Abstract: An image sensor package includes an image sensor chip on a package substrate, a logic chip on the package substrate and perpendicularly overlapping the image sensor chip, and a memory chip on the package substrate and perpendicularly overlapping the image sensor chip and logic chip. The logic chip processes a pixel signal output from the image sensor chip. The memory chip is electrically connected to the image sensor chip through a conductive wire and stores at least one of the pixel signal from the image sensor chip or a pixel signal processed by the logic chip. The memory chip receives the pixel signal output from the image sensor chip through the conductive wire and receives the pixel signal processed by the logic chip through the image sensor chip and the conductive wire.

Abstract: A memory system and a data processing system including the memory system may manage a plurality of memory devices. For example, the data processing system may categorize and analyze error information from the memory devices, acquire characteristic data from the memory devices and set operation modes of the memory devices based on the characteristic data, allocate the memory devices to a host workload, detect a defective memory device among the memory devices and efficiently recover the defective memory device.

Abstract: A plasma etching apparatus may include a first source electrode, a first bias electrode, and a second bias electrode configured to generate a plasma by supplying energy to a process gas injected into a chamber; and a controller. The controller may be configured to supply a first high-frequency RF power, a first low-frequency RF power, and a second low-frequency RF power to the chamber during a first period from a first time to a second time; ramp down and turn off the first high-frequency RF power to the chamber during a second period from the second time to a third time; and ramp down and turn off the first low-frequency RF power to the chamber during a third period from the second time to a fourth time different from the third time. The third period may be smaller than ½ of the first period and greater than the second period.

Abstract: A semiconductor package includes a first wiring structure which includes a first insulating layer, and a first wiring pad inside the first insulating layer, a first semiconductor chip on the first wiring structure, a second wiring structure on the first semiconductor chip, and a connecting member between the first wiring structure and the second wiring structure. The second wiring structure includes a second insulating layer and a plurality of second wiring pads in the second insulating layer which each directly contact one surface of the first semiconductor chip.

Abstract: A data processing system comprising: a memory system comprising a plurality of memory devices, each of which comprises a first error correction unit and a plurality of cell array regions each having a plurality of memory cells coupled in an array to a plurality of word lines and a plurality of bit lines; and a host comprising a second error correction unit for correcting an error of data transferred from the memory system, and suitable for generating error correction information on the error correction operation of the second error correction unit, setting error correcting strengths to the respective memory devices using the error correction information and log information, and performing counter-error operations on the respective memory devices according to the error correcting strengths.

Abstract: An image for communication with outside pedestrians is implemented by an afterimage effect by means of a cylindrical display installed at an upper end of a mobility vehicle, and visibility is ensured. In addition, the number of light sources for implementing the image is reduced, an overall size of a lighting device is reduced, and durability and reliability are improved because there is no direct mechanical contact.

Abstract: A semiconductor package is provided. A semiconductor package includes a wiring structure, which includes a first insulating layer and a first wiring pad inside the first insulating layer a semiconductor chip on the wiring structure, an interposer having one surface facing the semiconductor chip and including a second insulating layer and a second wiring pad inside the second insulating layer, a connecting member connecting the first wiring pad and the second wiring pad, a support member in the first recess and between the wiring structure and the interposer, and a mold layer covering the semiconductor chip. One surface of the wiring structure includes a first recess exposing at least a part of the first insulating layer.

Abstract: A semiconductor includes a lower structure, an upper structure on the lower structure, and a connection pattern between the lower structure and the upper structure. The connection pattern is configured to electrically connect the lower structure and the upper structure to each other. The lower structure includes a lower base and a first lower chip on the lower base. The first lower chip includes a chip bonding pad, a pad structure, and a heat sink structure. The connection pattern is connected to the upper structure and extends away from the upper structure to be connected to the pad structure. The pad structure has a thickness greater than a thickness of the chip bonding pad. At least a portion of the heat sink structure is at a same height level as at least a portion of the pad structure.

Abstract: A device for folding a seat may include: a lower arm stopper fixed to a predetermined radial position with respect to a reclining hinge shaft of a seatback as a center; a lock plate configured to rotate about a rotation shaft as a center while being hooked to the lower arm stopper in a process of reclining forward together with the seatback with respect to the reclining hinge shaft as the center; and a folding link limited to rotate by being hooked to the lock plate and configured to make folding rotation together with the seatback with respect to a folding hinge shaft, as a center, located at a part above the reclining hinge shaft, by being released from being hooked to the lock plate according to the rotation of the lock plate.

