Patents by Inventor Irena H. Wysok
Irena H. Wysok has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240093355Abstract: Methods and apparatus reduce defects in substrates processed in a physical vapor (PVD) chamber. In some embodiments, a method for cleaning a process kit disposed in an inner volume of a process chamber includes positioning a glassy carbon shutter disk on a substrate support of the PVD chamber; energizing an oxygen-containing cleaning gas disposed in the inner volume of the PVD chamber to create a plasma reactive with carbon-based materials; and heating the process kit having a carbon-based material adhered thereto while exposed to the plasma to remove at least a portion of the carbon-based material adhered to the process kit.Type: ApplicationFiled: September 21, 2022Publication date: March 21, 2024Inventors: Zhiyong WANG, Zheyuan CHEN, Irena H. WYSOK, Sundarapandian Ramalinga Vijayalakshmi REDDY, Avinash NAYAK, Jianxin LEI
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Patent number: 11898236Abstract: Methods and apparatus for processing a substrate are provided herein. For example, a processing chamber for processing a substrate comprises a sputtering target, a chamber wall at least partially defining an inner volume within the processing chamber and connected to ground, a power source comprising an RF power source, a process kit surrounding the sputtering target and a substrate support, an auto capacitor tuner (ACT) connected to ground and the sputtering target, and a controller configured to energize the cleaning gas disposed in the inner volume of the processing chamber to create the plasma and tune the sputtering target using the ACT to maintain a predetermined potential difference between the plasma in the inner volume and the process kit during the etch process to remove sputtering material from the process kit, wherein the predetermined potential difference is based on a resonant point of the ACT.Type: GrantFiled: October 20, 2021Date of Patent: February 13, 2024Assignee: APPLIED MATERIALS, INC.Inventors: Zhiyong Wang, Halbert Chong, John C. Forster, Irena H. Wysok, Tiefeng Shi, Gang Fu, Renu Whig, Keith A Miller, Sundarapandian Ramalinga Vijayalakshmi Reddy, Jianxin Lei, Rongjun Wang, Tza-Jing Gung, Kirankumar Neelasandra Savandaiah, Avinash Nayak, Lei Zhou
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Patent number: 11846013Abstract: An apparatus leverages a physical vapor deposition (PVD) process chamber with a wafer-to-target distance of approximately 400 millimeters to deposit tantalum film on through silicon via (TSV) structures. The PVD process chamber includes a source that is configured with dual magnet source compensation. The PVD chamber also includes an upper electromagnet assembly exterior to the chamber body in close proximity to the source, a magnetron assembly in the source including dual magnets with dual radius trajectories, a shield within the chamber body, and a plurality of grounding loops that are symmetrically spaced about a periphery of a substrate support assembly and are configured to provide an RF ground return path between the substrate support assembly and the shield.Type: GrantFiled: July 31, 2020Date of Patent: December 19, 2023Assignee: APPLIED MATERIALS, INC.Inventors: David Gunther, Jiao Song, Kirankumar Neelasandra Savandaiah, Irena H. Wysok, Anthony Chih-Tung Chan
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Publication number: 20230122956Abstract: Methods and apparatus for processing a substrate are provided herein. For example, a processing chamber for processing a substrate comprises a sputtering target, a chamber wall at least partially defining an inner volume within the processing chamber and connected to ground, a power source comprising an RF power source, a process kit surrounding the sputtering target and a substrate support, an auto capacitor tuner (ACT) connected to ground and the sputtering target, and a controller configured to energize the cleaning gas disposed in the inner volume of the processing chamber to create the plasma and tune the sputtering target using the ACT to maintain a predetermined potential difference between the plasma in the inner volume and the process kit during the etch process to remove sputtering material from the process kit, wherein the predetermined potential difference is based on a resonant point of the ACT.Type: ApplicationFiled: October 20, 2021Publication date: April 20, 2023Inventors: Zhiyong WANG, Halbert CHONG, John C. FORSTER, Irena H. WYSOK, Tiefeng SHI, Gang FU, Renu WHIG, Keith A. MILLER, Sundarapandian Ramalinga Vijayalakshmi REDDY, Jianxin LEI, Rongjun WANG, Tza-Jing GUNG, Kirankumar Neelasandra SAVANDAIAH, Avinash NAYAK, Lei ZHOU
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Publication number: 20230073011Abstract: Methods and apparatus reduce defects in substrates processed in a physical vapor (PVD) chamber. In some embodiments, a method for cleaning a process kit disposed in an inner volume of a process chamber includes positioning a non-sputtering shutter disk on a substrate support of the PVD chamber; energizing an oxygen-containing cleaning gas disposed in the inner volume of the PVD chamber to create a plasma reactive with carbon-based materials; and heating the process kit having a carbon-based material adhered thereto while exposed to the plasma to remove at least a portion of the carbon-based material adhered to the process kit.Type: ApplicationFiled: August 31, 2022Publication date: March 9, 2023Inventors: Zhiyong WANG, Halbert CHONG, Irena H. WYSOK, Jianxin LEI, Rongjun WANG, Lei ZHOU, Kirankumar Neelasandra SAVANDAIAH, Sundarapandian Ramalinga Vijayalakshmi REDDY
