Abstract: A method, system and apparatus are described. The apparatus includes a first device to adjust a polarity associated with a thermoelectric (TEC) module. The adjustment is to control the flow of heat. The flow of heat is directed toward a thermal interface material (TIM) in order to melt the TIM up to an acceptable melt level. The apparatus further includes a second device to determine whether the TIM has melted up to the acceptable melt level. The apparatus includes an application device to apply the TIM to a heat sink if the TIM is melted has melted up to the acceptable melt level.

Abstract: In some embodiments, a piezoelectric actuator is coupled to a blade having a rake shape. The blade may include a base with two or more prongs extending therefrom. At least a portion of one or more prongs may be positioned between the fins of a heat sink. Other embodiments are disclosed and claimed.

Abstract: A heat dissipating device. The heat dissipating device comprises a receptor plate to be placed over a device that generates heat, an evaporator coupling to the receptor plate, a condenser column placed in fluid communication with the evaporator, and a set of condenser extension surfaces extending from the condenser. The evaporator includes a modulated porous layer and stores liquid. The condenser column includes a non-wetting surface. The condenser extension surface facilitates heat dissipation.

Abstract: A pump includes a shaft, a first electric motor associated with first portion of the shaft, a second electric motor associated with a second portion of the shaft, and a position sensor associated with a third portion of the shaft. A controller commutates the first electric motor and the second electric motor to rotate the shaft and maintain a substantially equal distance between the sensor and the shaft.

Abstract: A piezo actuator includes a plurality of layers of ceramic material, a plurality of layers of conductive material interspersed between the plurality of layers of ceramic material, and a plate attached to an end of the actuator. The plate of the piezo actuator includes an overhang portion.

Abstract: An enclosure for a wireless device includes a first compartment and a second compartment. The first compartment is to house some or all of the electronic circuitry of the wireless device and is sealed from an exterior environment. The second compartment is adjacent to the first compartment and includes one or more piezoelectric fans to provide cooling for the first compartment. The second compartment is open to the exterior environment and provides physical protection for the one or more piezoelectric fans located therein.

Abstract: A thermal solution having a thermal energy transfer path and an isolation layer disposed on the thermal energy path is described herein.

Abstract: A microchannel structure has microchannels formed therein. The microchannels are to transport a coolant and to be proximate to an integrated circuit to transfer heat from the integrated circuit to the coolant. At least one of the microchannels has a length extent and has a first section at a first location along the length extent and a second section at a second location along the length extent. The first section of the microchannel has a first aspect ratio and the second section is divided into at least two sub-channels. Each sub-channel has a respective second aspect ratio that is greater than the first aspect ratio.

Abstract: An apparatus includes a microchannel structure having microchannels formed therein. The microchannels are to transport a coolant and to be proximate to an integrated circuit to transfer heat from the integrated circuit to the coolant. The apparatus also includes a cover positioned on the microchannel structure to define a respective upper wall of each of the microchannels. The cover presents a compliant surface to the microchannels.

Abstract: A method and device for thermal conduction is provided. Devices and methods are shown that include the ability to dissipate increased amounts of heat due to the use of an active heat transfer device. Devices and methods are shown that share the necessary heat transfer between a passive heat transfer device and an active heat transfer device, thus increasing the amount of heat dissipated while maintaining reliability of the individual components. Devices and methods are shown that include an increased length of the heatsink which can keep large temperature differences between heat transfer structures and the heat transfer fluid such as air.

Abstract: An apparatus and associated method to provide liquid cooling to a microelectronic device are generally described. In this regard, according to one example embodiment, a cooling solution including Potassium Formate in combination with inhibitors is processed through a cooling system to remove heat from a microelectronic device.

Abstract: Apparatus for removing heat from a heat generating device comprising a two-phase heat dissipation device having a dispersion device disposed within the heat dissipation device. The heat dissipation device includes a sealed housing having a vaporization region within the sealed housing and a condensation region within the sealed housing, a working fluid disposed within said seal housing; and the dispersion device being adapted to disperse said working fluid toward the sealed housing vaporization region. The heat dissipation device may further include a divider plate dispose within the sealed housing, wherein the divider plate substantially divides the sealed housing into a vapor path chamber and a liquid path chamber.

