Abstract: Thermal heat spreaders and/or an IC die with solderable thermal structures may be assembled together with a solder array thermal interconnects. A thermal heat spreader may include a non-metallic material and one or more metallized surfaces suitable for bonding to a solder alloy employed as thermal interface material between the heat spreader and an IC die. An IC die may include a metallized back-side surface similarly suitable for bonding to a thermal interconnect comprising a solder alloy. Metallization on the IC die and/or heat spreader may comprise a plurality of solderable structures. A multi-chip package may include multiple IC die having different die thickness that are accommodated by a z-height thickness variation in the thermal interconnects and/or the solderable structures of the IC die or heat spreader.

Abstract: A display panel includes a first substrate including a display area, in which a plurality of pixel areas is arranged, and a non-display area around the display area, a second substrate disposed opposite to the first substrate, a light emitting array disposed on the first substrate and including a plurality of light emitting elements corresponding to the plurality of pixel areas, a sealing layer disposed in the non-display area between the first substrate and the second substrate and bonding the first substrate and the second substrate to each other, a vacuum layer sealed by the sealing layer and defined between the light emitting array and the second substrate, and a reflection adjustment layer disposed on the second substrate and absorbing a portion of external light, where the reflection adjustment layer includes a plurality of protrusions protruding toward the light emitting array and exposed to the vacuum layer.

Abstract: A fuel cell vehicle includes a cell stack, a DC level converter, an output unit, a first switching unit disposed between a positive output terminal of the DC level converter and a positive input terminal of the output unit, a second switching unit disposed between a negative output terminal of the DC level converter and a negative input terminal of the output unit, a resistor and a third switching unit connected to each other in series between the positive output terminal of the DC level converter and the negative output terminal of the DC level converter, a fourth switching unit disposed between a contact point between the resistor and the third switching unit and the positive input terminal of the output unit, and a controller for controlling switching operation of the first, second, third and fourth switching units according to an operation mode.

Abstract: Provided is a device for injecting a fixed quantity of liquid medicine, to which a syringe may be mounted and which may inject the liquid medicine held in the syringe by a fixed quantity due to a user's pushing operation. The device for injecting the fixed quantity of liquid medicine is advantageous in that a user can operate the device with one hand to inject the fixed quantity of medicine into various areas, thus maximizing operability and convenience. Furthermore, the device is advantageous in that it is possible to maximize medicine delivery efficiency even when operated by a person who is not a medical staff not in a hospital but at home.

Abstract: An apparatus for measuring a concentration of a target gas includes: a gas sensor including a sensing layer having an electric resistance that changes by an oxidation reaction or a reduction reaction between gas molecules and the sensing layer; and a processor configured to, in response to the target gas being introduced along with air into the gas sensor, monitor a change of the electric resistance of the sensing layer and determine the concentration of the target gas by analyzing a shape of the change of the electric resistance.

Abstract: Embodiments include a cooling solution having a first array of fins, where the first array of fins extend vertically from the substrate, and where adjacent individual fins of the first array are separated from each other by a microchannel. A second array of fins extend vertically from the substrate, where a channel region is between the first array of fins and the second array of fins.

Abstract: Provided is a method for predicting and managing the temperature of an electronic circuit, which can trigger an alarm, block, or control by predicting in advance a temperature rise result due to heat before heat generation of the electronic circuit and components increases up to a risk level. The temperature prediction and management method is a method for predicting and managing the temperature of an electrical circuit unit including one or more circuits or components including: a detection unit for predicting and managing the heat of the electrical circuit unit; and a control/alarm unit for providing control or an alarm to the electrical circuit unit according to the operation of the detection unit, wherein the electrical circuit unit includes one or more thermistors, and the detection unit senses whether or not the electrical circuit unit is abnormally heated.

Abstract: An apparatus is disclosed that includes a duty cycle controller. The duty cycle controller includes a tuning circuit comprising a first field-effect transistor. The first field-effect transistor is configured to implement a capacitor. The duty cycle controller further includes an edge delay circuit. The edge delay circuit includes a second field-effect transistor that, when activated by an input clock signal of the duty cycle controller, is configured to connect a voltage source to an output clock signal of the duty cycle controller. The edge delay circuit further includes a third field-effect transistor that, when activated, is configured to connect the first field-effect transistor of the tuning circuit to the output clock signal.

Abstract: An apparatus is described. The apparatus includes a chamber to contain one or more electronic components, a first liquid and a second liquid. The electronics to be immersed in the second liquid. The first liquid having less density than the second liquid so that the first liquid floats above the second liquid. The first liquid to return second liquid molecules received from the second liquid back to the second liquid. The chamber comprising a first fluidic channel to drain the first liquid from the chamber while the second liquid is within the chamber.

Abstract: A stretchable circuit board according to an embodiment comprises: a substrate including one surface and the other surface opposite to the one surface; an electronic component disposed on the one surface of the substrate; and a wiring electrode disposed on the one surface of the substrate and connecting the electronic component, wherein the substrate includes an effective area, in which the electronic component is formed, and an ineffective area other than the effective area and includes a pattern part which is formed in the ineffective area and extends through the substrate from one surface to the other surface thereof.

Abstract: A method is described. The method includes repeatedly receiving information from one or more sensor circuits that are disposed within a coolant of an immersion cooling system, the one or more sensor circuits to detect one or more contaminants within the coolant. The method includes repeatedly processing the information. The method includes repeatedly keeping the one or more contaminants within acceptable levels within the coolant in response to the information by adjusting a valve setting that affects intake of the coolant to a filtration system of the immersion cooling system, and/or, adjusting a speed of a pump of the filtration system.

