Patents by Inventor In-Bo Shim

In-Bo Shim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240128173
    Abstract: A semiconductor package includes a first package substrate having a first region and a second region, which do not overlap each other, a first connection element having a first height on the first region, a first semiconductor chip having a second height connected to the first connection element, a second connection element having a third height on the second region, a third connection element having a fourth height on the second connection element and electrically connected to the second connection element, a second package on the third connection element, the second package including a second package substrate and a second semiconductor chip, and a first mold layer covering at least a portion of the first semiconductor chip, covering at least a portion of the second connection element, covering the first package substrate, exposing upper surfaces of the first semiconductor chip and the second connection element, and having a fifth height.
    Type: Application
    Filed: May 19, 2023
    Publication date: April 18, 2024
    Inventors: Ji-Yong Park, Jong Bo Shim, Dae Hun Lee, Choong Bin Yim
  • Patent number: 11959612
    Abstract: A chromaticity variable type road projection lamp system applied to a vehicle is composed of a chromaticity variable lamp that radiates a road surface radiation content, which is generated by reflecting the lights emitted from a first projection light-emitting diode (LED) of a warm white color and a second projection LED of a cool white color disposed in the direction symmetrical to a DMD at the tilting angle, with a projection beam from a chromaticity variable road projection, and radiates the low beam by comparing the warm white color of the first lamp LED and the cool white color of the second lamp LED with the road surface radiation content in chromaticity.
    Type: Grant
    Filed: November 17, 2022
    Date of Patent: April 16, 2024
    Assignees: HYUNDAI MOTOR COMPANY, KIA CORPORATION
    Inventors: Byoung-Suk Ahn, Joon-Bo Shim
  • Publication number: 20240118426
    Abstract: An integrated lamp device for a vehicle includes a first light source module for lidar sensing and a second light source module for beam patterning installed in a single housing, thereby reducing an overall size. Further, an aiming adjustment is performed by a reflection unit separated from the light source modules, thereby stabilizing a structure and ensuring durability performance.
    Type: Application
    Filed: January 24, 2023
    Publication date: April 11, 2024
    Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION
    Inventor: Joon Bo Shim
  • Publication number: 20240120177
    Abstract: A substrate processing method is provided. The substrate processing method comprises loading a substrate onto a substrate support inside a chamber, forming a plasma inside the chamber, providing a first DC pulse signal to an electromagnet that generates a magnetic field inside the chamber and processing the substrate with the plasma, wherein the first DC pulse signal is repeated at a first period including a first section and a second section subsequent to the first section, the first DC pulse signal has a first level during the first section, and the first DC pulse signal has a second level different from the first level during the second section.
    Type: Application
    Filed: September 19, 2023
    Publication date: April 11, 2024
    Inventors: Ji Mo LEE, Dong Hyeon NA, Myeong Soo SHIN, Woong Jin CHEON, Kyung-Sun KIM, Jae Bin KIM, Tae-Hwa KIM, Seung Bo SHIM
  • Publication number: 20240105567
    Abstract: A semiconductor package includes a first package substrate having a first area and a second area that is distinct and separate from the first area, a first connection element disposed on the first area and having a first thickness, a first semiconductor chip connected to the first connection element, a second connection element disposed on the second area and having a second thickness that is greater than the first thickness, a third connection element disposed on the second connection element and electrically connected to the second connection element, a second package substrate disposed on the third connection element, and a second semiconductor chip disposed on the second package substrate.
    Type: Application
    Filed: August 23, 2023
    Publication date: March 28, 2024
    Inventors: Choong Bin YIM, Ji Yong PARK, Jong Bo SHIM
  • Publication number: 20240104300
    Abstract: The present invention relates to a method of generating a word embedding library, including: receiving, by a processor, original text composed of Hangul through an input interface; segmenting, by the processor, the original text by morpheme, combining segmented morphemes step by step according to a preset rule, and matching a tag to a combination of step-by-step morphemes according to a morphological attribute or a syntactic attribute of the combination of step-by-step morphemes; and generating, by the processor, a word embedding library by classifying the morphemes included in the original text based on the tag matched to the combination of step-by-step morphemes.
