Abstract: A test system can include a probe suitable to be coupled between a test measurement device and a device under test (DUT). The probe can include a signal input to receive an active signal from the DUT and a signal output to provide the active signal to the test measurement device. The probe can also include an input ground to connect to the DUT ground and an output ground to connect to the test measurement device ground. A probe ground connection checking device can automatically determine whether the probe ground connections to the DUT ground and test measurement device ground are solid.

Abstract: A signal acquisition system has a signal acquisition probe having probe tip circuitry coupled to a resistive center conductor signal cable. The resistive center conductor signal cable of the signal acquisition probe is coupled to a compensation system in a signal processing instrument via an input node and input circuitry in the signal processing instrument. The signal acquisition probe and the signal processing instrument have mismatched time constants at the input node with the compensation system having an input amplifier with feedback loop circuitry and a shunt pole-zero pair coupled to the input circuitry providing pole-zero pairs for maintaining flatness over the signal acquisition system frequency bandwidth.

Abstract: A signal acquisition system has a signal acquisition probe having probe tip circuitry coupled to a resistive center conductor signal cable with the signal cable coupled to a signal processing instrument via an input node. The input node is coupled to an input current amplifier via input circuitry. The input circuitry provides at least one of resistive and capacitive termination of the resistive center conductor signal cable. The termination of the resistive center conductor signal cable in the signal processing instrument provides a signal acquisition system where the capacitive loading of a device under test at higher frequencies is reduced by reducing the input capacitance of the probe tip circuitry resulting in an increase in the signal acquisition system bandwidth.

Abstract: A signal acquisition system has a signal acquisition probe having probe tip circuitry coupled to a resistive center conductor signal cable. The resistive center conductor signal cable of the signal acquisition probe is coupled to a compensation system in a signal processing instrument via an input node and input circuitry in the signal processing instrument. The signal acquisition probe and the signal processing instrument have mismatched time constants at the input node with the compensation system providing pole-zero pairs for maintaining flatness over the signal acquisition system frequency bandwidth.

Abstract: A signal acquisition system has a signal acquisition probe having probe tip circuitry coupled to a resistive center conductor signal cable. The resistive center conductor signal cable is coupled to a compensation system in a signal processing instrument via an input node and input circuitry in the signal processing instrument. The signal acquisition probe and the signal processing instrument have mismatched time constants at the input node with the compensation system having an input amplifier with feedback loop circuitry and a compensation digital filter providing pole-zero pairs for maintaining flatness over the signal acquisition system frequency bandwidth.

Abstract: A signal acquisition system has a signal acquisition probe having probe tip circuitry coupled to a resistive center conductor signal cable. The resistive center conductor signal cable is coupled to a compensation system in a signal processing instrument via an input node and input circuitry in the signal processing instrument. The signal acquisition probe and the signal processing instrument have mismatched time constants at the input node with the compensation system having an input amplifier with feedback loop circuitry and a compensation digital filter providing pole-zero pairs for maintaining flatness over the signal acquisition system frequency bandwidth.

Abstract: The manufacturing method of a probe with printed tip consists of a substrate having a plurality of probe tips connected to its end edge, a plurality of test paths, each connected to one of the probe tips and extending along the substrate, and at least one of the test paths including an electrical component adjacent to the test path's probe tip. The electrical component may be a resistor. The probe tips may have a width equal to the thickness of the substrate. The probe tips may consist of a plurality of probe tip layers. The invention also includes a method of probing signals transmitted over target transmission lines on a target board. The disclosure also includes a method of manufacturing the claimed invention.

Abstract: A probe comprises a small “consumable” probe substrate permanently mounted to a circuit-under-test. The probe substrate includes a high-fidelity signal pathway, which is inserted into a conductor of the circuit-under-test, and a high-bandwidth sensing circuit which senses the signal-under-test as it propagates along the signal pathway. The probe substrate further includes a probe socket for receiving a detachable interconnect to a measurement instrument. Power is alternatively supplied to the probe by the circuit-under-test or the interconnect. When the interconnect is attached, control signals from the measurement instrument are supplied to the sensing circuit and the output of the sensing circuit is supplied to the measurement instrument. In one embodiment, the sensing circuit uses high-breakdown transistors in order to avoid the use of passive attenuation. In a further embodiment, the sensing circuit includes broadband directional sensing circuitry.

Abstract: The probe with printed tip consists of a substrate having a plurality of probe tips connected to its end edge, a plurality of test paths, each connected to one of the probe tips and extending along the substrate, and at least one of the test paths including an electrical component adjacent to the test path's probe tip. The electrical component may be a resistor. The probe tips may have a width equal to the thickness of the substrate. The probe tips may consist of a plurality of probe tip layers. The invention also includes a method of probing signals transmitted over target transmission lines on a target board. The disclosure also includes a method of manufacturing the claimed invention.

Abstract: The probe with printed tip consists of a substrate having a plurality of probe tips connected to its end edge, a plurality of test paths, each connected to one of the probe tips and extending along the substrate, and at least one of the test paths including an electrical component adjacent to the test path's probe tip. The electrical component may be a resistor. The probe tips may have a width equal to the thickness of the substrate. The probe tips may consist of a plurality of probe tip layers. The invention also includes a method of probing signals transmitted over target transmission lines on a target board. The disclosure also includes a method of manufacturing the claimed invention.

