Abstract: An image processing apparatus includes a detecting unit that detects whether image data for each of the lines in generated image information is chromatic or achromatic; and a determining unit that determines whether the original is chromatic or achromatic based on a detection result of the detecting unit for a first area of the image information, excluding a detection result for a predetermined second area of the image information, the predetermined second area including an end line among the lines in a scanning direction of the original.

Abstract: A radiation-sensitive resin composition suitable as a chemically-amplified resist useful for microfabrication utilizing various types of radiation such as deep ultraviolet rays represented by a KrF excimer laser or ArF excimer laser. The radiation-sensitive resin composition of the present invention comprises: (A) a resin comprising a recurring unit (1-1) shown by the following formula (I-1) and (B) a radiation-sensitive acid generator such as 1-(4-n-butoxynaphthyl)tetrahydrothiophenium nonafluoro-n-butanesulfonate. The radiation-sensitive resin composition may further comprise (C) an acid diffusion controller such as phenylbenzimidazole.

Abstract: A radiation-sensitive resin composition suitable as a chemically-amplified resist useful for microfabrication utilizing various types of radiation such as deep ultraviolet rays represented by a KrF excimer laser or ArF excimer laser. The radiation-sensitive resin composition of the present invention comprises: (A) a resin comprising a recurring unit (1-1) shown by the following formula (I-1) and (B) a radiation-sensitive acid generator such as 1-(4-n-butoxynaphthyl)tetrahydrothiophenium nonafluoro-n-butanesulfonate. The radiation-sensitive resin composition may further comprise (C) an acid diffusion controller such as phenylbenzimidazole.

Abstract: 1. A radiation-sensitive resin composition comprising: (A) a resin insoluble or scarcely soluble in alkali, but becomes alkali soluble by the action of an acid and (B) a photoacid generator. The resin comprises (a) at least one recurring unit of the following formula (1-1) or (1-2), and (b) at least one recurring unit for the following formula (2-1), (2-2), or (2-3).

Abstract: A radiation-sensitive resin composition suitable as a chemically-amplified resist useful for microfabrication utilizing various types of radiation such as deep ultraviolet rays represented by a KrF excimer laser or ArF excimer laser. The radiation-sensitive resin composition of the present invention comprises: (A) a resin comprising a recurring unit (1-1) shown by the following formula (I-1) and (B) a radiation-sensitive acid generator such as 1-(4-n-butoxynaphthyl)tetrahydrothiophenium nonafluoro-n-butanesulfonate.

Abstract: The present invention is directed to the preparation of photoresist polymers via living free radical polymerization techniques. Sterically bulky ester monomers are utilized as the polymerization components. Use of chain transfer agents is included in polymerization processing conditions. Cleavage of polymer terminal end groups that include a heteroatom are described.

Abstract: The present invention is directed to the preparation of photoresist polymers via living free radical polymerization techniques. Sterically bulky ester monomers are utilized as the polymerization components. Use of chain transfer agents is included in polymerization processing conditions. Cleavage of polymer terminal end groups that include a heteroatom are described.

Abstract: A dispensing apparatus includes a dispensing nozzle that moves between a first position and a second position. The dispensing nozzle sucks in a liquid specimen including a reagent at the first position and dispenses the liquid specimen into a vessel located at the second position. An agent applicator is located on the path of movement of the dispensing nozzle. The agent applicator applies, to the discharge end portion of the dispensing nozzle, an agent having a low affinity for the liquid specimen than the inner surface of the dispensing nozzle.

Abstract: A radiation-sensitive resin composition exhibiting only extremely controlled change in the sensitivity after storage when used as a chemically-amplified resist possessing high transparency at a wavelength of 193 nm or less and particularly excellent depth of focus (DOF) is provided. The radiation-sensitive resin composition comprises (A) a siloxane resin having a structural unit (I) shown by the following formula (I) and/or a structural unit (II) shown by the following formula (II), (B) a photoacid generator, and (C) a solvent, the content of nitrogen-containing compounds in the composition being not more than 100 ppm, wherein A and B individually represent a substituted or unsubstituted divalent linear, branched, or cyclic hydrocarbon group, R1 represents a monovalent acid-dissociable group, and R2 represents a hydrogen atom or monovalent acid-dissociable group.

Abstract: The present invention is directed to the preparation of photoresist polymers via living free radical polymerization techniques. Sterically bulky ester monomers are utilized as the polymerization components. Use of chain transfer agents is included in polymerization processing conditions. Cleavage of polymer terminal end groups that include a heteroatom are described.

Abstract: A novel polysiloxane suitable as a resin component of a chemically-amplified resist exhibiting particularly excellent I-D bias, depth of focus (DOF), and the like, a novel silane compound useful as a raw material for synthesizing the polysiloxane, and a radiation-sensitive resin composition comprising the polysiloxane are provided. The silane compound is shown by the following formula (I), and the polysiloxane has a structural unit shown by the following formula (1), wherein R is an alkyl group, R1 and R2 individually represent a fluorine atom, lower alkyl group, or lower fluoroalkyl group, n is 0 or 1, k is 1 or 2, and i is an integer of 0 to 10. The radiation-sensitive resin composition comprises the polysiloxane and a photoacid generator.

