Patents by Inventor Inderjit Singh

Inderjit Singh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9418909
    Abstract: A method and apparatus are provided which improve the adhesion of a lid to an IC die of an IC (chip) package. In one embodiment, a chip package assembly is provided that includes an IC die, a package substrate and a lid. The IC die is coupled to the package substrate. The lid has a first surface and a second surface. The second surface of the lid faces away from the first surface and towards the IC die. The second surface of the lid has a plurality of engineered features. The adhesive couples the plurality of engineered features of the lid to the IC die.
    Type: Grant
    Filed: August 6, 2015
    Date of Patent: August 16, 2016
    Assignee: XILINX, INC.
    Inventors: Raghunandan Chaware, Inderjit Singh
  • Patent number: 9385106
    Abstract: A method for providing charge protection to a die during formation of an integrated circuit, includes bonding the die to an interposer to form an unprotected stacked silicon component; encapsulating the unprotected stacked silicon component with a mold compound to cover at least a top surface of the die; grinding the mold compound to reduce a thickness of the mold compound; bonding a carrier wafer to the mold compound; removing the carrier wafer from the mold compound; and removing the mold compound from the top surface of the die after the carrier wafer is removed from the mold compound, to expose the top surface of the die.
    Type: Grant
    Filed: July 28, 2014
    Date of Patent: July 5, 2016
    Assignee: XILINX, INC.
    Inventors: Raghunandan Chaware, Inderjit Singh, Glenn O'Rourke, Ganesh Hariharan
  • Patent number: 9341668
    Abstract: A testable circuit arrangement includes an integrated circuit (IC) package. The IC package includes a package substrate, an interposer mounted directly on the package substrate with level 1 interconnects, and at least one IC die mounted directly on the interposer with level 0 interconnects. The package substrate of the IC package is mounted directly on a connector board with a soldered ball grid array of level 2 interconnects. The level 0, level 1, and level 2 interconnects include respective power, configuration, and test interconnects. Power, configuration, and test terminals of the connector board are coupled to the power, configuration, and test interconnects of the level 2 interconnects.
    Type: Grant
    Filed: April 1, 2014
    Date of Patent: May 17, 2016
    Assignee: XILNIX, INC.
    Inventors: Ganesh Hariharan, Raghunandan Chaware, Glenn O'Rourke, Inderjit Singh, Eric J. Thorne, David E. Schweigler
  • Publication number: 20160124860
    Abstract: A data analysis system to analyze data. The data analysis system includes a data buffer configured to receive data to be analyzed. The data analysis system also includes a state machine lattice. The state machine lattice includes multiple data analysis elements and each data analysis element includes multiple memory cells configured to analyze at least a portion of the data and to output a result of the analysis. The data analysis system includes a buffer interface configured to receive the data from the data buffer and to provide the data to the state machine lattice.
    Type: Application
    Filed: January 11, 2016
    Publication date: May 5, 2016
    Inventors: David R. Brown, Harold B. Noyes, Inderjit Singh Bains
  • Patent number: 9235798
    Abstract: A data analysis system to analyze data. The data analysis system includes a data buffer configured to receive data to be analyzed. The data analysis system also includes a state machine lattice. The state machine lattice includes multiple data analysis elements and each data analysis element includes multiple memory cells configured to analyze at least a portion of the data and to output a result of the analysis. The data analysis system includes a buffer interface configured to receive the data from the data buffer and to provide the data to the state machine lattice.
    Type: Grant
    Filed: July 18, 2012
    Date of Patent: January 12, 2016
    Assignee: Micron Technology, Inc.
    Inventors: David R. Brown, Harold B Noyes, Inderjit Singh Bains
  • Patent number: 9107434
    Abstract: A method and apparatus are disclosed for applying laser energy to a food product to effect cooking thereof. The energy can be applied with a laser emitter in proximity to the food product. The application of the energy can be controlled according to a profile so as to generate a plasma in and around the food product during a cooking period. The application of energy can be adjusted based on feedback associated with the controlled application of the energy to the food product.
    Type: Grant
    Filed: March 11, 2011
    Date of Patent: August 18, 2015
    Inventor: Inderjit Singh
  • Publication number: 20150215434
    Abstract: A USB-to-coaxial network bridging system and method includes receiving data frames from a USB or FireWire device via a corresponding USB or FireWire communication interface, wherein the received data frames are intended for transmittal to a predetermined remote device on a coaxial network; combining the received data frames into an aggregated frame and addressing the aggregated frame to allow the aggregated frame to be routed to the predetermined remote device on the coaxial network; and sending the aggregated frame to the remote device over the coaxial network.
