Patents by Inventor In-Young Chang

In-Young Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240162230
    Abstract: A transistor device includes a substrate, a fin structure extending on the substrate in a direction parallel to a top surface of the substrate, a source region and a drain region provided at an upper portion of the fin structure, a constant current generating layer provided at a lower portion of the fin structure, a gate insulating film provided on both side surfaces and a top surface of the upper portion of the fin structure, and a gate electrode provided on the gate insulating film, wherein the gate electrode is provided on the fin structure and between the source region and the drain region, the constant current generating layer generates a constant current between the drain region and the substrate, and the constant current is independent from a gate voltage applied to the gate electrode.
    Type: Application
    Filed: January 12, 2024
    Publication date: May 16, 2024
    Applicant: UNIST(ULSAN NATIONAL INSTITUTE OF SCIENCE AND TECHNOLOGY)
    Inventors: Kyung Rok Kim, Jae Won Jeong, Young Eun Choi, Woo Seok Kim, Jiwon Chang
  • Publication number: 20240164193
    Abstract: A display device includes a base substrate, a light emitting element disposed on the base substrate, an inorganic layer disposed on the light emitting element and including a metal and a metal oxide layer, an encapsulation layer disposed on the inorganic layer, an organic layer disposed on the encapsulation layer and including a quarter-wave plate, and an anti-reflection layer disposed on the organic layer.
    Type: Application
    Filed: June 5, 2023
    Publication date: May 16, 2024
    Inventors: KYUNGHEE LEE, DAEWON KIM, JONGHO SON, Hyebeom Shin, JINHYEONG LEE, SUN-YOUNG CHANG
  • Publication number: 20240159837
    Abstract: The present invention provides a battery monitoring method, which is performed by a battery monitoring device, including: measuring a first voltage drop across both ends of a first shunt resistor of a bus bar electrically connected to a battery and a second voltage drop across both ends of a second shunt resistor, which is in parallel or serial connection with the first shunt resistor; calculating a first current and a second current flowing, respectively, through the first shunt resistor and the second shunt resistor using a first voltage drop value and a second voltage drop value; and determining a state of the battery using a difference between a first current value and a second current value. According to the present invention, it is possible to increase the reliability of monitoring information related to the battery's state by utilizing current values that have undergone linearity compensation and temperature compensation.
    Type: Application
    Filed: November 9, 2023
    Publication date: May 16, 2024
    Applicant: SMART ELECTRONICS INC.
    Inventors: Hong Il CHAE, Hyun Chang KIM, Kwang Hoon LEE, Won Seok KIM, Hyuk Jae KWON, Young Min SON, Hyeon Chang JEONG
  • Publication number: 20240157613
    Abstract: A method of manufacturing a composite material through a wet compression molding (WCM) process is disclosed. The internal pressure of a mold is controlled so that productivity may be improved due to process automation through application of a resin using a robot. Quality of the composite material may be improved due to minimization of deformation of a foam core through control of the internal pressure of the mold.
    Type: Application
    Filed: August 2, 2023
    Publication date: May 16, 2024
    Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION, UNIST (ULSAN NATIONAL INSTITUTE OF SCIENCE AND TECHNOLOGY)
    Inventors: Sang Won Lim, Sang Jae Yoon, Young Bin Park, Woo Seok Ji, Soo Chang Kang, Seong Woo Im
  • Publication number: 20240157808
    Abstract: A power supply system for an aircraft and a control method thereof are provided. The power supply system of the aircraft includes a fuel cell configured to generate electrical energy, a converter device configured to supply a voltage generated by the fuel cell to a first motor device for driving the aircraft through a first output terminal and switch a connection with the fuel cell depending on a predetermined driving mode, a battery configured to supply the voltage to a second motor device for driving the aircraft through a second output terminal, the second output terminal being connected with an output node of the fuel cell, and a processor configure to control a connection between the fuel cell and the converter device depending on the driving mode.
