lin, Chih-Hao Wang
  • Patent number: 12009254
    Abstract: A method includes forming a first conductive feature on a substrate, forming a via that contacts the first conductive feature, the via comprising a conductive material, performing a Chemical Mechanical Polishing (CMP) process to a top surface of the via, depositing an Interlayer Dielectric (ILD) layer on the via, forming a trench within the ILD layer to expose the via, and filling the trench with a second conductive feature that contacts the via, the second conductive feature comprising a same material as the conductive material.
    Type: Grant
    Filed: May 16, 2022
    Date of Patent: June 11, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chun-Yuan Chen, Shih-Chuan Chiu, Jia-Chuan You, Chia-Hao Chang, Tien-Lu Lin, Yu-Ming Lin
  • Patent number: D1030343
    Type: Grant
    Filed: November 11, 2022
    Date of Patent: June 11, 2024
    Assignee: Ningbo TreeNest Children Products Co., Ltd.
    Inventor: Beibei You
  • Patent number: D1030529
    Type: Grant
    Filed: July 19, 2022
    Date of Patent: June 11, 2024
    Assignees: Mettler-Toledo (Changzhou) Precision Instrument Co., Ltd., Mettler-Toledo (Changzhou) Measurement Technology Co., Ltd., Mettler-Toledo International Trading (Shanghai) Co., Ltd.
    Inventors: You Yi Wu, Chin Hui Li, Ferenc Muranyi, Tom Leahy
  • Patent number: D1030530
    Type: Grant
    Filed: July 19, 2022
    Date of Patent: June 11, 2024
    Assignees: Mettler-Toledo (Changzhou) Precision Instrument Co., Ltd., Mettler-Toledo (Changzhou) Measurement Technology Co., Ltd., Mettler-Toledo International Trading (Shanghai) Co., Ltd.
    Inventors: You Yi Wu, Chin Hui Li, Ferenc Muranyi, Tom Leahy