    Type: Application
    Filed: June 11, 2014
    Publication date: July 30, 2015
    Inventors: Inderjit Singh, Branislav Petrovic
  • Publication number: 20150135632
    Abstract: The invention is a method to build and erect super high rise buildings with a completely new concept of civil engineering, which is based on concept and method of building of vertical columnar structures by multi stacking of columns using hydraulic suspension and elevator arm system, and then strengthening them with concrete. This is followed with building of gateway support structure around vertical columnar structure and central core to stabilize the high rise building. Next stage is the building of horizontal steel framework platforms at ground level and elevating them by central core elevator and cable hoist system. The passage of horizontal platforms through gateway structure is conducted by alternating opening and closing of gates. The process enables to populate the vertical columnar structures with horizontal platforms, which are then inter locked with vertical columnar structures and central concrete core wall Finally the steel framework platforms are strengthened with concrete.
    Type: Application
    Filed: May 14, 2013
    Publication date: May 21, 2015
    Inventor: Inderjit Singh Dhillon
  • Patent number: 8900987
    Abstract: A method for removing bumps from incomplete interposer die(s) and/or defective interposer die(s) of an interposer wafer is described. The method includes forming bumps on an interposer wafer; identifying at least one incomplete interposer die and/or at least one defective interposer die of the interposer wafer; and removing bumps from the at least one incomplete interposer die and/or the at least one defective interposer die of the interposer wafer.
    Type: Grant
    Filed: October 4, 2013
    Date of Patent: December 2, 2014
    Assignee: Xilinx, Inc.
    Inventors: Inderjit Singh, Raghunandan Chaware, Ganesh Hariharan, Glenn O'Rourke
  • Publication number: 20140291376
    Abstract: A flat-clinch-stapler comprises: a base portion (20) having upstanding bearing pieces (21) at its rear end for supporting a first transverse pivot axis (22), and a floating clincher table (11); a magazine (5) having a U-shaped cross section pivotably mounted at its rear end about said first pivot axis; a driver arm (1) carrying a driver blade (9) and being pivotably mounted at its rear end to said first pivot axis; and a handle member (300) pivotably mounted about a second transverse axis (310) in the bearing pieces offset relative to said first pivot axis in a direction to the front end of the base portion and acting on the driver arm at a position even further to the front end of the stapler. The magazine bottom wall guides the free ends of the legs of staples within the magazine.
    Type: Application
    Filed: January 27, 2011
    Publication date: October 2, 2014
    Applicant: KANIN (INDIA)
    Inventors: D. Ranjan, Navdeep Bassi, Inderjit Singh
  • Publication number: 20140113962
    Abstract: The current invention discloses novel methods for the inhibition of inducible nitric oxide synthesis (iNOS) and the production of NO. Methods of inhibiting the induction of proinflammatory cytokines are also described. Methods of treating various disease states, such as X-linked adrenoleukodystrophy, multiple sclerosis, Alzheimer's and septic shock using inhibitors of iNOS and cytokine induction are disclosed. The inhibitors include the exemplary compounds lovastatin, a sodium salt of phenylacetic acid (NaPA), FPT inhibitor II, N-acetyl cysteine (NAC), and cAMP.
    Type: Application
    Filed: July 26, 2013
    Publication date: April 24, 2014
    Applicant: MUSC FOUNDATION FOR RESEARCH DEVELOPMENT
    Inventor: Inderjit SINGH
  • Publication number: 20140025905
    Abstract: A data analysis system to analyze data. The data analysis system includes a data buffer configured to receive data to be analyzed. The data analysis system also includes a state machine lattice. The state machine lattice includes multiple data analysis elements and each data analysis element includes multiple memory cells configured to analyze at least a portion of the data and to output a result of the analysis. The data analysis system includes a buffer interface configured to receive the data from the data buffer and to provide the data to the state machine lattice.
    Type: Application
    Filed: July 18, 2012
    Publication date: January 23, 2014
    Applicant: Micron Technology, Inc.
    Inventors: David R. Brown, Harold B Noyes, Inderjit Singh Bains
  • Publication number: 20130344208
    Abstract: A method and apparatus are disclosed for applying laser energy to a food product to effect cooking thereof. The energy can be applied with a laser emitter in proximity to the food product. The application of the energy can be controlled according to a profile so as to generate a plasma in and around the food product during a cooking period. The application of energy can be adjusted based on feedback associated with the controlled application of the energy to the food product.
    Type: Application
    Filed: March 11, 2011
    Publication date: December 26, 2013
    Inventor: Inderjit Singh
  • Patent number: 8542683
    Abstract: The subject matter disclosed herein relates to dynamically adjusting bitloading for multiple destinations on a network.
