Patents by Inventor Inderjit Singh
Inderjit Singh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20240104020Abstract: A data analysis system to analyze data. The data analysis system includes a data buffer configured to receive data to be analyzed. The data analysis system also includes a state machine lattice. The state machine lattice includes multiple data analysis elements and each data analysis element includes multiple memory cells configured to analyze at least a portion of the data and to output a result of the analysis. The data analysis system includes a buffer interface configured to receive the data from the data buffer and to provide the data to the state machine lattice.Type: ApplicationFiled: December 4, 2023Publication date: March 28, 2024Inventors: David R. Brown, Harold B. Noyes, Inderjit Singh Bains
-
Patent number: 11875237Abstract: Systems, computer-implemented methods, and non-transitory computer readable media are provided for sharing medical data. The disclosed systems may be configured to create a first workgroup having a first knowledgebase. This first knowledgebase may be federated with a common knowledgebase, and with a second knowledgebase of a second workgroup. At least one of the first knowledgebase, common knowledgebase, and second knowledgebase may be configured to store data items comprising associations, signs, and evidence. The signs may comprise measurements and contexts, and the associations may describe the relationships between the measurements and contexts. The evidence may support these associations. The disclosed systems may be configured to receive a request from a user in the first workgroup, retrieve matching data items, and optionally then output to the user at least some of the retrieved matching data items. The request may comprise at least one of a first association and a first measurement.Type: GrantFiled: February 7, 2022Date of Patent: January 16, 2024Assignee: Illumina, Inc.Inventors: Kai-How Farh, Donavan Cheng, John Casey Shon, Jorg Hakenberg, Eugene Bolotin, James Geaney, Hong Gao, Pam Cheng, Inderjit Singh, Daniel Roche, Milan Karangutkar
-
Publication number: 20230411325Abstract: A chip package and method for fabricating the same are provided that includes hybrid bonds between a substrate and integrated circuit devices. In one example, a chip package includes a plurality of integrated circuit (IC) devices mounted on a substrate. The substrate has a die side and a ball side. The die side of the substrate includes a plurality of exposed metal bond pads. Each IC device has a device body. Functional circuitry is formed in the device body, terminating at a plurality of exposed metal bond pads. The plurality of exposed metal bond pads are hybrid bonded to the plurality of exposed metal bond pads.Type: ApplicationFiled: June 15, 2022Publication date: December 21, 2023Inventors: Inderjit SINGH, Shih-Yen CHEN, Yi-Ting CHEN
-
Patent number: 11836081Abstract: A data analysis system to analyze data. The data analysis system includes a data buffer configured to receive data to be analyzed. The data analysis system also includes a state machine lattice. The state machine lattice includes multiple data analysis elements and each data analysis element includes multiple memory cells configured to analyze at least a portion of the data and to output a result of the analysis. The data analysis system includes a buffer interface configured to receive the data from the data buffer and to provide the data to the state machine lattice.Type: GrantFiled: January 22, 2021Date of Patent: December 5, 2023Assignee: Micron Technology, Inc.Inventors: David R. Brown, Harold B Noyes, Inderjit Singh Bains
-
Patent number: 11741014Abstract: A data analysis system to analyze data. The data analysis system includes a data buffer configured to receive data to be analyzed. The data analysis system also includes a state machine lattice. The state machine lattice includes multiple data analysis elements and each data analysis element includes multiple memory cells configured to analyze at least a portion of the data and to output a result of the analysis. The data analysis system includes a buffer interface configured to receive the data from the data buffer and to provide the data to the state machine lattice.Type: GrantFiled: November 2, 2022Date of Patent: August 29, 2023Assignee: Micron Technology, Inc.Inventors: David R. Brown, Harold B Noyes, Inderjit Singh Bains
-
Publication number: 20230048032Abstract: A data analysis system to analyze data. The data analysis system includes a data buffer configured to receive data to be analyzed. The data analysis system also includes a state machine lattice. The state machine lattice includes multiple data analysis elements and each data analysis element includes multiple memory cells configured to analyze at least a portion of the data and to output a result of the analysis. The data analysis system includes a buffer interface configured to receive the data from the data buffer and to provide the data to the state machine lattice.Type: ApplicationFiled: November 2, 2022Publication date: February 16, 2023Inventors: David R. Brown, Harold B. Noyes, Inderjit Singh Bains
-
Publication number: 20220343429Abstract: A method for facilitating automated event management by using captured data is provided. The method includes capturing raw data from a source, the raw data corresponding to an agreement; converting the captured raw data into an event data set, the event data set including information that relates to an occurrence of an event; retrieving a set of rules that corresponds to the agreement; generating a chronological representation of the agreement based on the event data set and the retrieved set of rules; and determining an action based on the event data set, the retrieved set of rules, and the generated chronological representation.Type: ApplicationFiled: April 23, 2021Publication date: October 27, 2022Applicant: JPMorgan Chase Bank, N.A.Inventors: Srinivasa R. YENAMADALA, Inderjit Singh AHLUWALIA, Debraj MAJUMDAR