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Patent number: 11581166Abstract: Embodiments of deposition rings for use in a process chamber are provided herein. In some embodiments, a deposition ring includes: an annular body; an inner wall extending upward from an inner portion of the annular body; and an outer wall extending upward form an outer portion of the annular body to define a large deposition cavity between the inner wall and the outer wall, wherein a width of the large deposition cavity is about 0.35 inches to about 0.60 inches, wherein the outer wall includes an outer ledge and an inner ledge raised with respect to the outer ledge.Type: GrantFiled: July 31, 2020Date of Patent: February 14, 2023Assignee: APPLIED MATERIALS, INC.Inventors: Kirankumar Neelasandra Savandaiah, Jiao Song, David Gunther, Irena H. Wysok, Anthony Chih-Tung Chan
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Publication number: 20220310363Abstract: Methods and apparatus for cleaning a process kit configured for processing a substrate are provided. For example, a process chamber for processing a substrate can include a chamber wall; a sputtering target disposed in an upper section of the inner volume; a pedestal including a substrate support having a support surface to support a substrate below the sputtering target; a power source configured to energize sputtering gas for forming a plasma in the inner volume; a process kit surrounding the sputtering target and the substrate support; and an ACT connected to the pedestal and a controller configured to tune the pedestal using the ACT to maintain a predetermined potential difference between the plasma in the inner volume and the process kit, wherein the predetermined potential difference is based on a percentage of total capacitance of the ACT and a stray capacitance associated with a grounding path of the process chamber.Type: ApplicationFiled: June 13, 2022Publication date: September 29, 2022Inventors: Halbert CHONG, Rong TAO, Jianxin LEI, Rongjun WANG, Keith A. Miller, Irena H. Wysok, Tza-Jing Gung, Xing Chen
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Publication number: 20220310364Abstract: Methods and apparatus for cleaning a process kit configured for processing a substrate are provided. For example, a process chamber for processing a substrate can include a chamber wall; a sputtering target disposed in an upper section of the inner volume; a pedestal including a substrate support having a support surface to support a substrate below the sputtering target; a power source configured to energize sputtering gas for forming a plasma in the inner volume; a process kit surrounding the sputtering target and the substrate support; and an ACT connected to the pedestal and a controller configured to tune the pedestal using the ACT to maintain a predetermined potential difference between the plasma in the inner volume and the process kit, wherein the predetermined potential difference is based on a percentage of total capacitance of the ACT and a stray capacitance associated with a grounding path of the process chamber.Type: ApplicationFiled: June 13, 2022Publication date: September 29, 2022Inventors: Halbert CHONG, Rong TAO, Jianxin LEI, Rongjun WANG, Keith A. Miller, Irena H. Wysok, Tza-Jing Gung, Xing Chen
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Patent number: 11295938Abstract: Methods and apparatus for processing a substrate are provided herein. In embodiments, a magnetron assembly for use in a PVD chamber includes: a base plate having a first side, a second side opposite the first side, and a central axis; a magnet plate rotatably coupled to the base plate, wherein the magnet plate rotates with respect to the base plate about an offset axis; a magnet assembly coupled to the magnet plate offset from the offset axis and configured to rotate about the central axis and the offset axis; a first motor coupled to the base plate to rotate the magnet assembly about the central axis; and a second motor coupled to the magnet plate to control an angular position thereof and to position the magnet assembly in each of a plurality of fixed angular positions defining a plurality of different fixed radii.Type: GrantFiled: June 30, 2020Date of Patent: April 5, 2022Assignee: APPLIED MATERIALS, INC.Inventors: Jiao Song, Anthony Chih-Tung Chan, David Gunther, Kirankumar Neelasandra Savandaiah, Irena H. Wysok
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Publication number: 20220033956Abstract: An apparatus leverages a physical vapor deposition (PVD) process chamber with a wafer-to-target distance of approximately 400 millimeters to deposit tantalum film on through silicon via (TSV) structures. The PVD process chamber includes a source that is configured with dual magnet source compensation. The PVD chamber also includes an upper electromagnet assembly exterior to the chamber body in close proximity to the source, a magnetron assembly in the source including dual magnets with dual radius trajectories, a shield within the chamber body, and a plurality of grounding loops that are symmetrically spaced about a periphery of a substrate support assembly and are configured to provide an RF ground return path between the substrate support assembly and the shield.Type: ApplicationFiled: July 31, 2020Publication date: February 3, 2022Inventors: David GUNTHER, Jiao SONG, Kirankumar Neelasandra SAVANDAIAH, Irena H. WYSOK, Anthony Chih-Tung CHAN
