Patents by Inventor Inderjit Singh

Inderjit Singh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240104020
    Abstract: A data analysis system to analyze data. The data analysis system includes a data buffer configured to receive data to be analyzed. The data analysis system also includes a state machine lattice. The state machine lattice includes multiple data analysis elements and each data analysis element includes multiple memory cells configured to analyze at least a portion of the data and to output a result of the analysis. The data analysis system includes a buffer interface configured to receive the data from the data buffer and to provide the data to the state machine lattice.
    Type: Application
    Filed: December 4, 2023
    Publication date: March 28, 2024
    Inventors: David R. Brown, Harold B. Noyes, Inderjit Singh Bains
  • Patent number: 11875237
    Abstract: Systems, computer-implemented methods, and non-transitory computer readable media are provided for sharing medical data. The disclosed systems may be configured to create a first workgroup having a first knowledgebase. This first knowledgebase may be federated with a common knowledgebase, and with a second knowledgebase of a second workgroup. At least one of the first knowledgebase, common knowledgebase, and second knowledgebase may be configured to store data items comprising associations, signs, and evidence. The signs may comprise measurements and contexts, and the associations may describe the relationships between the measurements and contexts. The evidence may support these associations. The disclosed systems may be configured to receive a request from a user in the first workgroup, retrieve matching data items, and optionally then output to the user at least some of the retrieved matching data items. The request may comprise at least one of a first association and a first measurement.
    Type: Grant
    Filed: February 7, 2022
    Date of Patent: January 16, 2024
    Assignee: Illumina, Inc.
    Inventors: Kai-How Farh, Donavan Cheng, John Casey Shon, Jorg Hakenberg, Eugene Bolotin, James Geaney, Hong Gao, Pam Cheng, Inderjit Singh, Daniel Roche, Milan Karangutkar
  • Publication number: 20230411325
    Abstract: A chip package and method for fabricating the same are provided that includes hybrid bonds between a substrate and integrated circuit devices. In one example, a chip package includes a plurality of integrated circuit (IC) devices mounted on a substrate. The substrate has a die side and a ball side. The die side of the substrate includes a plurality of exposed metal bond pads. Each IC device has a device body. Functional circuitry is formed in the device body, terminating at a plurality of exposed metal bond pads. The plurality of exposed metal bond pads are hybrid bonded to the plurality of exposed metal bond pads.
    Type: Application
    Filed: June 15, 2022
    Publication date: December 21, 2023
    Inventors: Inderjit SINGH, Shih-Yen CHEN, Yi-Ting CHEN
  • Patent number: 11836081
    Abstract: A data analysis system to analyze data. The data analysis system includes a data buffer configured to receive data to be analyzed. The data analysis system also includes a state machine lattice. The state machine lattice includes multiple data analysis elements and each data analysis element includes multiple memory cells configured to analyze at least a portion of the data and to output a result of the analysis. The data analysis system includes a buffer interface configured to receive the data from the data buffer and to provide the data to the state machine lattice.
    Type: Grant
    Filed: January 22, 2021
    Date of Patent: December 5, 2023
    Assignee: Micron Technology, Inc.
    Inventors: David R. Brown, Harold B Noyes, Inderjit Singh Bains
  • Patent number: 11741014
    Abstract: A data analysis system to analyze data. The data analysis system includes a data buffer configured to receive data to be analyzed. The data analysis system also includes a state machine lattice. The state machine lattice includes multiple data analysis elements and each data analysis element includes multiple memory cells configured to analyze at least a portion of the data and to output a result of the analysis. The data analysis system includes a buffer interface configured to receive the data from the data buffer and to provide the data to the state machine lattice.
    Type: Grant
    Filed: November 2, 2022
    Date of Patent: August 29, 2023
    Assignee: Micron Technology, Inc.
    Inventors: David R. Brown, Harold B Noyes, Inderjit Singh Bains
  • Publication number: 20230048032
    Abstract: A data analysis system to analyze data. The data analysis system includes a data buffer configured to receive data to be analyzed. The data analysis system also includes a state machine lattice. The state machine lattice includes multiple data analysis elements and each data analysis element includes multiple memory cells configured to analyze at least a portion of the data and to output a result of the analysis. The data analysis system includes a buffer interface configured to receive the data from the data buffer and to provide the data to the state machine lattice.
    Type: Application
    Filed: November 2, 2022
    Publication date: February 16, 2023
    Inventors: David R. Brown, Harold B. Noyes, Inderjit Singh Bains
  • Publication number: 20220343429
    Abstract: A method for facilitating automated event management by using captured data is provided. The method includes capturing raw data from a source, the raw data corresponding to an agreement; converting the captured raw data into an event data set, the event data set including information that relates to an occurrence of an event; retrieving a set of rules that corresponds to the agreement; generating a chronological representation of the agreement based on the event data set and the retrieved set of rules; and determining an action based on the event data set, the retrieved set of rules, and the generated chronological representation.
    Type: Application
    Filed: April 23, 2021
    Publication date: October 27, 2022
    Applicant: JPMorgan Chase Bank, N.A.