    Type: Application
    Filed: October 31, 2023
    Publication date: May 16, 2024
    Inventors: Jong Pil Kim, Woo Young Lee, Hee Kwang Lee, Jung Hyun Lee, Sae Kwon Chang, Mi Jin Kim
  • Patent number: 11984377
    Abstract: Thermal heat spreaders and/or an IC die with solderable thermal structures may be assembled together with a solder array thermal interconnects. A thermal heat spreader may include a non-metallic material and one or more metallized surfaces suitable for bonding to a solder alloy employed as thermal interface material between the heat spreader and an IC die. An IC die may include a metallized back-side surface similarly suitable for bonding to a thermal interconnect comprising a solder alloy. Metallization on the IC die and/or heat spreader may comprise a plurality of solderable structures. A multi-chip package may include multiple IC die having different die thickness that are accommodated by a z-height thickness variation in the thermal interconnects and/or the solderable structures of the IC die or heat spreader.
    Type: Grant
    Filed: March 26, 2020
    Date of Patent: May 14, 2024
    Assignee: Intel Corporation
    Inventors: Debendra Mallik, Je-Young Chang, Ram Viswanath, Elah Bozorg-Grayeli, Ahmad Al Mohammad
  • Publication number: 20240153655
    Abstract: According to an embodiment of the present invention, an emergency core cooling system (ECCS) valve provided between a reactor vessel of a system-integrated modular advanced reactor (SMART) and a small containment vessel formed to surround the reactor vessel so that a coolant is filled in a space between the reactor vessel and the small containment vessel in the event of a loss of coolant accident (LOCA) includes an outer shell connected to the reactor vessel and formed to protrude toward the small containment vessel and having a connector formed therein so as to communicatively connect an inside of the reactor vessel to an inside of the small containment vessel, an inner shell provided inside the outer shell at a preset distance from an inner wall of the outer shell, a piston movably constrained and inserted through a piston opening formed in the inner shell at a position facing the connector of the outer shell to open and close the connector, and a spring provided on an outer circumferential surface of the p
    Type: Application
    Filed: November 1, 2021
    Publication date: May 9, 2024
    Inventors: Soo Jai SHIN, Cheongbong CHANG, Seungyeob RYU, Han-Ok KANG, Young-In KIM, Ji Han CHUN, Sung Won LIM, Joo Hyung MOON, Hun Sik HAN, Seok KIM, Hyunjun CHO
  • Publication number: 20240149752
    Abstract: An embodiment relaxation seat for a vehicle includes a seat cushion lower frame configured to be mounted on a seat rail, a seat cushion upper frame connected to the seat cushion lower frame in a tilting-enabled manner, a seat back frame connected to the seat cushion upper frame, a locking device mounted at a predetermined position on the seat cushion upper frame, a front link hinge-connecting between the seat cushion upper frame and a front end portion of the seat cushion lower frame, a rear link hinge-connecting between the seat cushion upper frame and a rear end portion of the seat cushion lower frame, and a support bar connecting between the locking device and the front link in a manner that is movable backward and forward and configured to support the front link for rotation or fixation thereof.
    Type: Application
    Filed: April 17, 2023
    Publication date: May 9, 2024
    Inventors: Byeong Kwang Kim, Young Bok Sung, Yong Chang Jung, Young Jun Kim
  • Publication number: 20240153073
    Abstract: A method for training an artificial neural network for detecting a prostate cancer from a TURP pathological image, includes: acquires a plurality of acquiring pathological images for primary training, each being a prostate needle biopsy pathological image or a radical prostatectomy pathological image; using the pathological images to primarily train an artificial neural network for determining prostate cancer; acquiring TURP pathological images; and using the TURP pathological images to secondarily train the primarily trained artificial neural network, wherein each TURP pathological image includes a non-prostate tissue region and/or a cauterized prostate tissue region, and does not include any prostate cancer lesion region.
    Type: Application
    Filed: March 7, 2022
    Publication date: May 9, 2024
    Inventors: Joon Young CHO, Hye yoon CHANG, Tae Yeong Kwak, Sun woo KIM
  • Patent number: 11980037
    Abstract: Described herein are ferroelectric (FE) memory cells that include transistors having gate stacks separate from FE capacitors of these cells. An example memory cell may be implemented as an IC device that includes a support structure (e.g., a substrate) and a transistor provided over the support structure and including a gate stack. The IC device also includes a FE capacitor having a first capacitor electrode, a second capacitor electrode, and a capacitor insulator of a FE material between the first capacitor electrode and the second capacitor electrode, where the FE capacitor is separate from the gate stack (i.e., is not integrated within the gate stack and does not have any layers that are part of the gate stack). The IC device further includes an interconnect structure, configured to electrically couple the gate stack and the first capacitor electrode.