Abstract: Embodiments disclosed herein include electronic packages and thermal solutions for such electronic packages. In an embodiment, an electronic package comprises, a package substrate with a first surface, a second surface opposite from the first surface, and a sidewall surface connecting the first surface to the second surface. In an embodiment, the electronic package further comprises a heat spreader, where a first portion of the heat spreader is attached to the first surface of the package substrate and a second portion of the heat spreader is attached to the second surface of the package substrate. In an embodiment, a third portion of the heat spreader adjacent to the sidewall surface of the package substrate connects the first portion of the heat spreader to the second portion of the heat spreader.

Abstract: A method for manufacturing a PDMS device in accordance with an exemplary embodiment of the present invention surface treats the entire surface of a pattern with a thiol group (—SH), so that a hydrogel may be connected to the surface of the pattern by a covalent bond under ultraviolet rays. Therefore, a PDMS device manufactured by the above method has an advantage in that the shape thereof may be stably maintained without the swelling or desorption of a hydrogel even when an electrolyte is filled in a pattern.

Abstract: The present disclosure provides a composite wherein NaCl nanoparticles are uniformly dispersed on reduced graphene oxide (rGO), a positive electrode active material including the same, a sodium secondary battery including the same, and a method for preparing the same. The positive electrode active material according to the present disclosure has a structure wherein NaCl nanoparticles are uniformly dispersed on rGO in a one-step process through chemical self-assembly. Therefore, the positive electrode active material according to the present disclosure exhibits superior electrochemical properties with high capacity because the small NaCl particles are dispersed uniformly and is economically favorable because the preparation process is simple.

Abstract: The present disclosure relates to a cathode active material for a secondary battery, a cathode for a secondary battery including the same, a secondary battery including the cathode for a secondary battery and manufacturing methods thereof. More particularly, it is possible to obtain a secondary battery having excellent electrochemical characteristics by electrochemically inducing a structural phase change in the cathode active material of a secondary battery including NaCl as a cathode active material.

Abstract: A deposition mask according to an embodiment comprises: a metal plate including an Fe—Ni—based alloy and including a first surface and a second surface opposite to the first surface, wherein the metal plate comprises a through-hole including a small-area hole on the first surface of the metal plate and a large-area hole on the second surface of the metal plate, the compressive stress of the first surface is greater than that of the second surface, the tensile stress of the second surface is greater than that of the first surface, the metal plate is bent toward the second surface, and a height difference between the highest point and the lowest point of the first surface has a value equal to or less than 3 ?m.

Abstract: Embodiments include semiconductor packages. A semiconductor package includes dies on a package substrate, an integrated heat spreader (IHS) with a lid and sidewalls over the dies and package substrate, and a heatsink and a thermal interface material respectively on the IHS. The semiconductor package includes a vapor chamber defined by a surface of the package substrate and surfaces of the lid and sidewalls, and a wick layer in the vapor chamber. The wick layer is on the dies, package substrate, and IHS, where the vapor chamber has a vapor space defined by surfaces of the wick layer and lid of the IHS. The sidewalls are coupled to the package substrate with a sealant that hermetically seals the vapor chamber with the surfaces of the package substrate and the sidewalls and lid. The wick layer has a uniform or non-uniform thickness, and has porous materials including metals, powders, or graphite.

Abstract: Embodiments include semiconductor packages. A semiconductor package include a high-power electronic component and an embedded heat spreader (EHS) in a package substrate. The EHS is adjacent to the high-power electronic component. The semiconductor package includes a plurality of thermal interconnects below the EHS and the package substrate, and a plurality of dies on the package substrate. The thermal interconnects is coupled to the EHS. The EHS is below the high-power electronic component and embedded within the package substrate. The high-power electronic component has a bottom surface substantially proximate to a top surface of the EHS. The EHS is a copper heat sink, and the high-power electronic component is an air core inductor or a voltage regulator. The thermal interconnects are comprised of thermal ball grid array balls or thermal adhesive materials. The thermal interconnects couple a bottom surface of the package substrate to a top surface of a substrate.

Abstract: A heat exchange module, comprising an array of microchannels, where the array of microchannels extends in a first direction, and are separated from one another by a first sidewall. The array of microchannels is over a cold plate. A first array of fluid distribution channels is stacked over the array of microchannels and extend in a second direction that is substantially orthogonal to the first direction. The first array of fluid distribution channels extends from the first manifold and terminate between a first manifold and a second manifold. A second array of fluid distribution channels is stacked over the array of microchannels. The first array of fluid distribution channels and the second array of the fluid distribution channels are fluidically coupled to the microchannel array. A wall extends into the microchannel array below a second sidewall separating ones of the first array and ones of the second array of fluid distribution channels.

Abstract: A method for depositing a material from a solution to a surface is provided. The method includes depositing, through a deposition channel of a material depositor, the solution in a rich state to the surface, wherein the solution in the rich state includes an initial concentration of the material, onto a surface, applying a predefined electrical output, by the material depositor, through the deposited solution to adhere the material to the surface, and to yield the solution in a depleted state wherein the solution in the depleted state contains a different concentration of the material from the rich solution, and removing, through a removal channel in the material depositor, the deposited solution in the depleted state. The material depositor includes a hydrophilic region defined by a hydrophilic surface through which the material depositor conducts the depositing and the removing and a hydrophobic barrier circumscribing the hydrophilic region.