    Type: Grant
    Filed: June 30, 2008
    Date of Patent: September 24, 2013
    Assignee: Entropic Communications, Inc.
    Inventors: Kenneth Chu, Inderjit Singh
  • Patent number: 8536717
    Abstract: A method of assembling an integrated circuit package is disclosed. The method comprises placing a die on a substrate of the integrated circuit package; coupling a plurality of wire bonds from a plurality of bond pads on the die to corresponding bond pads on the substrate; applying a non-conductive material to the plurality of wire bonds; and encapsulating the die and the plurality of wire bonds. An integrated circuit package is also disclosed.
    Type: Grant
    Filed: January 10, 2012
    Date of Patent: September 17, 2013
    Assignee: XILINX, Inc.
    Inventors: Shin S. Low, Inderjit Singh
  • Patent number: 8507219
    Abstract: The current invention discloses novel methods for the inhibition of inducible nitric oxide synthesis (iNOS) and the production of NO. Methods of inhibiting the induction of proinflammatory cytokines are also described. Methods of treating various disease states, such as X-linked adrenoleukodystrophy, multiple sclerosis, Alzheimer's and septic shock using inhibitors of iNOS and cytokine induction are disclosed. The inhibitors include the exemplary compounds lovastatin, a sodium salt of phenylacetic acid (NaPA), FPT inhibitor II, N-acetyl cysteine (NAC), and cAMP.
    Type: Grant
    Filed: May 27, 2011
    Date of Patent: August 13, 2013
    Assignee: MUSC Foundation for Research Development
    Inventor: Inderjit Singh
  • Publication number: 20130175709
    Abstract: A method of assembling an integrated circuit package is disclosed. The method comprises placing a die on a substrate of the integrated circuit package; coupling a plurality of wire bonds from a plurality of bond pads on the die to corresponding bond pads on the substrate; applying a non-conductive material to the plurality of wire bonds; and encapsulating the die and the plurality of wire bonds. An integrated circuit package is also disclosed.
    Type: Application
    Filed: January 10, 2012
    Publication date: July 11, 2013
    Applicant: XILINX, INC.
    Inventors: Shin S. Low, Inderjit Singh
  • Patent number: 8352569
    Abstract: In one embodiment a communication method comprises the steps of receiving a query at Layer 2 from an entry node by way of a coordinated network, the query requesting data rates of network resources of the coordinated network; transmitting a Layer 2 request for an available data rate to each of a plurality of nodes connected to the coordinated network in response to the query; receiving a first Layer 2 response to said request from one or more of the plurality of nodes, wherein the first response includes a data rate with which each of the one or more nodes is capable of transmitting or receiving data; and transmitting a list of the received data rates to at least the entry node on the coordinated network.
    Type: Grant
    Filed: February 6, 2008
    Date of Patent: January 8, 2013
    Assignee: Entropic Communications, Inc.
    Inventors: Robert L. Hare, Jr., Inderjit Singh, Bradley Thomas Hyslop, Shlomo Ovadia
  • Patent number: 8343505
    Abstract: An aquatic subunit vaccine comprises an antigenic fusion protein and suitable carrier or adjuvant. The antigenic fusion protein sequence consists from its amino terminus to carboxyl terminus of a receptor binding motif and a translocation domain of Pseudomonas aeruginosa exotoxin A and has the amino acid sequence of SEQ ID No: 8; a viral antigenic protein affecting fish disease; and a signal peptide having the amino acid sequence of SEQ ID No: 10.
    Type: Grant
    Filed: December 4, 2007
    Date of Patent: January 1, 2013
    Assignee: Schweitzer Co., Ltd.
    Inventors: Tsunyung Kuo, Gabriel Hsuchung Chen, Chungchin Wu, Oystein Evensen, Inderjit Singh Marjara
  • Patent number: 8198483
    Abstract: (1R)-2-[(6-{2-[(2,6-dichlorobenzyl)oxy]ethoxy}hexyl)amino]-1-(2,2-dimethyl-4H-1,3-benzodioxin-6-yl)ethanol and (5R)-3-(6-{2-[(2,6-dichlorobenzyl)oxy]ethoxy}hexyl)-5-(2,2-dimethyl-4H-1,3-benzodioxin-6-yl)-1,3-oxazolidin-2-one are claimed.
    Type: Grant
    Filed: June 21, 2011
    Date of Patent: June 12, 2012
    Assignee: Glaxo Group Limited
    Inventors: Philip Charles Box, Diane Mary Coe, Brian Edgar Looker, Inderjit Singh Mann, Panayiotis Alexandrou Procopiou