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Publication number: 20220037128Abstract: Embodiments of deposition rings for use in a process chamber are provided herein. In some embodiments, a deposition ring includes: an annular body; an inner wall extending upward from an inner portion of the annular body; and an outer wall extending upward form an outer portion of the annular body to define a large deposition cavity between the inner wall and the outer wall, wherein a width of the large deposition cavity is about 0.35 inches to about 0.60 inches, wherein the outer wall includes an outer ledge and an inner ledge raised with respect to the outer ledge.Type: ApplicationFiled: July 31, 2020Publication date: February 3, 2022Inventors: Kirankumar Neelasandra SAVANDAIAH, Jiao SONG, David GUNTHER, Irena H. WYSOK, Anthony Chih-Tung CHAN
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Publication number: 20210407778Abstract: Methods and apparatus for processing a substrate are provided herein. In embodiments, a magnetron assembly for use in a PVD chamber includes: a base plate having a first side, a second side opposite the first side, and a central axis; a magnet plate rotatably coupled to the base plate, wherein the magnet plate rotates with respect to the base plate about an offset axis; a magnet assembly coupled to the magnet plate offset from the offset axis and configured to rotate about the central axis and the offset axis; a first motor coupled to the base plate to rotate the magnet assembly about the central axis; and a second motor coupled to the magnet plate to control an angular position thereof and to position the magnet assembly in each of a plurality of fixed angular positions defining a plurality of different fixed radii.Type: ApplicationFiled: June 30, 2020Publication date: December 30, 2021Inventors: Jiao SONG, Anthony Chih-Tung CHAN, David GUNTHER, Kirankumar Neelasandra SAVANDAIAH, Irena H. WYSOK
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Patent number: 11189472Abstract: Embodiments of a magnetron assembly and a processing system incorporating same are provided herein. In some embodiments, a magnetron assembly includes a body extending along a central axis of the magnetron assembly; a coolant feed structure extending through the body along the central axis to provide a coolant along the central axis to an area beneath the coolant feed structure; and a rotatable magnet assembly coupled to a bottom of the body and having a plurality of magnets.Type: GrantFiled: July 17, 2017Date of Patent: November 30, 2021Assignee: APPLIED MATERIALS, INC.Inventors: Irena H. Wysok, Kirankumar Savandaiah, Anthony Chih-Tung Chan, Jiao Song, Prashant Prabhu
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Publication number: 20210319989Abstract: Methods and apparatus for cleaning a process kit configured for processing a substrate are provided. For example, a process chamber for processing a substrate can include a chamber wall; a sputtering target disposed in an upper section of the inner volume; a pedestal including a substrate support having a support surface to support a substrate below the sputtering target; a power source configured to energize sputtering gas for forming a plasma in the inner volume; a process kit surrounding the sputtering target and the substrate support; and an ACT connected to the pedestal and a controller configured to tune the pedestal using the ACT to maintain a predetermined potential difference between the plasma in the inner volume and the process kit, wherein the predetermined potential difference is based on a percentage of total capacitance of the ACT and a stray capacitance associated with a grounding path of the process chamber.Type: ApplicationFiled: April 13, 2020Publication date: October 14, 2021Inventors: Halbert CHONG, Rong TAO, Jianxin LEI, Rongjun WANG, Keith A. Miller, Irena H. Wysok, Tza-Jing Gung, Xing Chen
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Publication number: 20190019658Abstract: Embodiments of a magnetron assembly and a processing system incorporating same are provided herein. In some embodiments, a magnetron assembly includes a body extending along a central axis of the magnetron assembly; a coolant feed structure extending through the body along the central axis to provide a coolant along the central axis to an area beneath the coolant feed structure; and a rotatable magnet assembly coupled to a bottom of the body and having a plurality of magnets.Type: ApplicationFiled: July 17, 2017Publication date: January 17, 2019Inventors: Irena H. Wysok, Kirankumar Savandaiah, Anthony Chih-Tung Chan, Jiao Song, Prashant Prabhu
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Patent number: D933726Type: GrantFiled: July 31, 2020Date of Patent: October 19, 2021Assignee: APPLIED MATERIALS, INC.Inventors: Kirankumar Neelasandra Savandaiah, Jiao Song, David Gunther, Irena H. Wysok, Anthony Chih-Tung Chan