    Inventors: Srinivasa R. YENAMADALA, Inderjit Singh AHLUWALIA, Debraj MAJUMDAR
  • Publication number: 20220193181
    Abstract: The present disclosure provides methods for the treatment or prevention of SARS-Cov-2 infection or disease and IL-6 mediated immune/autoimmune and cancers by the administration of GSNO or GSNO reductase inhibitor.
    Type: Application
    Filed: December 21, 2021
    Publication date: June 23, 2022
    Applicant: MUSC FOUNDATION FOR RESEARCH DEVELOPMENT
    Inventors: Inderjit Singh, Avtar K. Singh
  • Publication number: 20220164710
    Abstract: Systems, computer-implemented methods, and non-transitory computer readable media are provided for sharing medical data. The disclosed systems may be configured to create a first workgroup having a first knowledgebase. This first knowledgebase may be federated with a common knowledgebase, and with a second knowledgebase of a second workgroup. At least one of the first knowledgebase, common knowledgebase, and second knowledgebase may be configured to store data items comprising associations, signs, and evidence. The signs may comprise measurements and contexts, and the associations may describe the relationships between the measurements and contexts. The evidence may support these associations. The disclosed systems may be configured to receive a request from a user in the first workgroup, retrieve matching data items, and optionally then output to the user at least some of the retrieved matching data items. The request may comprise at least one of a first association and a first measurement.
    Type: Application
    Filed: February 7, 2022
    Publication date: May 26, 2022
    Inventors: Kai-How Farh, Donavan Cheng, John Casey Shon, Jorg Hakenberg, Eugene Bolotin, James Geaney, Hong Gao, Pam Cheng, Inderjit Singh, Daniel Roche, Milan Karangutkar
  • Publication number: 20220086260
    Abstract: A USB-to-coaxial network bridging system and method includes receiving data frames from a USB or FireWire device via a corresponding USB or FireWire communication interface, wherein the received data frames are intended for transmittal to a predetermined remote device on a coaxial network; combining the received data frames into an aggregated frame and addressing the aggregated frame to allow the aggregated frame to be routed to the predetermined remote device on the coaxial network; and sending the aggregated frame to the remote device over the coaxial network.
    Type: Application
    Filed: September 30, 2021
    Publication date: March 17, 2022
    Inventors: Inderjit Singh, Branislav Petrovic
  • Patent number: 11244246
    Abstract: Systems, computer-implemented methods, and non-transitory computer readable media are provided for sharing medical data. The disclosed systems may be configured to create a first workgroup having a first knowledgebase. This first knowledgebase may be federated with a common knowledgebase, and with a second knowledgebase of a second workgroup. At least one of the first knowledgebase, common knowledgebase, and second knowledgebase may be configured to store data items comprising associations, signs, and evidence. The signs may comprise measurements and contexts, and the associations may describe the relationships between the measurements and contexts. The evidence may support these associations. The disclosed systems may be configured to receive a request from a user in the first workgroup, retrieve matching data items, and optionally then output to the user at least some of the retrieved matching data items. The request may comprise at least one of a first association and a first measurement.
    Type: Grant
    Filed: February 24, 2020
    Date of Patent: February 8, 2022
    Assignee: ILLUMINA, INC.
    Inventors: Kai-How Farh, Donavan Cheng, John Shon, Jorg Hakenberg, Eugene Bolotin, James Casey Geaney, Hong Gao, Pam Cheng, Inderjit Singh, Daniel Roche, Milan Karangutkar
  • Patent number: 11201095
    Abstract: A chip package and method for fabricating the same are provided which utilize a cover having one or more windows formed through one or more sidewalls to provide excellent resistance to warpage while allowing access to an internal volume of the chip package. In one example, the chip package includes a package substrate, an integrated circuit (IC) die, and a cover disposed over the IC die. The cover includes a lower surface facing the IC die, an upper surface facing away from the IC die, a lip extending from the lower surface, and a first sidewall extending from a first edge of the upper surface to the bottom of the lip. The lip is secured to the package substrate and encloses a volume between the lower surface and the package substrate. The IC die resides in the volume. A first elongated window is formed through the first sidewall and exposes the volume through the cover.
    Type: Grant
    Filed: August 23, 2019
    Date of Patent: December 14, 2021
    Assignee: XILINX, INC.
    Inventors: Ronilo Boja, Inderjit Singh, Gerilyn Maloney, Chandan Bhat
  • Patent number: 11153415
    Abstract: A USB-to-coaxial network bridging system and method includes receiving data frames from a USB or FireWire device via a corresponding USB or FireWire communication interface, wherein the received data frames are intended for transmittal to a predetermined remote device on a coaxial network; combining the received data frames into an aggregated frame and addressing the aggregated frame to allow the aggregated frame to be routed to the predetermined remote device on the coaxial network; and sending the aggregated frame to the remote device over the coaxial network.
