Abstract: A laminated structure includes an interconnect structure including first and second product areas and a first interconnect layer, and a first insulating layer formed on the interconnect structure. The first product area includes an opening penetrating the first insulating layer, and the second product area includes an annular groove penetrating the first insulating layer. The laminated structure further includes an electronic component mounted inside the opening in the first product area with an annular gap formed between the electronic component and a wall surface defining the opening, an insulating member located inside the groove in the second product area, a second insulating layer that fills the annular gap and the groove, and covers the first insulating layer, the electronic component, and the insulating member, and a second interconnect layer formed on the second insulating layer, and electrically connected to the first interconnect layer.

Abstract: A laminated structure includes an interconnect structure including first and second product areas and a first interconnect layer, and a first insulating layer formed on the interconnect structure. The first product area includes an opening penetrating the first insulating layer, and the second product area includes an annular groove penetrating the first insulating layer. The laminated structure further includes an electronic component mounted inside the opening in the first product area with an annular gap formed between the electronic component and a wall surface defining the opening, an insulating member located inside the groove in the second product area, a second insulating layer that fills the annular gap and the groove, and covers the first insulating layer, the electronic component, and the insulating member, and a second interconnect layer formed on the second insulating layer, and electrically connected to the first interconnect layer.

Abstract: A wiring substrate includes a pad, an insulation layer that covers the pad, and a via wiring extending through the insulation layer and connected to the pad. The via wiring includes a first via portion, which has a diameter that is decreased from an upper surface of the insulation layer toward the pad, and a second via portion, which has a diameter that is increased from a lower end of the first via portion toward the pad. The diameter of the second via portion at an upper surface of the pad is larger than the diameter of the first via portion at the upper surface of the insulation layer.

Abstract: A wiring substrate includes a pad, an insulation layer that covers the pad, and a via wiring extending through the insulation layer and connected to the pad. The via wiring includes a first via portion, which has a diameter that is decreased from an upper surface of the insulation layer toward the pad, and a second via portion, which has a diameter that is increased from a lower end of the first via portion toward the pad. The diameter of the second via portion at an upper surface of the pad is larger than the diameter of the first via portion at the upper surface of the insulation layer.

Abstract: A wiring substrate includes a pad, an insulation layer that covers the pad, and a via wiring extending through the insulation layer and connected to the pad. The via wiring includes a first via portion, which has a diameter that is decreased from an upper surface of the insulation layer toward the pad, and a second via portion, which has a diameter that is increased from a lower end of the first via portion toward the pad. The diameter of the second via portion at an upper surface of the pad is larger than the diameter of the first via portion at the upper surface of the insulation layer.

Abstract: A wiring substrate includes a pad, an insulation layer that covers the pad, and a via wiring extending through the insulation layer and connected to the pad. The via wiring includes a first via portion, which has a diameter that is decreased from an upper surface of the insulation layer toward the pad, and a second via portion, which has a diameter that is increased from a lower end of the first via portion toward the pad. The diameter of the second via portion at an upper surface of the pad is larger than the diameter of the first via portion at the upper surface of the insulation layer.

Abstract: A wiring substrate includes first through holes extending through an insulation layer, first via wirings formed in the first through holes, a conductive pattern connected to the first via wirings, recesses formed in the first via wirings, and a protective insulation layer covering the conductive pattern and the first via wirings. The first via wirings, the conductive pattern, the recesses, and the protective insulation layer form an identification mark identifiable as a particular shape including a character or a symbol. Each recess is defined by an upper surface of the corresponding first via wiring and includes a curved side wall and a bottom wall that is located at a lower position than an upper surface of the conductive pattern. The protective insulation layer is thicker over the first via wirings than over the conductive pattern.

Abstract: A wiring substrate includes first through holes extending through an insulation layer, first via wirings formed in the first through holes, a conductive pattern connected to the first via wirings, recesses formed in the first via wirings, and a protective insulation layer covering the conductive pattern and the first via wirings. The first via wirings, the conductive pattern, the recesses, and the protective insulation layer form an identification mark identifiable as a particular shape including a character or a symbol. Each recess is defined by an upper surface of the corresponding first via wiring and includes a curved side wall and a bottom wall that is located at a lower position than an upper surface of the conductive pattern. The protective insulation layer is thicker over the first via wirings than over the conductive pattern.

Abstract: To provide a graphene sheet that has a large area, is homogeneous, and has a small amount of domain boundaries, a novel method for producing a graphene sheet suitable for industrial applications, such as application to electronics, that is capable of producing a graphene sheet that has well aligned crystal orientation at a low cost, and a graphene sheet. In the method for producing a graphene sheet of the present invention, a substrate containing a single crystal substrate having formed on the surface thereof an epitaxial metal film is used, and a graphene sheet is grown by making a carbon material into contact with the surface of the epitaxial metal film. In the graphene sheet of the present invention, the graphene sheet is constituted by a number of graphene domains, the domains each have an area of from 0.000001 ?m2 to 100,000 mm2, and the orientations of 6-membered rings in the domains are averagely aligned in a single direction over the graphene sheet.

