Abstract: A pluggable bi-directional transceiver with a single optical fiber comprises a sub-assembly module, a circuit board, a main frame, an upper cover, a lower cover, a tab-base and a tab, connected to a communication equipment. The sub-assembly module connected to a single optical fiber includes a WDM, which reflects or transmits a specific wavelength optical signal adapted to function in receiving and transmitting optical signal. The circuit board exchanges the signal of the sub-assembly module with the communication equipment. The main frame and the upper and lower covers are used to fix and protect elements. The tab and tab-base are used to fix the transceiver on the equipment or remove from it. The specifications of the transceiver follow the small form-factor pluggable transceiver multi-source agreement.

Abstract: A pluggable bi-directional transceiver with a single optical fiber comprises a sub-assembly module, a circuit board, a main frame, an upper cover, a lower cover, a tab-base and a tab, connected to a communication equipment. The sub-assembly module connected to a single optical fiber includes a WDM, which reflects or transmits a specific wavelength optical signal adapted to function in receiving and transmitting optical signal. The circuit board exchanges the signal of the sub-assembly module with the communication equipment. The main frame and the upper and lower covers are used to fix and protect elements. The tab and tab-base are used to fix the transceiver on the equipment or remove from it. The specifications of the transceiver follow the small form-factor pluggable transceiver multi-source agreement.

Abstract: The present invention disclose a method for measuring a thermal expansion coefficient of a thin film, in which the thin film is first deposited on two substrates having different thermal expansion coefficients under the same conditions. For each of the two deposited substrates, a relationship between the thin film stresses and the measuring temperatures is established by using a phase shifting interferometry technique, in which the stresses in the thin films are derived by comparing the deflections of the substrates prior to and after the deposition. Based on the two relationships the thermal expansion coefficient, and elastic modulus, E f ( 1 - v f ) , can be calculated, wherein Ef and &ngr;f are the Young's modulus and Poisson's ratio of the thin film, respectively.