Abstract: A signal acquisition system has a signal acquisition probe having probe tip circuitry coupled to a resistive center conductor signal cable. The resistive center conductor signal cable of the signal acquisition probe is coupled to a compensation system in a signal processing instrument via an input node and input circuitry in the signal processing instrument. The signal acquisition probe and the signal processing instrument have mismatched time constants at the input node with the compensation system providing pole-zero pairs for maintaining flatness over the signal acquisition system frequency bandwidth.

Abstract: A signal acquisition system has a signal acquisition probe having probe tip circuitry coupled to a resistive center conductor signal cable. The resistive center conductor signal cable of the signal acquisition probe is coupled to a compensation system in a signal processing instrument via an input node and input circuitry in the signal processing instrument. The signal acquisition probe and the signal processing instrument have mismatched time constants at the input node with the compensation system having an input amplifier with feedback loop circuitry and a shunt pole-zero pair coupled to the input circuitry providing pole-zero pairs for maintaining flatness over the signal acquisition system frequency bandwidth.

Abstract: A signal acquisition system has a signal acquisition probe having probe tip circuitry coupled to a resistive center conductor signal cable with the signal cable coupled to a signal processing instrument via an input node. The input node is coupled to an input current amplifier via input circuitry. The input circuitry provides at least one of resistive and capacitive termination of the resistive center conductor signal cable. The termination of the resistive center conductor signal cable in the signal processing instrument provides a signal acquisition system where the capacitive loading of a device under test at higher frequencies is reduced by reducing the input capacitance of the probe tip circuitry resulting in an increase in the signal acquisition system bandwidth.

Abstract: A signal acquisition system has a signal acquisition probe having probe tip circuitry coupled to a resistive center conductor signal cable. The resistive center conductor signal cable is coupled to a compensation system in a signal processing instrument via an input node and input circuitry in the signal processing instrument. The signal acquisition probe and the signal processing instrument have mismatched time constants at the input node with the compensation system having an input amplifier with feedback loop circuitry and a compensation digital filter providing pole-zero pairs for maintaining flatness over the signal acquisition system frequency bandwidth.

Abstract: A low capacitance signal acquisition system has a signal acquisition probe having a low capacitance input circuit coupled to a compensation amplifier in a signal processing instrument via a signal cable. The low capacitance input circuit, the signal cable and the signal processing instrument input have mismatched time constants with the compensation amplifier having feedback loop circuitry providing adjustable gain and pole-zero pairs for maintaining flatness over the low capacitance signal acquisition system frequency bandwidth.

Abstract: The probe with printed tip consists of a substrate having a plurality of probe tips connected to its end edge, a plurality of test paths, each connected to one of the probe tips and extending along the substrate, and at least one of the test paths including an electrical component adjacent to the test path's probe tip. The electrical component may be a resistor. The probe tips may have a width equal to the thickness of the substrate. The probe tips may consist of a plurality of probe tip layers. The invention also includes a method of probing signals transmitted over target transmission lines on a target board. The disclosure also includes a method of manufacturing the claimed invention.

Abstract: A probing adapter has a support member receiving a probing tip assembly having probing arms. The probing tip assembly is mounted to the support member via a rotational joint having elastomeric member disposed in the probing arms with each of the probing arms having a pivot point disposed away from the rotational joint. Each of the probing arms supports a removable probing tip substrate having a probing tip at one end electrically coupled via an electrical signal conductor to an electrical connector at the other end. Substrate retention clips secure the removable probing tip substrates to the probing arms. A probing tip positioning member is mounted to the probing arms for varying the distance between the probing tips on the removable probing tip substrates.

Abstract: A wide bandwidth attenuator input circuit for a measurement probe has a Z0 attenuator circuit coupled in series with a compensated RC attenuator circuit. The series attenuator elements of the Z0 and the compensated RC attenuator circuits are coupled via a controlled impedance transmission line to the shunt attenuator elements of the Z0 and the compensated RC attenuator circuits. The shunt element of the Z0 attenuator element terminates the transmission line in its characteristic impedance. The junction of the series and shunt attenuator elements are coupled to the input of a buffer amplifier. At low and intermediate frequencies, the compensated RC attenuator circuit attenuates an input signal while at high frequencies, the compensated RC attenuator circuit acts as a short and the Z0 attenuator circuits attenuates the input signal.

Abstract: A probing adapter has a support member receiving a probing tip assembly having probing arms. The probing tip assembly is mounted to the support member via a rotational joint having elastomeric member disposed in the probing arms with each of the probing arms having a pivot point disposed away from the rotational joint. Each of the probing arms supports a removable probing tip substrate having a probing tip at one end electrically coupled via an electrical signal conductor to an electrical connector at the other end. Substrate retention clips secure the removable probing tip substrates to the probing arms. A probing tip positioning member is mounted to the probing arms for varying the distance between the probing tips on the removable probing tip substrates.

Abstract: A wide bandwidth attenuator input circuit for a measurement probe has a Z0 attenuator circuit coupled in series with a compensated RC attenuator circuit. The series attenuator elements of the Z0 and the compensated RC attenuator circuits are coupled via a controlled impedance transmission line to the shunt attenuator elements of the Z0 and the compensated RC attenuator circuits. The shunt element of the Z0 attenuator element terminates the transmission line in its characteristic impedance. The junction of the series and shunt attenuator elements are coupled to the input of a buffer amplifier. At low and intermediate frequencies, the compensated RC attenuator circuit attenuates an input signal while at high frequencies, the compensated RC attenuator circuit acts as a short and the Z0 attenuator circuits attenuates the input signal.