Patents by Inventor In-hwan Kim

In-hwan Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240147592
    Abstract: The present disclosure relates to a light emitting diode (LED) driving device that may expand a usable range of LED current and battery voltage by reducing heat generation of an integrated circuit, and an LED lighting device including the same, which may include a current controller that constantly controls an LED current flowing through an LED string and an IC heat dissipation part connected to a node between the LED string and the current controller to dissipate IC heat of the current controller, wherein when a battery voltage supplied to the LED string increases, the IC heat dissipation part reduces a first LED current flowing from the LED string to the current controller and simultaneously increases a second LED current flowing from the LED string to the current controller via the IC heat dissipation part, thereby reducing the IC heat generation of the current controller.
    Type: Application
    Filed: November 1, 2023
    Publication date: May 2, 2024
    Applicant: LX SEMICON CO., LTD.
    Inventors: Byung Jun SEO, Ji Hwan KIM, Young Jin WOO, Jong Min LEE, Ju Pyo HONG
  • Publication number: 20240147098
    Abstract: A color matching circuit of an image sensor includes a receiving end configured to receive an analog pixel signal. The color matching circuit also includes a path controller including a first switch set configured to control current paths between a common node coupled to the receiving end and power sources and a second switch set configured to control signal paths between the common node and analog-to-digital converters, the path controller being configured to determine on-off states of switches included in the first switch set and the second switch set based on a color corresponding to the analog pixel signal. The path controller transfers the analog pixel signal to a target analog-to-digital converter determined depending on the on-off states of the switches, among the analog-to-digital converters.
    Type: Application
    Filed: March 22, 2023
    Publication date: May 2, 2024
    Applicant: SK hynix Inc.
    Inventors: Han Sol PARK, Yu Jin PARK, Soo Hwan KIM, Seung Hwan LEE, Ji Ho LEE
  • Publication number: 20240147694
    Abstract: The present invention provides a highly integrated memory cell and a semiconductor memory device including the same. According to the present invention, a semiconductor memory device comprises: a substrate; an active layer spaced apart from the substrate, extending in a direction parallel to the substrate, and including a thin-body channel; a bit line extending in a direction vertical to the substrate and connected to one side of the active layer; a capacitor connected to another side of the active layer; and a first word line and a second word line extending in a direction crossing the thin-body channel with the thin-body channel interposed therebetween, wherein a thickness of the thin-body channel is smaller than thicknesses of the first word line and the second word line.
    Type: Application
    Filed: January 12, 2024
    Publication date: May 2, 2024
    Inventor: Seung Hwan KIM
  • Publication number: 20240145174
    Abstract: A multilayer electronic component includes a body including a dielectric layer and an internal electrode, an external electrode disposed outside the body, and an insulating layer disposed on the external electrode. The external electrode is disposed to cover an exposed surface of an outermost surface of the electrode layer, and is formed to have a thickness, equal to or less than a thickness of the body, and the insulating layer is disposed to cover an end of the external electrode, to improve moisture resistance reliability.
    Type: Application
    Filed: January 11, 2024
    Publication date: May 2, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Young Ghyu AHN, Soo Hwan SON, Young Key KIM
  • Publication number: 20240145939
    Abstract: A dual polarization antenna is disclosed in at least one embodiment of the present disclosure, including a base substrate, a power feeding unit supported on the base substrate, and a radiating plate supported on the power feeding unit, the power feeding unit includes a first feeding substrate and a second feeding substrate arranged to cross each other on the base substrate, the first feeding substrate includes a first feed line configured to supply a first reference phase signal to a first point on the radiating plate and to supply a first reverse phase signal having a reverse phase relative to the first reference phase signal, to a second point on the radiating plate, the second feeding substrate includes a second feed line configured to supply a second reference phase signal to a third point on the radiating plate and to supply a second reverse phase signal having a reverse phase relative to the second reference phase signal, to a fourth point on the radiating plate, and wherein the first feeding substrate
    Type: Application
    Filed: December 15, 2023
    Publication date: May 2, 2024
    Applicant: KMW INC.
