Abstract: A fabricating method of light emitting element. A substrate is provided. A plurality of first concaves and a plurality of second concaves are formed on the substrate, wherein a volume of each first concave is different from a volume of each second concave. A plurality of first light emitting diode chips and a plurality of second light emitting diode chips are provided, wherein a volume of each first light emitting diode chip is corresponding to the volume of each first concave, and a volume of each second light emitting diode chip is corresponding to the volume of each second concave. The first light emitting diode chips are moved onto the substrate such that the first light emitting diode chips go into the first concaves, and the second light emitting diode chips are moved onto the substrate such that the second light emitting diode chips go into the first concaves.

Abstract: A method for forming a micro bump includes forming a first nano-particle layer on a substrate and forming a second nano-particle layer on the first nano-particle layer. The first and second nano-particle layers include a plurality of first nano particles and a plurality of second nano particles, respectively. The method further includes irradiating a laser beam onto the second nano-particle layer, where the laser beam penetrates through the second nano-particle layer and is at least partially absorbed by at least some of the first nano particles to generate heat. The first nano particles and the second nano particles have different absorption rates with respect to the laser beam.

Abstract: A surgical method for distracting adjacent spinal vertebrae or spinal process is disclosed. The steps of the method includes: inserting a device between the adjacent spinal vertebrae or the spinous processes, wherein the device includes at least a main portion and a stabilizing portion; and providing at least two contacts between the device and the adjacent vertebrae or the spinous processes, wherein the contacts are located on a side of vertebrae, or spinous process.

Abstract: One embodiment of the present invention discloses an apparatus for solar-thermal collection.

Abstract: A method for inserting characteristic extractor is provided. The method includes parsing a transaction level model (TLM) of an electronic device of a target system to find out at least one target point of an operation status of the electronic device; and inserting at least one characteristic extractor into the at least one target point.

Abstract: Methods and systems for operating a sensor network comprising a plurality of nodes and at least one resource, where a resource can be a sensing device (e.g., a camera or microphone) or other peripheral devices (e.g., a storage or recording system). In at least one embodiment of the present invention, at least one node in a network determines at least one resource available to it and the type of the resource or its capabilities. Based on the type or capabilities of the resource, the node associates with one or more logical node names and acquires instructions for performing at least one function.

Abstract: Methods and systems for operating a sensor network comprising a plurality of nodes and at least one resource, where a resource can be a sensing device (e.g., a camera or microphone) or other peripheral devices (e.g., a storage or recording system). In at least one embodiment of the present invention, at least one node in a network determines at least one resource available to it and the type of the resource or its capabilities. Based on the type or capabilities of the resource, the node associates with one or more logical node names and acquires instructions for performing at least one function.

Abstract: A double-side light emitting display panel includes a substrate, a plurality of top emission pixel structures and a plurality of bottom emission pixel structures. The top emission pixel structures are disposed on the substrate, and the bottom emission pixel structures are disposed on the substrate. The top emission pixel structures and the bottom emission pixel structures are arranged alternatively on the substrate.

Abstract: The present disclosure relates to a multiple-capacity centrifugal compressor, which includes a plurality of capacity-control mechanisms. Each of the capacity-control mechanisms includes an inlet guide vane and an outlet diffuser, so that the multiple-capacity centrifugal compressor provides a flexible control strategy. In addition, the present disclosure further provides a method for controlling the multiple-capacity centrifugal compressor that effectively adjusts and controls the capacity-control mechanisms by coarsely adjusting the inlet guide vanes and combined with subsequently adjusting the outlet diffusers.

Abstract: A light emitting device includes a substrate, and a plurality of light emitting structures disposed thereon. Each of the light emitting structures includes an auxiliary electrode disposed on the substrate, a first insulating layer disposed on the substrate and covering the auxiliary electrode, an electrode disposed on the first insulating layer, a second insulating layer disposed on the first insulating layer and having a first opening exposing the electrode, an organic light emitting layer disposed in the first opening, a cathode disposed on the organic light emitting layer, at least a conductive structure penetrating through the first insulating layer and the second insulating layer, and a closed ring structure disposed on the second insulating layer and around the cathode, wherein a thickness of the closed ring structure is larger than that of the cathode.