Abstract: A display device includes a first display area including a first pixel area; a second display area including a second pixel area and a transmissive area; a signal line, a common electrode, and a touch electrode that are disposed in the second display area. The common electrode includes an opening overlapping the transmissive area, and the common electrode is disposed between the signal line and the touch electrode to overlap the signal line.

Abstract: Plasma processing equipment includes a chuck stage for supporting a wafer and including a lower electrode, an upper electrode disposed on the chuck stage, an AC power supply which applies first to third signals having different magnitudes of frequencies to the upper electrode or the lower electrode, a dielectric ring which surrounds the chuck stage, an edge electrode located within the dielectric ring, and a resonance circuit connected to the edge electrode. The resonance circuit includes a filter circuit which allows only the third signal among the first to third signals to pass, and a series resonance circuit connected in series with the filter circuit and having a first coil and a first variable capacitor connected in series and grounded.

Abstract: A display image device includes a sensor in which when a surrounding object is detected through a scanning unit, an image display unit operates together with and the image for message delivery to an outside is implemented, so that Light Detection and Ranging (LiDAR) sensing function and image implementation may be integrated, a package may be reduced and a LiDAR sensing area may be secured.

Abstract: A leveling apparatus for a vehicle headlamp includes: a housing disposed at a front side of a vehicle; a light source module disposed in the housing to emit light; a tilting sensor disposed in the housing to detect an inclination degree of a road; a tilting means to tilt the light source module and the tilting sensor together; and a controller. The controller receives a signal detected by the tilting sensor and controls the tilting means based on the inclination degree of the road to adjust a light emission angle of the light source module. In addition, the tilting sensor operates until a sensed output of the tilting sensor reaches a normal range.

Abstract: The present invention relates to a structure for accelerating transdermal absorption, a manufacturing method thereof, and a cosmetic composition comprising the same, and the structure for accelerating transdermal absorption comprises an acicular body; a hydrophilic group binded to the acicular body; and a carrier binded to the hydrophilic group.

Abstract: A memory system and a data processing system including the memory system may manage a plurality of memory devices. For example, the data processing system may categorize and analyze error information from the memory devices, acquire characteristic data from the memory devices and set operation modes of the memory devices based on the characteristic data, allocate the memory devices to a host workload, detect a defective memory device among the memory devices and efficiently recover the defective memory device.

Abstract: Disclosed is a peroral endoscopic apparatus of a swallowable type, the peroral endoscopic apparatus including: at least one imaging unit configured to perform imaging of a human body digestive system and output image data; at least one ultrasonic unit configured to output ultrasonic data on a submucosal region of the digestive system and a peripheral organ located therearound; a magnetic unit configured to adjust a position, a posture, and a proceeding direction of the peroral endoscopic apparatus in response to an external magnetic force; a transceiving unit configured to transmit the image data and the ultrasonic data to an external device or receive an external control signal; a control unit configured to control the imaging unit and the ultrasonic unit to perform imaging of the digestive system and the submucosal region simultaneously or individually; and a power supply unit configured to supply power.

Abstract: A plasma processing apparatus includes; a chamber, a lower electrode disposed within the chamber and including a lower surface and an opposing upper surface configured to seat a wafer, an RF rod disposed on the lower surface of the lower electrode and extending in a vertical direction. The RF plate includes a first portion contacting the lower surface of the lower electrode, a second portion protruding from the first portion towards the RF rod, and a third portion extending from the second portion to connect the RF rod. A grounding electrode is spaced apart from the RF plate and at least partially surrounds a side wall of the RF rod and a side wall of the second portion of the RF plate. The grounding electrode includes a first grounding electrode facing each of the side wall of the RF rod and the second portion of the RF plate, and a second grounding electrode at least partially surrounding the first grounding electrode, and configured to horizontally rotate.

Abstract: There are provided a thermosetting resin composition for a semiconductor package and a prepreg and a metal clad laminate using the same. More particularly, there are provided a thermosetting resin composition for a semiconductor package capable of improving desmear characteristics by using a cyanate based ester resin and a benzoxazine resin in a thermosetting resin composition based on an epoxy resin and improving chemical resistance by using a slurry type filler to have high heat resistance and reliability, and a prepreg and a metal clad laminate using the same.