    Type: Grant
    Filed: June 4, 2019
    Date of Patent: October 19, 2021
    Assignee: Entropic Communications, LLC
    Inventors: Inderjit Singh, Branislav Petrovic
  • Patent number: 11075117
    Abstract: Techniques for singulating dies from a respective workpiece and for incorporating one or more singulated die into a stacked device structure are described herein. In some examples, singulating a die from a workpiece includes chemically etching the workpiece in a scribe line. In some examples, singulating a die from a workpiece includes mechanically dicing the workpiece in a scribe line and forming a liner along a sidewall of the die. The die can be incorporated into a stacked device structure. The die can be attached to a substrate along with another die that is attached to the substrate. An encapsulant can be between each die and the substrate and laterally between the dies.
    Type: Grant
    Filed: February 26, 2018
    Date of Patent: July 27, 2021
    Assignee: Xilinx, Inc.
    Inventors: Ganesh Hariharan, Raghunandan Chaware, Inderjit Singh
  • Publication number: 20210149810
    Abstract: A data analysis system to analyze data. The data analysis system includes a data buffer configured to receive data to be analyzed. The data analysis system also includes a state machine lattice. The state machine lattice includes multiple data analysis elements and each data analysis element includes multiple memory cells configured to analyze at least a portion of the data and to output a result of the analysis. The data analysis system includes a buffer interface configured to receive the data from the data buffer and to provide the data to the state machine lattice.
    Type: Application
    Filed: January 22, 2021
    Publication date: May 20, 2021
    Inventors: David R. Brown, Harold B. Noyes, Inderjit Singh Bains
  • Patent number: 10925858
    Abstract: The present disclosure provides methods for the treatment of neurological deficits by the administration of GSNO or GSNO reductase inhibitor. Further provided herein are methods of treating autoimmune diseases by administering GSNO or GSNO reductase inhibitor.
    Type: Grant
    Filed: May 8, 2018
    Date of Patent: February 23, 2021
    Assignees: The US Government as Represented by the Department of Veterans Affairs, MUSC Foundation for Research Development
    Inventors: Inderjit Singh, Avtar K. Singh
  • Patent number: 10915450
    Abstract: A data analysis system to analyze data. The data analysis system includes a data buffer configured to receive data to be analyzed. The data analysis system also includes a state machine lattice. The state machine lattice includes multiple data analysis elements and each data analysis element includes multiple memory cells configured to analyze at least a portion of the data and to output a result of the analysis. The data analysis system includes a buffer interface configured to receive the data from the data buffer and to provide the data to the state machine lattice.
    Type: Grant
    Filed: July 16, 2019
    Date of Patent: February 9, 2021
    Assignee: Micron Technology, Inc.
    Inventors: David R. Brown, Harold B Noyes, Inderjit Singh Bains
  • Publication number: 20200380412
    Abstract: Systems, computer-implemented methods, and non-transitory computer readable media are provided for sharing medical data. The disclosed systems may be configured to create a first workgroup having a first knowledgebase. This first knowledgebase may be federated with a common knowledgebase, and with a second knowledgebase of a second workgroup. At least one of the first knowledgebase, common knowledgebase, and second knowledgebase may be configured to store data items comprising associations, signs, and evidence. The signs may comprise measurements and contexts, and the associations may describe the relationships between the measurements and contexts. The evidence may support these associations. The disclosed systems may be configured to receive a request from a user in the first workgroup, retrieve matching data items, and optionally then output to the user at least some of the retrieved matching data items. The request may comprise at least one of a first association and a first measurement.
    Type: Application
    Filed: February 24, 2020
    Publication date: December 3, 2020
    Inventors: Kai-How FARH, Donavan CHENG, John SHON, Jorg HAKENBERG, Eugene BOLOTIN, James Casey GEANEY, Hong GAO, Pam CHENG, Inderjit SINGH, Daniel ROCHE, Milan KARANGUTKAR
  • Patent number: 10840192
    Abstract: A chip package assembly and method for fabricating the same are provided which utilize a stiffener to improve a package substrate against out of plane deformation. In one example, a chip package assembly is provided that includes a package substrate, at least one integrated circuit (IC) die and a stiffener. The package substrate has a first surface and a second surface coupled by a side wall. The at least one IC die is disposed on the first surface of the package substrate. The stiffener is disposed outward of the at least one IC die. The stiffener has a first surface disposed outward of and bonded to the side wall of the package substrate. The stiffener has a second surface bonded to at least one of the first and second surfaces of the package substrate.
    Type: Grant
    Filed: April 6, 2017
    Date of Patent: November 17, 2020
    Assignee: XILINX, INC.
    Inventors: Nael Zohni, Shin S. Low, Inderjit Singh, Raghunandan Chaware, Ganesh Hariharan
  • Publication number: 20200293804
    Abstract: An automaton is implemented in a state machine engine. The automaton is configured to observe data from a beginning of an input data stream until a point when an end of data (EOD) signal is seen. Additionally the automaton is configured to report an event only when one and only one occurrence of a target symbol is seen in the input data stream.
    Type: Application
    Filed: May 28, 2020
    Publication date: September 17, 2020
    Inventors: Harold B Noyes, Michael C. Leventhal, Jeffery M. Tanner, Inderjit Singh Bains