-
Publication number: 20220193181Abstract: The present disclosure provides methods for the treatment or prevention of SARS-Cov-2 infection or disease and IL-6 mediated immune/autoimmune and cancers by the administration of GSNO or GSNO reductase inhibitor.Type: ApplicationFiled: December 21, 2021Publication date: June 23, 2022Applicant: MUSC FOUNDATION FOR RESEARCH DEVELOPMENTInventors: Inderjit Singh, Avtar K. Singh
-
Publication number: 20220164710Abstract: Systems, computer-implemented methods, and non-transitory computer readable media are provided for sharing medical data. The disclosed systems may be configured to create a first workgroup having a first knowledgebase. This first knowledgebase may be federated with a common knowledgebase, and with a second knowledgebase of a second workgroup. At least one of the first knowledgebase, common knowledgebase, and second knowledgebase may be configured to store data items comprising associations, signs, and evidence. The signs may comprise measurements and contexts, and the associations may describe the relationships between the measurements and contexts. The evidence may support these associations. The disclosed systems may be configured to receive a request from a user in the first workgroup, retrieve matching data items, and optionally then output to the user at least some of the retrieved matching data items. The request may comprise at least one of a first association and a first measurement.Type: ApplicationFiled: February 7, 2022Publication date: May 26, 2022Inventors: Kai-How Farh, Donavan Cheng, John Casey Shon, Jorg Hakenberg, Eugene Bolotin, James Geaney, Hong Gao, Pam Cheng, Inderjit Singh, Daniel Roche, Milan Karangutkar
-
Publication number: 20220086260Abstract: A USB-to-coaxial network bridging system and method includes receiving data frames from a USB or FireWire device via a corresponding USB or FireWire communication interface, wherein the received data frames are intended for transmittal to a predetermined remote device on a coaxial network; combining the received data frames into an aggregated frame and addressing the aggregated frame to allow the aggregated frame to be routed to the predetermined remote device on the coaxial network; and sending the aggregated frame to the remote device over the coaxial network.Type: ApplicationFiled: September 30, 2021Publication date: March 17, 2022Inventors: Inderjit Singh, Branislav Petrovic
-
Patent number: 11244246Abstract: Systems, computer-implemented methods, and non-transitory computer readable media are provided for sharing medical data. The disclosed systems may be configured to create a first workgroup having a first knowledgebase. This first knowledgebase may be federated with a common knowledgebase, and with a second knowledgebase of a second workgroup. At least one of the first knowledgebase, common knowledgebase, and second knowledgebase may be configured to store data items comprising associations, signs, and evidence. The signs may comprise measurements and contexts, and the associations may describe the relationships between the measurements and contexts. The evidence may support these associations. The disclosed systems may be configured to receive a request from a user in the first workgroup, retrieve matching data items, and optionally then output to the user at least some of the retrieved matching data items. The request may comprise at least one of a first association and a first measurement.Type: GrantFiled: February 24, 2020Date of Patent: February 8, 2022Assignee: ILLUMINA, INC.Inventors: Kai-How Farh, Donavan Cheng, John Shon, Jorg Hakenberg, Eugene Bolotin, James Casey Geaney, Hong Gao, Pam Cheng, Inderjit Singh, Daniel Roche, Milan Karangutkar
-
Patent number: 11201095Abstract: A chip package and method for fabricating the same are provided which utilize a cover having one or more windows formed through one or more sidewalls to provide excellent resistance to warpage while allowing access to an internal volume of the chip package. In one example, the chip package includes a package substrate, an integrated circuit (IC) die, and a cover disposed over the IC die. The cover includes a lower surface facing the IC die, an upper surface facing away from the IC die, a lip extending from the lower surface, and a first sidewall extending from a first edge of the upper surface to the bottom of the lip. The lip is secured to the package substrate and encloses a volume between the lower surface and the package substrate. The IC die resides in the volume. A first elongated window is formed through the first sidewall and exposes the volume through the cover.Type: GrantFiled: August 23, 2019Date of Patent: December 14, 2021Assignee: XILINX, INC.Inventors: Ronilo Boja, Inderjit Singh, Gerilyn Maloney, Chandan Bhat
-
Patent number: 11153415Abstract: A USB-to-coaxial network bridging system and method includes receiving data frames from a USB or FireWire device via a corresponding USB or FireWire communication interface, wherein the received data frames are intended for transmittal to a predetermined remote device on a coaxial network; combining the received data frames into an aggregated frame and addressing the aggregated frame to allow the aggregated frame to be routed to the predetermined remote device on the coaxial network; and sending the aggregated frame to the remote device over the coaxial network.Type: GrantFiled: June 4, 2019Date of Patent: October 19, 2021Assignee: Entropic Communications, LLCInventors: Inderjit Singh, Branislav Petrovic