    Type: Application
    Filed: September 28, 2022
    Publication date: March 28, 2024
    Inventors: Sung Min KIM, Hye Won LIM, Yoon Bo SHIM, Yui HA, Yoon Seok CHOI
  • Publication number: 20240103651
    Abstract: A display device includes a first display area including a first pixel area; a second display area including a second pixel area and a transmissive area; a signal line, a common electrode, and a touch electrode that are disposed in the second display area. The common electrode includes an opening overlapping the transmissive area, and the common electrode is disposed between the signal line and the touch electrode to overlap the signal line.
    Type: Application
    Filed: November 27, 2023
    Publication date: March 28, 2024
    Applicant: Samsung Display Co., LTD.
    Inventors: Jin Ho JEONG, Myoung-Ho KWON, Ho Seok SON, Jin Bo SHIM
  • Publication number: 20240083342
    Abstract: Disclosed are an automatic leveling system and a method for a headlamp, which accurately detects whether a road is uphill or downhill, and a lateral gradient condition of the road. The system and method also automatically adjust a light radiating direction through the headlamp according to the road. Further, a sensor capable of scanning a road surface and a lamp module radiating light are integrated with each other, so a light irradiation position is accurately and rapidly adjusted according to a road condition, thus improving the accuracy and the reliability of the light irradiation position. Further, as the light irradiation position of a headlamp is adjusted by comparing image capturing information obtained through an image capturing device with sensing information obtained through a laser sensor, the deterioration of the aiming accuracy due to the mounting state of a camera is prevented.
    Type: Application
    Filed: January 23, 2023
    Publication date: March 14, 2024
    Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION
    Inventors: Joon Bo Shim, Young Ho Son, Jae Joon Park
  • Publication number: 20240067208
    Abstract: There is provided a VIL system-based autonomous driving function verification method. According to embodiments of the disclosure, a VIL system enables an autonomous vehicle to verify an autonomous driving function by interlocking with a virtual road environment in any other place, without having to go to a real test road corresponding to a simulated virtual road environment. Accordingly, an autonomous driving function can be rapidly verified based on a VIL system with respect to various virtual road environments without changing a driving place, so that speed and convenience in development of autonomous driving technology can be enhanced.
    Type: Application
    Filed: April 21, 2023
    Publication date: February 29, 2024
    Inventors: Young Bo SHIM, Kyoung Won MIN, Haeng Seon SON, Seon Young LEE, Chang Gue PARK
  • Patent number: 11908806
    Abstract: A semiconductor package includes a first substrate that includes a first insulating layer, a ground pattern in the first insulating layer, and a first conductive pattern; a first semiconductor chip placed on an upper surface of the first substrate; a ball array structure that is placed on the upper surface of the first substrate along a perimeter of the first semiconductor chip and is electrically connected to the ground pattern; and a shielding structure placed on the upper surface of the first semiconductor chip and in contact with the upper surface of the ball array structure. The ball array structure has a closed loop shape, and includes a solder ball portion and a connecting portion that connects adjacent solder ball portions. A maximum width of the solder ball portion is greater than a width of the connecting portion in a direction perpendicular to an extension direction of the connecting portion.
    Type: Grant
    Filed: October 14, 2021
    Date of Patent: February 20, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Dong Ho Kim, Ji Hwang Kim, Hwan Pil Park, Jong Bo Shim
  • Publication number: 20240055398
    Abstract: A semiconductor package includes a first substrate, a memory semiconductor package on a first surface of the first substrate, an adhesive layer between the first surface of the first substrate and the memory semiconductor package, a wire extending from an upper surface of the memory semiconductor package and connected to the first substrate, a logic semiconductor chip on the first surface of the first substrate, a first connection terminal between the first surface of the first substrate and the logic semiconductor chip, and a molding layer, wherein a first height of the memory semiconductor package is smaller than a second height of the logic semiconductor chip, and wherein an uppermost surface of the molding layer and the upper surface of the logic semiconductor chip are coplanar.