Abstract: A siloxane resin exhibiting high transparency at a wavelength of 193 nm or less, very suitable as a resin component in a radiation-sensitive resin composition useful particularly for manufacturing LSIs, and a radiation-sensitive resin composition useful as a chemically-amplified resist exhibiting excellent depth of focus (DOF) and capability of remarkably decreasing development defects are provided. The siloxane resin comprises the structural unit (I) shown by the following formula (I) and the structural unit (II) shown by the following formula (II) in the same molecule, the structural unit (I) and the structural unit (II) being included in an amount of more than 0 mol % but not more than 70 mol %, wherein A and B individually represents a divalent linear, branched, or cyclic hydrocarbon group, R1 represents a monovalent acid-dissociable group, and R2 represents a linear, branched, or cyclic alkyl group.

Abstract: A radiation-sensitive resin composition comprising (A) a resin containing a structural unit of the following formula (I), (B) a resin containing a recurring unit of the following formula (II), and (C) a photoacid generator, wherein R1 represents a substituted or unsubstituted divalent (alicyclic) hydrocarbon, R2 represents a lower alkyl group or a monovalent (substituted) alicyclic hydrocarbon group, or any two R2s form in combination a divalent (substituted) alicyclic hydrocarbon group, with the remaining R2 being a lower alkyl group or a monovalent (substituted) alicyclic hydrocarbon group, wherein R3 represents a hydrogen atom, fluorine atom, or trifluoromethyl group, R4 represents a (substituted) hydrocarbon group with a valence of (c+1), (substituted) alicyclic hydrocarbon with a valence of (c+1), or (substituted) aromatic group with a valence of (c+1), R5 represents a hydrogen atom or a monovalent acid-dissociable group, a and b individually represent an integer of 0-3, provided that (a+b)?1 is

Abstract: The present invention is directed to the preparation of photoresist polymers via living free radical polymerization techniques. Sterically bulky ester monomers are utilized as the polymerization components. Use of chain transfer agents is included in polymerization processing conditions. Cleavage of polymer terminal end groups that include a heteroatom are described.

Abstract: The present invention is directed to the preparation of photoresist polymers via living free radical polymerization techniques. Sterically bulky ester monomers are utilized as the polymerization components. Use of chain transfer agents is included in polymerization processing conditions. Cleavage of polymer terminal end groups that include a heteroatom are described.

Abstract: A radiation sensitive dielectric constant changing composition comprising (A) a decomposable compound, (B) a nondecomposable compound, (C) a radiation sensitive decomposer and (D) a stabilizer. The composition allows its dielectric constant to be changed by a simple method, has a sufficiently large difference between its changed dielectric constant and its original dielectric constant and can provide a dielectric constant pattern and an optical material which are stable regardless of their use conditions.

Abstract: The invention provides novel acid generators which are unproblematic in combustibility and accumulation inside the human body and can generate acids having high acidities and high boiling points and exhibiting properly short diffusion lengths in resist coating films and which permit the formation of resist patterns excellent smoothness with little dependence on the denseness of a mask pattern; sulfonic acids generated from the acid generators; sulfonyl halides useful as raw material in the synthesis of the acid generators; and radiation-sensitive resin compositions containing the acid generators. The acid generators have structures represented by the general formula (I), wherein R1 is a monovalent substituent such as alkoxycarbonyl, alkylsulfonyl, or alkoxysulfonyl, R2 to R4 are each hydrogen or alkyl; k is an integer of 0 or above; and n is an integer of 0 to 5.

Abstract: The present invention is directed to the preparation of photoresist polymers via living free radical polymerization techniques. Sterically bulky ester monomers are utilized as the polymerization components. Use of chain transfer agents is included in polymerization processing conditions. Cleavage of polymer terminal end groups that include a heteroatom are described.

Abstract: To provide a refractive index pattern and an optical material whose refractive indices are changed by a simple method, which have a sufficiently large refractive index difference and which are stable irrespective of their use conditions, and a method of forming these. A radiation sensitive refractive index changing composition comprising (A) a decomposable compound, (B) a hydrolyzate of an alkoxide such as tetrabutoxytitanium, tetramethoxyzirconium, tetramethoxygermanium or tetramethoxysilane, or a halogen compound such as tetrachlorosilane and (C) a radiation sensitive decomposer; and a method of producing a refractive index pattern and an optical material, using the above radiation sensitive refractive index changing composition.

Abstract: A radiation-sensitive resin composition comprising an acid-labile group-containing resin obtained by living radical polymerization having a specific structure which is insoluble or scarcely soluble in alkali, but becomes alkali soluble by the action of an acid, and a photoacid generator, wherein the ratio of weight average molecular weight to number average molecular weight (weight average molecular weight/number average molecular weight) of the acid-labile group-containing resin is smaller than 1.5.