-
Patent number: 11075117Abstract: Techniques for singulating dies from a respective workpiece and for incorporating one or more singulated die into a stacked device structure are described herein. In some examples, singulating a die from a workpiece includes chemically etching the workpiece in a scribe line. In some examples, singulating a die from a workpiece includes mechanically dicing the workpiece in a scribe line and forming a liner along a sidewall of the die. The die can be incorporated into a stacked device structure. The die can be attached to a substrate along with another die that is attached to the substrate. An encapsulant can be between each die and the substrate and laterally between the dies.Type: GrantFiled: February 26, 2018Date of Patent: July 27, 2021Assignee: Xilinx, Inc.Inventors: Ganesh Hariharan, Raghunandan Chaware, Inderjit Singh
-
Publication number: 20210149810Abstract: A data analysis system to analyze data. The data analysis system includes a data buffer configured to receive data to be analyzed. The data analysis system also includes a state machine lattice. The state machine lattice includes multiple data analysis elements and each data analysis element includes multiple memory cells configured to analyze at least a portion of the data and to output a result of the analysis. The data analysis system includes a buffer interface configured to receive the data from the data buffer and to provide the data to the state machine lattice.Type: ApplicationFiled: January 22, 2021Publication date: May 20, 2021Inventors: David R. Brown, Harold B. Noyes, Inderjit Singh Bains
-
Patent number: 10925858Abstract: The present disclosure provides methods for the treatment of neurological deficits by the administration of GSNO or GSNO reductase inhibitor. Further provided herein are methods of treating autoimmune diseases by administering GSNO or GSNO reductase inhibitor.Type: GrantFiled: May 8, 2018Date of Patent: February 23, 2021Assignees: The US Government as Represented by the Department of Veterans Affairs, MUSC Foundation for Research DevelopmentInventors: Inderjit Singh, Avtar K. Singh
-
Patent number: 10915450Abstract: A data analysis system to analyze data. The data analysis system includes a data buffer configured to receive data to be analyzed. The data analysis system also includes a state machine lattice. The state machine lattice includes multiple data analysis elements and each data analysis element includes multiple memory cells configured to analyze at least a portion of the data and to output a result of the analysis. The data analysis system includes a buffer interface configured to receive the data from the data buffer and to provide the data to the state machine lattice.Type: GrantFiled: July 16, 2019Date of Patent: February 9, 2021Assignee: Micron Technology, Inc.Inventors: David R. Brown, Harold B Noyes, Inderjit Singh Bains
-
Publication number: 20200380412Abstract: Systems, computer-implemented methods, and non-transitory computer readable media are provided for sharing medical data. The disclosed systems may be configured to create a first workgroup having a first knowledgebase. This first knowledgebase may be federated with a common knowledgebase, and with a second knowledgebase of a second workgroup. At least one of the first knowledgebase, common knowledgebase, and second knowledgebase may be configured to store data items comprising associations, signs, and evidence. The signs may comprise measurements and contexts, and the associations may describe the relationships between the measurements and contexts. The evidence may support these associations. The disclosed systems may be configured to receive a request from a user in the first workgroup, retrieve matching data items, and optionally then output to the user at least some of the retrieved matching data items. The request may comprise at least one of a first association and a first measurement.Type: ApplicationFiled: February 24, 2020Publication date: December 3, 2020Inventors: Kai-How FARH, Donavan CHENG, John SHON, Jorg HAKENBERG, Eugene BOLOTIN, James Casey GEANEY, Hong GAO, Pam CHENG, Inderjit SINGH, Daniel ROCHE, Milan KARANGUTKAR
-
Patent number: 10840192Abstract: A chip package assembly and method for fabricating the same are provided which utilize a stiffener to improve a package substrate against out of plane deformation. In one example, a chip package assembly is provided that includes a package substrate, at least one integrated circuit (IC) die and a stiffener. The package substrate has a first surface and a second surface coupled by a side wall. The at least one IC die is disposed on the first surface of the package substrate. The stiffener is disposed outward of the at least one IC die. The stiffener has a first surface disposed outward of and bonded to the side wall of the package substrate. The stiffener has a second surface bonded to at least one of the first and second surfaces of the package substrate.Type: GrantFiled: April 6, 2017Date of Patent: November 17, 2020Assignee: XILINX, INC.Inventors: Nael Zohni, Shin S. Low, Inderjit Singh, Raghunandan Chaware, Ganesh Hariharan
-
Publication number: 20200293804Abstract: An automaton is implemented in a state machine engine. The automaton is configured to observe data from a beginning of an input data stream until a point when an end of data (EOD) signal is seen. Additionally the automaton is configured to report an event only when one and only one occurrence of a target symbol is seen in the input data stream.Type: ApplicationFiled: May 28, 2020Publication date: September 17, 2020Inventors: Harold B Noyes, Michael C. Leventhal, Jeffery M. Tanner, Inderjit Singh Bains