    Type: Application
    Filed: April 28, 2023
    Publication date: February 15, 2024
    Inventors: Choong Bin Yim, Ji-Yong Park, Jin-Woo Park, Jong Bo Shim
  • Patent number: 11900982
    Abstract: A semiconductor device may include: a first receiver configured to receive a chip select signal from a receiving node to which a termination resistor is coupled and configured to generate a first internal chip select signal; a command pulse generation circuit configured to generate a command pulse for entering into a self-refresh operation based on an internal command address and the first internal chip select signal; and an operation control circuit configured to, when the semiconductor device enters the self-refresh operation based on the command pulse, generate a resistor value change signal that adjusts the value of the termination resistor.
    Type: Grant
    Filed: March 15, 2022
    Date of Patent: February 13, 2024
    Assignee: SK hynix Inc.
    Inventors: Chang Hyun Kim, Seok Bo Shim
  • Publication number: 20240027890
    Abstract: A reflective mask used in an EUV exposure process includes a mask substrate, a reflective layer on the mask substrate, and an absorption layer on the reflective layer. The reflective mask includes a main region, an out-of-band region surrounding the main region, and an alignment mark region outside a periphery of the out-of-band region. The absorption layer in the alignment mark region includes an alignment mark and an anti-reflection pattern adjacent the alignment mark, and the anti-reflection pattern includes line-and-space patterns having a predetermined line width in the alignment mark region.
    Type: Application
    Filed: March 8, 2023
    Publication date: January 25, 2024
    Inventors: Hyungjong Bae, Hyun Jung Hwang, Heebom Kim, Seong-Bo Shim, Seungyoon Lee, Woo-Yong Jung, Chan Hwang
  • Patent number: 11874734
    Abstract: A method for operating a memory includes: performing an error check operation on first memory cells; performing an error check operation on second memory cells; detecting an error which is equal to or greater than a threshold value in a region including the first memory cells and the second memory cells; classifying the region as a bad region in response to the detection of an error which is equal to or greater than the threshold value; and performing an error check operation on the first memory cells and the second memory cells again in response to the classification of the bad region.
    Type: Grant
    Filed: June 23, 2022
    Date of Patent: January 16, 2024
    Assignee: SK hynix Inc.
    Inventors: Dae Suk Kim, Eung Bo Shim
  • Publication number: 20240011936
    Abstract: The present invention relates to a metal doped organic framework-based catalyst, and an oxygen sensing electrode using same, wherein the 3D oxygen sensing electrode is manufactured easily and quickly at a low cost by using a trace amount of noble metal, by means of a polymer/graphene/nanocatalyst composition prepared by 3D printing and nanocatalyst synthesis on the basis of a metal doped organic framework and the 3D oxygen sensing electrode is capable of selectively sensing gases and dissolved oxygen and exhibits long-term stability.
    Type: Application
    Filed: September 25, 2023
    Publication date: January 11, 2024
    Applicants: PUSAN NATIONAL UNIVERSITY INDUSTRY-UNIVERSITY COOPERATION FOUNDATION, NF CO.,Ltd
    Inventors: Yoon-Bo SHIM, Deog Su PARK, Sang Kon LEE, Jae Hoon LEE, Sang Hoon KIM
  • Publication number: 20240005197
    Abstract: Provided are a method and a system for generating an AI training hierarchical dataset including data acquisition context information. A GT dataset generation method according to an embodiment of the present disclosure includes: acquiring and storing vehicle data; acquiring and storing sensor data generated at a sensor installed in a vehicle; and generating and storing context information which is information regarding a context at a time when the data is acquired. Accordingly, in generating a GT descriptor, various contexts, conditions at the time when data is acquired may be made to be easily analyzed, classified on the GT descriptor through a hierarchical dataset, which hierarchically describes context information at the time when sensor data is acquired on the descriptor, so that an AI network is effectively trained, and eventually, has high recognition performance.