Abstract: A device includes a liquid metal and a ferrofluid contained in a closed tube. Many electrode groups are connected to the closed tube. A feedback device is connected to the electrode groups. The feedback device switches power to each electrode group in series to circulate the liquid metal and move the ferrofluid in the closed tube.

Abstract: Piezoelectric fan assemblies are provided to provide a conduction path and forced convection for space-limited electronic devices in accordance with embodiments of the present invention. The fan blade of a piezoelectric fan is thermally coupled to the heat source, such as, but not limited to, the fins of a heat sink, the condenser of the heat pipe, and to the thermal mass of a heat spreader or block. The high amplitude resonant vibration of the fan blade causes formation of a high velocity unidirectional flow stream. Maximum airflow occurs on axes of the piezoelectric fan's centerline, relative to both width and height dimensions. Air intake is above and below the swept out plane of the fan blade. The air flow provides forced convection for the fan blade and, secondarily, for the heat source.

Abstract: A liquid metal thermal interface for an integrated circuit die. The liquid metal thermal interface may be disposed between the die and another heat transfer element, such as a heat spreader or heat sink. The liquid metal thermal interface includes a liquid metal in fluid communication with a surface of the die, and liquid metal moving over the die surface transfers heat from the die to the heat transfer element. A surface of the heat transfer element may also be in fluid communication with the liquid metal. Other embodiments are described and claimed.

Abstract: A condensate removal apparatus with a wick structure, method for condensate removal and system for condensate removal using such a wick structure are described herein.

Abstract: The method and apparatus of the present invention dissipate heat from an electronic device to provide an efficient and universally applied thermal solution for high heat generating electronic devices. The apparatus comprises an evaporator, a condenser, a heater and conduits. The evaporator, condenser, and conduits define a closed system that has an interior volume which is partially filled with a liquid coolant. The evaporator is thermally connected to an electronic device, such as a processor, and removes thermal energy from the processor by evaporating the liquid coolant. When the apparatus is oriented such that no liquid coolant is in contact with the evaporator, the heater applies thermal energy to the coolant until the coolant begins to boil. Boiling the liquid coolant causes bubbles to form within the liquid coolant. The volume of the bubbles generated by boiling raises the level of the liquid coolant within the closed system until the liquid coolant comes into contact with the evaporator.

Abstract: According to an embodiment of the invention, a thermoelectric module (TEM) is formed between a first and a second thermally conductive device. A first dielectric layer is deposited over the first thermally conductive device, and interconnects are formed over the dielectric layer. Solder patches are then printed over the interconnects. A second dielectric layer is deposited over the second thermally conductive device. Interconnects and solder patches are deposited over the second dielectric layer. Alternating p- and n-type semiconductor elements are then placed over the patches over the first dielectric layer. The second thermally conductive device is then placed over the first device, and the solder is reflowed.

Abstract: A microchannel cold plate for cooling semiconductor electronic devices which may include a semi-permeable wall in contact with liquid in the cooling passage. The cold plate, in turn, may be in contact with the integrated circuit. Cooling liquid passes through the cold plate where it starts boiling inside of the microchannels. The wall allows gas bubbles to pass through while preventing the passage of liquid. As a result, the gas bubbles may be removed from the liquid flow by upward buoyancy. The removal of the gas bubbles improves the operation of the cold plate in some embodiments.

Abstract: A heat dissipating device. The heat dissipating device comprises a receptor plate to be placed over a device that generates heat, an evaporator coupling to the receptor plate, a condenser column placed in fluid communication with the evaporator, and a set of condenser extension surfaces extending from the condenser. The evaporator includes a modulated porous layer and stores liquid. The condenser column includes a non-wetting surface. The condenser extension surface facilitates heat dissipation.