    Inventors: Sung Hwan SO, Oh Seog CHOI, Seong Man KANG, Yong Won SEO, Myung Hwa KIM, Su Yong LEE
  • Publication number: 20240145483
    Abstract: A display device includes a substrate, a semiconductor layer disposed on the substrate, and including a first channel portion, a second channel portion, a connecting portion disposed between the first channel portion and the second channel portion, and electrode regions, a first insulating layer disposed on the semiconductor layer, a gate conductor disposed on the first insulating layer and including a first gate electrode overlapping the first channel portion and a second gate electrode overlapping the second channel portion, signal lines disposed on the substrate, a first electrode electrically connected to at least one of electrode regions of the semiconductor layer, an emission layer disposed on the first electrode, and a second electrode disposed on the emission layer, and the first channel portion and the second channel portion of the semiconductor layer each have a first width greater than a second width of the connecting portion.
    Type: Application
    Filed: January 5, 2024
    Publication date: May 2, 2024
    Inventors: Han Bit KIM, Mee Jae KANG, Keun Woo KIM, Doo-Na KIM, Sang Sub KIM, Do Kyeong LEE, Jae Hwan CHU
  • Publication number: 20240138475
    Abstract: An aerosol generating device includes: a housing including a hole for receiving an aerosol generating article and a guide apart from the hole; and a cover configured to move along the guide between a first position and a second position to open or close the hole, wherein the hole is open when the cover is located in the first position, and the hole is closed when the cover is located in the second position.
    Type: Application
    Filed: July 21, 2022
    Publication date: May 2, 2024
    Applicant: KT&G CORPORATION
    Inventors: Dong Sung KIM, Yong Hwan KIM, Hun II LIM, Seok Su JANG
  • Publication number: 20240145268
    Abstract: A molding apparatus for fabricating a semiconductor package includes an upper mold including an upper cavity, a first side cavity at a first side of the upper cavity, a second side cavity formed at an opposite second side of the upper cavity, and a first driving part connected to the first side cavity and configured to move the first side cavity in a first direction, and a bottom mold including a bottom cavity configured to receive a molding target including a package substrate and at least one semiconductor chip. A width in the first direction between the first side cavity and the second side cavity may be smaller than a width of the package substrate in the first direction and greater than a width in the first direction between a first boundary and a second boundary of the at least one semiconductor chip.
    Type: Application
    Filed: September 15, 2023
    Publication date: May 2, 2024
    Inventors: Jun Woo Park, Gyu Hyeong Kim, Seung Hwan Kim, Jung Joo Kim, Jong Wan Kim, Yong Kwan Lee
  • Publication number: 20240145790
    Abstract: A button-type secondary battery includes a lower can having a bottom surface; an upper can having a top, the upper can and the lower can being coupled to define a space therein; an electrolyte in the space; an electrode assembly in the space and including a negative electrode, a separator, and a positive electrode wound together; a gasket between the upper can and the lower can to electrically insulate the upper and lower cans; a top insulator that is electrically insulating and covering a top surface of the electrode assembly; and a bottom insulator that is electrically insulating and covering a bottom surface of the electrode assembly. The top and bottom insulators are each configured to expand in volume by absorbing the electrolyte. Surfaces of at least one of the top insulator and the bottom insulator are coated with a protective layer to prevent thermal shrinkage from occurring.
    Type: Application
    Filed: October 14, 2022
    Publication date: May 2, 2024
    Applicant: LG ENERGY SOLUTION, LTD.