    Type: Grant
    Filed: June 19, 2020
    Date of Patent: May 7, 2024
    Assignee: Intel Corporation
    Inventors: Nazila Haratipour, Shriram Shivaraman, Sou-Chi Chang, Jack T. Kavalieros, Uygar E. Avci, Chia-Ching Lin, Seung Hoon Sung, Ashish Verma Penumatcha, Ian A. Young, Devin R. Merrill, Matthew V. Metz, I-Cheng Tung
  • Publication number: 20240145752
    Abstract: A fuel cell apparatus of the disclosure includes a case having defined therein a first accommodation space and a second accommodation space, which are isolated from each other by a partition wall, a first cover covering the first accommodation space in the case, a second cover covering the second accommodation space in the case, a power distribution unit disposed in the first accommodation space, and a power conversion unit disposed in the second accommodation space.
    Type: Application
    Filed: May 11, 2023
    Publication date: May 2, 2024
    Inventors: Sae Kwon CHANG, Jong Jun LEE, Woo Young LEE, Yoon Tae KIM
  • Publication number: 20240143173
    Abstract: A memory module includes a memory array, an interface and a controller. The memory array includes an array of memory cells and is configured as a dual in-line memory module (DIMM). The DIMM includes a plurality of connections that have been repurposed from a standard DIMM pin out configuration to interface operational status of the memory device to a host device. The interface is coupled to the memory array and the plurality of connections of the DIMM to interface the memory array to the host device. The controller is coupled to the memory array and the interface and controls at least one of a refresh operation of the memory array, control an error-correction operation of the memory array, control a memory scrubbing operation of the memory array, and control a wear-level control operation of the array, and the controller to interface with the host device.
    Type: Application
    Filed: January 9, 2024
    Publication date: May 2, 2024
    Inventors: Mu-Tien CHANG, Dimin NIU, Hongzhong ZHENG, Sun Young LIM, Indong KIM, Jangseok CHOI
  • Patent number: 11973584
    Abstract: This application relates to a noise signal generating apparatus. In one aspect, the apparatus includes a bandwidth expansion unit configured to generate a noise signal having a second bandwidth by expanding a noise source signal having a first bandwidth to the second bandwidth that is greater than the first bandwidth. The apparatus may also include a randomization unit configured to perform randomization and output the generated noise signal having the second bandwidth.
    Type: Grant
    Filed: July 15, 2021
    Date of Patent: April 30, 2024
    Assignee: Agency for Defense Development
    Inventors: Jaewon Chang, Jeong Ho Ryu, Joo Rae Park, Young Ju Park, Byeong Nam Lee
  • Patent number: 11969213
    Abstract: Provided are apparatuses, a non-transitory computer-readable medium or media, and methods for supporting predicting of vascular disease using a fundus image of a subject. In certain aspects, disclosed a method including the steps of: extracting a feature information from a first fundus image of the subject based on a machine learning model; generating a second fundus image having a feature which is corresponding to the feature information by mapping a saliency factor to the first fundus image; and displaying the first fundus image and the second fundus image on a display device.
    Type: Grant
    Filed: May 9, 2021
    Date of Patent: April 30, 2024
    Assignee: XAIMED CO., LTD.
    Inventors: Sang Min Park, Joo Young Chang, Choong Hee Lee, Il Hyung Shin
  • Publication number: 20240136244
    Abstract: Thermal heat spreaders and/or an IC die with solderable thermal structures may be assembled together with a solder array thermal interconnects. A thermal heat spreader may include a non-metallic material and one or more metallized surfaces suitable for bonding to a solder alloy employed as thermal interface material between the heat spreader and an IC die. An IC die may include a metallized back-side surface similarly suitable for bonding to a thermal interconnect comprising a solder alloy. Metallization on the IC die and/or heat spreader may comprise a plurality of solderable structures. A multi-chip package may include multiple IC die having different die thickness that are accommodated by a z-height thickness variation in the thermal interconnects and/or the solderable structures of the IC die or heat spreader.