    Type: Application
    Filed: December 29, 2020
    Publication date: January 4, 2024
    Applicant: Korea Electronics Technology Institute
    Inventors: Kyoung Won MIN, Haeng Seon SON, Seon Young LEE, Young Bo SHIM, Chang Gue PARK
  • Patent number: 11850977
    Abstract: A device for folding a seat may include: a lower arm stopper fixed to a predetermined radial position with respect to a reclining hinge shaft of a seatback as a center; a lock plate configured to rotate about a rotation shaft as a center while being hooked to the lower arm stopper in a process of reclining forward together with the seatback with respect to the reclining hinge shaft as the center; and a folding link limited to rotate by being hooked to the lock plate and configured to make folding rotation together with the seatback with respect to a folding hinge shaft, as a center, located at a part above the reclining hinge shaft, by being released from being hooked to the lock plate according to the rotation of the lock plate.
    Type: Grant
    Filed: July 25, 2022
    Date of Patent: December 26, 2023
    Assignees: HYUNDAI MOTOR COMPANY, KIA CORPORATION, DAYOU A-TECH CO., LTD., DAEWON PRECISION INDUSTRIAL CO., LTD, HYUNDAI TRANSYS INC.
    Inventors: Sang Uk Yu, Seok Hwan Kim, Seon Hyeok Lee, Sung Young Bok, Seon Chae Na, Hae Won Lee, Ui Bo Shim, Dae Keon Jang, Ji Sung Bae
  • Patent number: 11850994
    Abstract: A leveling apparatus for a vehicle headlamp includes: a housing disposed at a front side of a vehicle; a light source module disposed in the housing to emit light; a tilting sensor disposed in the housing to detect an inclination degree of a road; a tilting means to tilt the light source module and the tilting sensor together; and a controller. The controller receives a signal detected by the tilting sensor and controls the tilting means based on the inclination degree of the road to adjust a light emission angle of the light source module. In addition, the tilting sensor operates until a sensed output of the tilting sensor reaches a normal range.
    Type: Grant
    Filed: May 6, 2022
    Date of Patent: December 26, 2023
    Assignees: HYUNDAI MOTOR COMPANY, KIA CORPORATION
    Inventors: Joon Bo Shim, Seung Pyo Hong
  • Publication number: 20230378787
    Abstract: A power supply apparatus may include a charging circuit configured to receive an external voltage and to generate a charging voltage by charging and discharging energy by switching according to a level of the charging voltage; an auxiliary power circuit configured to store an electric charge using the charging voltage; and a health monitoring circuit configured to determine a charging health state of the auxiliary power circuit by counting a number of switchings of the charging circuit during an interval in which the charging voltage rises to a first level from a second level, the determined charging health state being based on the number of switchings.
    Type: Application
    Filed: October 21, 2022
    Publication date: November 23, 2023
    Inventors: Su Il JIN, In Bo SHIM, Won Seob SONG, Jin Yeon WON
  • Publication number: 20230341102
    Abstract: A chromaticity variable type road projection lamp system applied to a vehicle is composed of a chromaticity variable lamp that radiates a road surface radiation content, which is generated by reflecting the lights emitted from a first projection light-emitting diode (LED) of a warm white color and a second projection LED of a cool white color disposed in the direction symmetrical to a DMD at the tilting angle, with a projection beam from a chromaticity variable road projection, and radiates the low beam by comparing the warm white color of the first lamp LED and the cool white color of the second lamp LED with the road surface radiation content in chromaticity.
    Type: Application
    Filed: November 17, 2022
    Publication date: October 26, 2023
    Inventors: Byoung-Suk Ahn, Joon-Bo Shim