    Inventors: Yeong Hun JUNG, Young Ji TAE, Joo Hwan SUNG, Min Su CHO, Geun Young PARK, Min Gyu KIM, Min Seon KIM, Sang Hak CHAE, Min Young JU
  • Publication number: 20240145346
    Abstract: A semiconductor device includes a substrate with a conductive pattern. A semiconductor die is electrically connected to the substrate and both the semiconductor die and the substrate are at least partially covered by a package body. In some examples, through-mold vias are formed in the package body to provide electrical signal paths from an exterior surface thereof to the conductive pattern of the substrate. In some examples, through-mold vias are included in the package body to provide electrical signal paths between the semiconductor die and an exterior surface of the package body. In some examples, an interposer is electrically connected to the through-mold vias and may be covered by the package body and/or disposed in spaced relation thereto. In some examples, the interposer may not be electrically connected to the through-mold vias but may have one or more semiconductor dies of the semiconductor device electrically connected thereto.
    Type: Application
    Filed: January 8, 2024
    Publication date: May 2, 2024
    Applicant: Amkor Technology Singapore Holding Pte. Ltd
    Inventors: Dong Joo PARK, Jin Seong KIM, Ki Wook LEE, Dae Byoung KANG, Ho CHOI, Kwang Ho KIM, Jae Dong KIM, Yeon Soo JUNG, Sung Hwan CHO
  • Publication number: 20240140078
    Abstract: A textile fabric includes a textile fabric layer, a transparent film layer provided on the textile fabric layer, and a surface layer disposed on the transparent film layer. The transparent film layer has a two-layer structure including a first film layer having a first polyetherester-based copolymer and a second film layer having a second polyetherester-based copolymer disposed on the first film layer. The second film layer is provided on the textile fabric layer. A method of manufacturing the fabric includes preparing the textile fabric layer, forming the transparent film layer on the fabric layer, and laminating the textile fabric and transparent film layers through heat treatment.
    Type: Application
    Filed: June 16, 2023
    Publication date: May 2, 2024
    Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION, TKG ECO MATERIAL CO., LTD.
    Inventors: Hyun Dae Cho, Myoung Ryoul Lee, Seul Yi, Gu Hwan Kim, Jin Hun Cha
  • Publication number: 20240140944
    Abstract: The present invention relates to a novel naphthyridinone derivative compound, a pharmaceutically acceptable salt thereof, a hydrate thereof, or a stereoisomer thereof, which are each relevant to a compound for inhibiting ENPP1, a composition for inhibiting ENPP1, and a method for inhibiting ENPP1.
    Type: Application
    Filed: December 29, 2021
    Publication date: May 2, 2024
    Applicant: TXINNO BIOSCIENCE INC.
    Inventors: Seo Jung Han, Chan Sun Park, Sung Joon Kim, Jae Eun Cheong, Jung Hwan Choi, Ali Imran, Sun Woo Lee, Yong Yea Park, Ah Ran Yu, Sun Young Park
  • Publication number: 20240145160
    Abstract: A coil component includes a body including a first surface and a second surface opposing each other and first to fourth side surfaces connecting the first and second surfaces; a first coil disposed within the body and including a first lead-out portion and a second lead-out portion extending to at least one of the first to fourth side surfaces of the body; a second coil disposed within the body and including a third lead-out portion and a fourth lead-out portion extending to at least one of the first to fourth side surfaces of the body; first to fourth external electrodes disposed on two adjacent side surfaces of the first to fourth side surfaces of the body and respectively connected to the first to fourth lead-out portions.
    Type: Application
    Filed: September 28, 2023
    Publication date: May 2, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Tae Hyun Kim, Dong Hwan Lee, Dong Jin Lee, Boum Seock Kim
  • Publication number: 20240143940
    Abstract: The present invention relates to a context-based QA generation architecture, and an object of the present invention is to generate diverse QA pairs from a single context. To achieve the object, the present invention includes a latent variable generating network including at least one encoder and an artificial neural network (Multi-Layer Perceptron: MLP) and configured to train the artificial neural network using a first context, a first question, and a first answer, and generate a second question latent variable and a second answer latent variable by applying the trained artificial neural network to a second context, an answer generating network configured to generate a second answer by decoding the second answer latent variable, and a question generating network configured to generate a second question based on a second context and the second answer.
