Abstract: A semiconductor package may include a package substrate, a stack die including a plurality of dies are stacked on the package substrate, a gap fill insulating layer on an upper surface of the stack die, a top dummy die on the gap fill insulating layer, and a molding portion surrounding the stack die having the top dummy die thereon.

Abstract: Disclosed herein is a program conversion apparatus, which converts a first program to which homomorphic encryption is not applied into a second program to which the homomorphic encryption is applied, including a memory, which stores a first library for configuring the first program and a second library for configuring the second program, and a processor configured to convert the first program into the second program through conversion between operations provided by the first and second libraries.

Abstract: The present invention relates to a cold wallet apparatus. The cold wallet apparatus includes a homomorphic encryption generation module configured to generate homomorphic encryption using personally identifiable sensitive information; a first authentication code extraction module configured to extract an authentication code from the homomorphic encryption; a second authentication code extraction module configured to extract an authentication code from physical unclonable function (PUF) information of the cold wallet apparatus; a private key generation module configured to combine the authentication code extracted from the homomorphic encryption and the authentication code extracted from the PUF information to generate a private key; and a transaction signature module configured to perform a transaction signature using a wallet account and a wallet address generated based on the private key.

Abstract: Disclosed is an image processing method including obtaining, from a first image, object information of an important object included in the first image, obtaining control information for image quality processing, and obtaining a second image by performing image quality processing on the important object from the first image based on the object information and user control information.

Abstract: A power converter includes a voltage conversion unit that provides a first driving voltage at a first output electrode by converting a power supply voltage in response to a first control signal, the voltage conversion unit being configured to provide a second driving voltage at a second output electrode by converting the power supply voltage after a short detection period, the voltage conversion unit being configured to shut down in response to a third control signal, and a short detection unit that generates the third control signal by comparing a magnitude of a voltage of the second output electrode with a magnitude of a reference voltage during the short detection period.

Abstract: A semiconductor package includes a buffer die, semiconductor chip stacks stacked on the buffer die, each of the semiconductor chip stacks including a plurality of first semiconductor chips and a second semiconductor chip on the plurality of first semiconductor chips, and a mold layer covering an upper surface of the buffer die and side surfaces of the semiconductor chip stacks. Each of the first semiconductor chips and the second semiconductor chip includes a wiring part including multilayer wirings, an upper connection structure on the wiring part and having a plurality of upper conductive pads and a lower connection structure under the wiring part and having a plurality of lower conductive pads, and the second semiconductor chip further includes a redistribution layer on the upper connection structure and having an insulating layer and a plurality of redistribution pads in the insulating layer.

Abstract: A semiconductor package includes a substrate, a first semiconductor chip disposed on the substrate, and a second semiconductor chip disposed on a top surface of the first semiconductor chip. The first semiconductor chip includes a conductive pattern disposed on the top surface of the first semiconductor chip and a first protective layer covering the top surface of the first semiconductor chip and at least partially surrounds the conductive pattern. The second semiconductor chip includes a first pad that contacts a first through electrode on a bottom surface of the second semiconductor chip. A second protective layer surrounds the first pad and covers the bottom surface of the second semiconductor chip. A third protection layer fills a first recess defined in the second protective layer to face the inside of the second protective layer. The first protective layer and the third protective layer contact each other.

Abstract: A radio frequency (RF) weak magnetic field detection sensor includes a ferromagnetic core, a pickup coil disposed to surround the ferromagnetic core, a substrate that includes an opening, a core pad connected to the ferromagnetic core and a coil pad connected to the pickup coil, and an insulating tube interposed between the ferromagnetic core and the pickup coil. The insulating tube includes a bobbin around which the pickup coil is wound, and a core hole formed to pass through the bobbin and configured to accommodate the ferromagnetic core.

Abstract: Disclosed are semiconductor packages and their fabrication methods. The semiconductor package comprises providing a semiconductor substrate, forming a semiconductor element on an active surface of the semiconductor substrate, forming in the semiconductor substrate through vias that extend from the active surface into the semiconductor substrate, forming a first pad layer on the active surface of the semiconductor substrate, performing a first planarization process on the first pad layer, performing on an inactive surface of the semiconductor substrate a thinning process to expose the through vias, forming a second pad layer on the inactive surface of the semiconductor substrate, performing a second planarization process on the second pad layer, and after the second planarization process, performing a third planarization process on the first pad layer.

Abstract: Disclosed is an accelerator which includes a first to a K-th stage performing an NTT (Number Theoretic Transform) operation of first input data including a polynomial of a homomorphic ciphertext, the first to K-th stages being connected in series, and a first assist circuit generating a first to a K-th enable signal based on a degree of the polynomial of the first input data. Each of the first to K-th stages performs a butterfly operation of the first input data or corresponding output data of a previous stage in response to that the corresponding enable signal among the first to K-th enable signals indicates a first logical value, and bypasses the first input data or the corresponding output data of the previous stage in response to that the corresponding enable signal among the first to K-th enable signals indicates a second logical value.

Abstract: An image processing apparatus applies an image to a first learning network model to optimize the edges of the image, applies the image to a second learning network model to optimize the texture of the image, and applies a first weight to the first image and a second weight to the second image based on information on the edge areas and the texture areas of the image to acquire an output image.