Abstract: A timing control circuit for a switching capacitor dynamic switch includes a first time generator and a second time generator. The first generator includes a first capacitor. The first time generator determines a first time by charging to the first capacitor. The second time generator includes a second capacitor. The first time generator is connected to the second time generator. When the first time ends, the second time generator determines a second time by discharging to the second capacitor.

Abstract: An optical scanning projection module includes a scanning light component including a plurality of sub light sources and at least one light-splitting element, a main light reflective element, a scanning element and a photosensitive element. Sub light beams of the sub light sources are converged to form a main light beam. One of the sub light beams travels to the light-delivering element to form a partial reflective light beam and a partial penetrating light beam. With a scanning manner, the partial reflective light beam or the partial penetrating light beam is reflected by the scanning element to be an inspection light, and the main light beam is reflected by the scanning element to be a projection light. The photosensitive element outputs a sensing signal according to the inspection light. Thus, the optical scanning projection module controls the operation of the scanning light component according to the sensing signal.

Abstract: A method of handling hybrid automatic repeat request (HARQ) acknowledgement responses in a network of a wireless communication system is disclosed. The method comprises assigning resources for a plurality of physical hybrid indicator channels (PHICHs) and a plurality of extended physical hybrid indicator channels (ePHICHs); and transmitting a HARQ acknowledgement response to a communication device of the wireless communication system on a channel selected from the plurality of PHICHs and the plurality of ePHICHs, after receiving an uplink transmission from the communication device.

Abstract: A method of handling a plurality of time offsets between a communication device of a wireless communication system and a plurality of transmission points of the wireless communication system is disclosed. The method is utilized in the communication device, and comprises obtaining the plurality of time offsets by using a first reference signal; and transmitting the plurality of time offsets to the plurality of transmission points, respectively; wherein the plurality of transmission points compensate the plurality of time offsets, respectively, when communicating with the communication device.

Abstract: A solar cell is disclosed. A substrate includes a first surface and a second surface, wherein the substrate is of a first type. A through hole passes through the substrate, wherein the substrate includes a third surface in the through hole. An insulating layer is on the third surface in the through hole and extends to be over the second surface of the substrate. A first thin film semiconductor layer is disposed on the first surface of the substrate, wherein the first thin film semiconductor layer is of a first type. A transparent conductive layer is on the first thin film semiconductor layer. A through hole connection layer is disposed in the through hole and extends to be over the first surface and the second surface of the substrate.

Abstract: A method of handling hybrid automatic repeat request (HARQ) acknowledgement responses in a network of a wireless communication system is disclosed. The method comprises selecting a plurality of communication devices of the wireless communication system when the plurality of communication devices conform to a specified rule; and always responding positive HARQ acknowledgement messages to the plurality of communication devices.

Abstract: Disclosed is a polyimide polymerized by x molar parts of a first diamine, y molar parts of a second diamine, and 100 molar parts of a first dianhydride, wherein the first diamine has a formula of the second diamine has a formula of the first dianhydride has a formula of a+b=100, 50?x?80, and 20?y?50.

Abstract: A fabricating method and a testing method of a semiconductor device and a mechanical integrity testing apparatus are provided. An object includes a wafer, an insulating layer, and a plurality of conductive posts is provided. A surface of the wafer has a plurality of first blind holes outside chip regions and a plurality of second blind holes inside the chip regions. The insulating layer is between the conductive posts and the walls of the first blind holes and between the conductive posts and the walls of the second blind holes. A mechanical integrity test is performed to test a binding strength between the insulating layer, the conductive posts, and the walls of the first blind holes. The conductive posts in the chip regions are electrically connected to an element after the conductive posts in the first blind holes are qualified in the mechanical integrity test.

Abstract: A superabsorbent polymer network formed of two monomers and two crosslinkers. The monomers and the crosslinkers are described herein. Further, a method for preparing this superabsorbent polymer network is disclosed. Also disclosed is a method of determining a ratio between two monomeric moieties in a superabsorbent polymer network formed of two monomers.

Abstract: A semiconductor light source device is provided. The semiconductor light source device includes a light guide, at least one semiconductor light source set and at least one light transformation coupler. The light transformation coupler is disposed between the semiconductor light source set and the light guide for guiding the light emitted from the semiconductor light source set to the light guide. The light transformation coupler has an inclined surface and a curved surface. The inclined surface is a multi-level inclined surface with several slopes.