Optical sub-assembly module

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Description

FIG. 1 is a front elevational view of an optical sub-assembly module showing our new design;

FIG. 2 is a rear elevational view thereof;

FIG. 3 is a left side elevational view thereof;

FIG. 4 is a right side elevational view thereof;

FIG. 5 is a top plan view thereof;

FIG. 6 is a bottom plan view thereof; and,

FIG. 7 is a perspective view thereof.

Claims

The ornamental design for an optical sub-assembly module, as shown and described.

Referenced Cited
U.S. Patent Documents
D330006 October 6, 1992 Kamakura et al.
D355406 February 14, 1995 Smith
6299467 October 9, 2001 Chien
Patent History
Patent number: D475970
Type: Grant
Filed: May 24, 2002
Date of Patent: Jun 17, 2003
Assignee: RiteKom Photonics Corporation (Hsin-Chu Hsien)
Inventors: Chang-You Li (Chia-Yi), Ing-Jer Ho (Hsin-Chu), Ling-Ying Chiang (Hsin-Chu), Tuan-Yu Hung (Hsin-Chu), Wen-Chih Hsieh (Hsin-Chu Hsien)
Primary Examiner: Holly Baynham
Attorney, Agent or Law Firm: Winston Hsu
Application Number: 29/161,113
Classifications
Current U.S. Class: Connector, Conductor Or Housing Therefor (10) (D13/133)
International Classification: 1303;