Abstract: An apparatus and method for transmitting and receiving magnetic field signals in a magnetic field communication system are provided. The apparatus includes a controller configured to generate a communication signal, matching units that are configured to receive the communication signal and that respectively correspond to different matching frequencies, and loop antennas that are connected to the matching units, respectively, and that are configured to convert communication signals according to the different matching frequencies into magnetic transmission signals in the form of magnetic field energy and to transmit the magnetic transmission signals.

Abstract: Disclosed is a homomorphic encryption calculating accelerator which includes a parallel processing unit performing a polynomial multiplication operation in parallel on a plurality of input data corresponding to a degree N polynomial of a homomorphic ciphertext and a combination unit generating a plurality of output data by performing the polynomial multiplication operation on an output of the parallel processing unit. The parallel processing unit includes a first parallel processing element performing the polynomial multiplication operation on first input data among the plurality of input data and a second parallel processing element performing the polynomial multiplication operation on second input data among the plurality of input data.

Abstract: A semiconductor package includes a redistribution substrate, a first memory chip provided on the redistribution substrate, the first memory chip comprising a first base layer, a first circuit layer provided on a top surface of the first base layer, and a first via penetrating the first base layer and connected to the first circuit layer and the redistribution substrate, a logic chip provided on the first memory chip, and a first molding layer surrounding the first memory chip. An outer side surface of the first molding layer is coplanar with a side surface of the logic chip. At an interface of the logic chip and the first memory chip, a first chip pad provided in the first circuit layer of the first memory chip and a second chip pad of the logic chip are formed of the same material and constitute one body.

Abstract: Disclosed is an accelerator device, which includes a first NTT converter that performs an NTT operation on a first ciphertext of a first type to generate a first internal signal, a test polynomial generator that generates a test polynomial, a second NTT converter that performs the NTT operation on the test polynomial to generate a second internal signal, a first multiplier that performs a multiplication on the first internal signal and the second internal signal to generate a third internal signal, a first INTT converter that performs an INTT operation on the third internal signal to generate a fourth internal signal, a gadget decomposer that performs a gadget decomposition on the fourth internal signal to generate a fifth internal signal, and a third NTT converter that performs the NTT operation on the fifth internal signal to generate a sixth internal signal.

Abstract: A semiconductor package includes a substrate including a first semiconductor chip including a first wiring structure, a first bonding pad, and a first alignment key on the first wiring structure to be spaced apart in a first direction, a second semiconductor chip including a second wiring structure, a second bonding pad on the second wiring structure and connected to the first bonding pad, and a second alignment key on the second wiring structure to be spaced apart from the second bonding pad and not overlapping the first alignment key in the second direction, the first wiring structure including a first wiring pattern connected to the first bonding pad and not overlapping the first and second alignment keys in the second direction, and the second wiring structure including a second wiring pattern connected to the second bonding pad and not overlapping the first and second alignment keys in the second direction.

Abstract: A semiconductor package includes a redistribution substrate, a first memory chip provided on the redistribution substrate, the first memory chip comprising a first base layer, a first circuit layer provided on a top surface of the first base layer, and a first via penetrating the first base layer and connected to the first circuit layer and the redistribution substrate, a logic chip provided on the first memory chip, and a first molding layer surrounding the first memory chip. An outer side surface of the first molding layer is coplanar with a side surface of the logic chip. At an interface of the logic chip and the first memory chip, a first chip pad provided in the first circuit layer of the first memory chip and a second chip pad of the logic chip are formed of the same material and constitute one body.

Abstract: A power converter includes a voltage conversion unit that provides a first driving voltage at a first output electrode by converting a power supply voltage in response to a first control signal, the voltage conversion unit being configured to provide a second driving voltage at a second output electrode by converting the power supply voltage after a short detection period, the voltage conversion unit being configured to shut down in response to a third control signal, and a short detection unit that generates the third control signal by comparing a magnitude of a voltage of the second output electrode with a magnitude of a reference voltage during the short detection period.

Abstract: A semiconductor package includes a substrate including a first semiconductor chip including a first wiring structure, a first bonding pad, and a first alignment key on the first wiring structure to be spaced apart in a first direction, a second semiconductor chip including a second wiring structure, a second bonding pad on the second wiring structure and connected to the first bonding pad, and a second alignment key on the second wiring structure to be spaced apart from the second bonding pad and not overlapping the first alignment key in the second direction, the first wiring structure including a first wiring pattern connected to the first bonding pad and not overlapping the first and second alignment keys in the second direction, and the second wiring structure including a second wiring pattern connected to the second bonding pad and not overlapping the first and second alignment keys in the second direction.

Abstract: A radio frequency (RF) weak magnetic field detection sensor includes a ferromagnetic core, a pickup coil disposed to surround the ferromagnetic core, a substrate that includes an opening, a core pad connected to the ferromagnetic core and a coil pad connected to the pickup coil, and an insulating tube interposed between the ferromagnetic core and the pickup coil. The insulating tube includes a bobbin around which the pickup coil is wound, and a core hole formed to pass through the bobbin and configured to accommodate the ferromagnetic core.