Abstract: There is prepared an insulation layer generation member having a support film and a semi-cured insulation layer provided on a surface of the support film. Subsequently, the insulation layer generation member is affixed to a pad such that the pad contacts the semi-cured insulation layer. The semi-cured insulation layer is cured, to thus generate an insulation layer. Subsequently, the insulation layer is exposed to laser by way of the support film, thereby opening an opening in the insulation layer.

Abstract: There is prepared an insulation layer generation member having a support film and a semi-cured insulation layer provided on a surface of the support film. Subsequently, the insulation layer generation member is affixed to a pad such that the pad contacts the semi-cured insulation layer. The semi-cured insulation layer is cured, to thus generate an insulation layer. Subsequently, the insulation layer is exposed to laser by way of the support film, thereby opening an opening in the insulation layer.

Abstract: To provide a graphene sheet that has a large area, is homogeneous, and has a small amount of domain boundaries, a novel method for producing a graphene sheet suitable for industrial applications, such as application to electronics, that is capable of producing a graphene sheet that has well aligned crystal orientation at a low cost, and a graphene sheet. In the method for producing a graphene sheet of the present invention, a substrate containing a single crystal substrate having formed on the surface thereof an epitaxial metal film is used, and a graphene sheet is grown by making a carbon material into contact with the surface of the epitaxial metal film. In the graphene sheet of the present invention, the graphene sheet is constituted by a number of graphene domains, the domains each have an area of from 0.000001 ?m2 to 100,000 mm2, and the orientations of 6-membered rings in the domains are averagely aligned in a single direction over the graphene sheet.

Abstract: There is prepared an insulation layer generation member having a support film and a semi-cured insulation layer provided on a surface of the support film. Subsequently, the insulation layer generation member is affixed to a pad such that the pad contacts the semi-cured insulation layer. The semi-cured insulation layer is cured, to thus generate an insulation layer. Subsequently, the insulation layer is exposed to laser by way of the support film, thereby opening an opening in the insulation layer.

Abstract: There is prepared an insulation layer generation member having a support film and a semi-cured insulation layer provided on a surface of the support film. Subsequently, the insulation layer generation member is affixed to a pad such that the pad contacts the semi-cured insulation layer. The semi-cured insulation layer is cured, to thus generate an insulation layer. Subsequently, the insulation layer is exposed to laser by way of the support film, thereby opening an opening in the insulation layer.

Abstract: A stacked battery module or a battery pack is formed by laying a plurality of unit batteries of non-aqueous electrolyte batteries in layers with the surfaces thereof having a large area disposed vis-à-vis and electrically connecting them in series and a temperature fuse is arranged in the central part of the stacked battery module with one of its terminals connected to either the positive electrode terminal or the negative electrode terminal of the stacked battery module while the other terminal connected to a charging terminal for supplying a charging current in a charging operation. One of the terminals of the stacked battery module is connected to a discharging terminal for taking out a discharging current in a discharging operation and the other terminal of the stacked battery module is a common terminal for charging and discharging operations.

Abstract: There is prepared an insulation layer generation member having a support film and a semi-cured insulation layer provided on a surface of the support film. Subsequently, the insulation layer generation member is affixed to a pad such that the pad contacts the semi-cured insulation layer. The semi-cured insulation layer is cured, to thus generate an insulation layer. Subsequently, the insulation layer is exposed to laser by way of the support film, thereby opening an opening in the insulation layer.

Abstract: A humidifier is superior in terms of hygiene, simple in terms of maintenance, humidity is easily adjusted, and energy consumption is low. The humidifier uses, as a moisture permeable membrane, a moisture-permeable polyurethane obtained by using, as raw materials, at least an isocyanate component, a diol as a chain extender, and polyethylene glycol as a polyol component, and reacting these raw materials.

Abstract: A stacked battery module or a battery pack is formed by laying a plurality of unit batteries of non-aqueous electrolyte batteries in layers with the surfaces thereof having a large area disposed vis-à-vis and electrically connecting them in series and a temperature fuse is arranged in the central part of the stacked battery module with one of its terminals connected to either the positive electrode terminal or the negative electrode terminal of the stacked battery module while the other terminal connected to a charging terminal for supplying a charging current in a charging operation. One of the terminals of the stacked battery module is connected to a discharging terminal for taking out a discharging current in a discharging operation and the other terminal of the stacked battery module is a common terminal for charging and discharging operations.

Abstract: There is provided a humidifier superior in terms of hygiene, simple in terms of maintenance, wherein humidity is easily adjusted, and energy consumption is low. The humidifier uses as a moisture permeable membrane, a moisture-permeable polyurethane obtained by using as raw materials, at least an isocyanate component, a diol as a chain extender, and polyethylene glycol as a polyol component, and reacting these raw materials.

Abstract: The present invention is an improvement of a semiconductor memory device, preferably a PROM or a mask ROM, wherein: MOS transistors are formed in a semiconductor substrate, are arranged in rows, and are isolated from each other by a plurality of field insulation films arranged in an island pattern; the MOS transistors aligned in one of the rows have one common gate which extends over one row of field insulation films; the MOS transistors aligned in one of the rows have a common first region for forming a drain or a source parallel to the common gates; and a second region for forming another drain or source is surrounded by a pair of common gates and a pair of field insulation films so that a plurality of second regions are isolated from each other.