    Type: Application
    Filed: December 18, 2023
    Publication date: May 2, 2024
    Inventors: Dong Hwan KIM, Sung Ju HWANG, Seanie LEE, Dong Bok LEE, Woo Tae JEONG, Han Su KIM, You Kyung KWON, Hyun Ok KIM
  • Publication number: 20240141585
    Abstract: A seat molded article and a method of preparing a seat molded article are disclosed. The seat molded article includes: an upper pad formed of polyurethane foam having a thickness in a range of 25 to 50 mm; and an elastic fabric disposed under the upper pad, wherein, in the elastic fabric, a difference in tensile elongation between warp and weft directions is 5.0% or less, and a tensile elongation measured under a load of 20 kgf is in a range of 20 to 40% in the warp and weft directions.
    Type: Application
    Filed: June 27, 2023
    Publication date: May 2, 2024
    Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION, TKG ECO MATERIAL Co.,Ltd., Hyundai Transys Inc.
    Inventors: Myoung Ryoul Lee, Byungguk Lim, Jun Ho Song, Hye Rin Choi, Gu Hwan Kim, Tyuckkyu Hwang
  • Publication number: 20240144801
    Abstract: A rear seat passenger notification device includes a sensor device that identifies information about at least one passenger who is present in a host vehicle when the host vehicle enters a lock state. The rear seat passenger notification device also includes an alarm device that performs a visual and audible alarm function, and an information collection device that collects information about the host vehicle and information about a user of the host vehicle The rear seat passenger notification device further includes an action determination and control device that identifies, based on at least one of the information about the at least one passenger, the information about the host vehicle, the information about the user, or a combination thereof, at least one action item for control of the host vehicle, and provides the user with the at least one action item.
    Type: Application
    Filed: May 18, 2023
    Publication date: May 2, 2024
    Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION
    Inventors: Seul Ki Jeon, Hui Won Shin, Eung Hwan Kim
  • Publication number: 20240144893
    Abstract: A display panel includes an amorphous silicon gate driver in which a lower voltage than the gate-off voltage output from the gate driver is applied to an adjacent stage as a low voltage transmission signal.
    Type: Application
    Filed: January 10, 2024
    Publication date: May 2, 2024
    Inventors: JAE-HOON LEE, SEUNG-HWAN MOON, YONG-SOON LEE, YOUNG-SU KIM, CHANG-HO LEE, WHEE-WON LEE, JUN-YONG SONG, YU-HAN BAE
  • Publication number: 20240144829
    Abstract: A lane change recommendation system may include: a lane recommendation condition determination unit including a driving situation determination unit determining whether a host vehicle being driven on a driving lane satisfies driving situation conditions for lane change from the driving lane to a target lane; and a lane determination unit determining whether a lane condition for the lane change is satisfied based on a color and type of a lane between the driving lane and the target lane; and a status transition unit receiving a status indicating whether the lane change is possible from the lane recommendation condition determination unit to generate an instruction of lane recommendation.
    Type: Application
    Filed: August 10, 2023
    Publication date: May 2, 2024
    Inventor: Jae Hwan KIM
  • Patent number: 11972825
    Abstract: An integrated circuit chip includes a first through electrode and a second through electrode formed through the integrated circuit chip, a transmission circuit suitable for selecting one of signals transmitted through the first and second through electrodes, respectively, and transmitting the selected signal to a data line, in response to a selection signal, and a selection signal generation circuit suitable for generating the selection signal by toggling the selection signal, during a test operation.
    Type: Grant
    Filed: October 29, 2019
    Date of Patent: April 30, 2024
    Assignee: SK hynix Inc.
    Inventors: Ji-Hwan Kim, Sang-Muk Oh
  • Patent number: D1025393
    Type: Grant
    Filed: February 25, 2022
    Date of Patent: April 30, 2024
    Assignee: BIONLIFESCIENCE Co., Ltd.
    Inventors: Chang Wook Goh, Bong Yoon Kim, Joong Hwan Jeong