    Type: Application
    Filed: December 22, 2023
    Publication date: April 25, 2024
    Applicant: Intel Corporation
    Inventors: Debendra Mallik, Je-Young Chang, Ram Viswanath, Elah Bozorg-Grayeli, Ahmad Al Mohammad
  • Publication number: 20240128274
    Abstract: An electronic device may include a display having an array of display pixels on a substrate. The display pixels may be organic light-emitting diode display pixels or display pixels in a liquid crystal display. In an organic light-emitting diode display, hybrid thin-film transistor structures may be formed that include semiconducting oxide thin-film transistors, silicon thin-film transistors, and capacitor structures. The capacitor structures may overlap the semiconducting oxide thin-film transistors. Organic light-emitting diode display pixels may have combinations of oxide and silicon transistors. In a liquid crystal display, display driver circuitry may include silicon thin-film transistor circuitry and display pixels may be based on oxide thin-film transistors. A single layer or two different layers of gate metal may be used in forming silicon transistor gates and oxide transistor gates. A silicon transistor may have a gate that overlaps a floating gate structure.
    Type: Application
    Filed: December 8, 2023
    Publication date: April 18, 2024
    Inventors: Vasudha Gupta, Jae Won Choi, Shih Chang Chang, Tsung-Ting Tsai, Young Bae Park
  • Publication number: 20240128494
    Abstract: A pouch type all-solid-state battery including a reference electrode is disclosed. In the all-solid-state battery, a potential variation of each electrode is accurately measured because the ion transfer path between the reference electrode and a positive electrode/negative electrode is short. Accordingly, the all-solid-state battery secures a desired cell performance while having battery specifications similar to actual battery specifications.
    Type: Application
    Filed: September 5, 2023
    Publication date: April 18, 2024
    Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION
    Inventors: Jae Ho Shin, Ji Chang Kim, Hyun Min Seo, Young Jin Nam, Ga Young Choi
  • Publication number: 20240130207
    Abstract: A display device includes a display panel, a filler layer, a reflection control layer, a plurality of light-blocking patterns, and an encapsulation substrate. The low reflection layer is disposed on the display panel. The filler layer is disposed on the display panel. The reflection control layer includes a first catalyst and is disposed on the filler layer. The plurality of light-blocking patterns is disposed between the filler layer and the reflection control layer. The encapsulation substrate is disposed on the reflection control layer.
    Type: Application
    Filed: May 1, 2023
    Publication date: April 18, 2024
    Inventors: HYEBEOM SHIN, DAEWON KIM, SU JEONG KIM, JONGHO SON, KYUNGHEE LEE, JINHYEONG LEE, SUN-YOUNG CHANG
  • Patent number: 11961775
    Abstract: In one example, a semiconductor device can comprise a substrate, a device stack, first and second internal interconnects, and an encapsulant. The substrate can comprise a first and second substrate sides opposite each other, a substrate outer sidewall between the first substrate side and the second substrate side, and a substrate inner sidewall defining a cavity between the first substrate side and the second substrate side. The device stack can be in the cavity and can comprise a first electronic device, and a second electronic device stacked on the first electronic device. The first internal interconnect can be coupled to the substrate and the device stack. The encapsulant can cover the substrate inner sidewall and the device stack and can fill the cavity. Other examples and related methods are disclosed herein.
    Type: Grant
    Filed: November 8, 2022
    Date of Patent: April 16, 2024
    Assignee: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Gyu Wan Han, Won Bae Bang, Ju Hyung Lee, Min Hwa Chang, Dong Joo Park, Jin Young Khim, Jae Yun Kim, Se Hwan Hong, Seung Jae Yu, Shaun Bowers, Gi Tae Lim, Byoung Woo Cho, Myung Jea Choi, Seul Bee Lee, Sang Goo Kang, Kyung Rok Park
  • Publication number: 20240119064
    Abstract: Disclosed herein is an apparatus and method for synchronizing a block in a blockchain network. The apparatus synchronizes node information of existing participating nodes connected to a blockchain network by joining the blockchain network, determines synchronization target blocks by calculating the current section of a blockchain using an agreed-upon block received from the existing participating nodes, receives a block header of each section and the segment hash table of a snapshot that are verification data for verifying synchronization target data for the synchronization target blocks from participating nodes that are not connected as peers, among the existing participating nodes, generates a snapshot by receiving snapshot segments and the blocks of the current section, which are the synchronization target data, from participating nodes connected as peers, among the existing participating nodes, verifies the snapshot generated from the snapshot segments, and synchronizes the verified snapshot.
    Type: Application
    Filed: October 10, 2023
    Publication date: April 11, 2024
    Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Young-Chang KIM, Jong-Choul YIM, Jin-Tae OH, Chang-Hyun LEE