Abstract: A system for producing thermally stable cutting elements may include a heat source, a pressure vessel, at least one polycrystalline diamond body attached to a carbide substrate, and a leaching agent is disclosed, wherein the heat source includes a container comprising at least one receiving mechanism and at least one retention mechanism, and wherein the carbide substrate is disposed in the at least one receiving mechanism of the pressure vessel, and wherein the leaching agent is disposed in the pressure vessel, and wherein the leaching agent removes the catalyzing material from the interstitial spaces interposed between the diamond particles of the at least one polycrystalline diamond body, and wherein the at least one retention mechanism of the pressure vessel seals at least a portion of the carbide substrate into the at least one receiving mechanism and prevents the leaching agent from contacting at least a portion of the carbide substrate.

Abstract: A sintered body for cutting tools that includes hard particle phase comprising a plurality of hard particles, wherein at least a portion of the hard phase particles comprise a coating deposited by atomic layer deposition disposed thereon; and a binder phase is disclosed. The hard particles that may be included in the sintered bodies may include tungsten carbide, diamond, and boron nitride particles.

Abstract: A method for facilitating infiltration of an infiltrant material into a TSP material during re-bonding of the TSP material to a substrate, by enhancing the porosity of the TSP material near the interface with the substrate is provided. Cutting elements formed by such method and downhole tools including such cutting elements are also provided.

Abstract: Diamond bonded constructions comprise a body comprising a plurality of bonded together diamond grains with interstitial regions disposed between the grains that are substantially free of the catalyst material used to initially sinter the body. A metallic substrate is attached to the body, and a braze joint is interposed between the body and the substrate. The body is metallized to include a metallic material disposed along a substrate attachment surface in contact with the braze joint, wherein the metallic material is different from the braze joint material. The metallic material may exist within a region of the body extending fully or partially into the body, and/or may exist as a layer extending away from the substrate attachment surface. The body includes a working surface characterized by empty interstitial regions or by interstitial regions filled with an infiltrant material, wherein the infiltrant material is different from the metallizing material.

Abstract: Thermally stable polycrystalline constructions include a body having a polycrystalline ultra-hard phase and a plurality of empty voids. The construction includes a backside support member over at least a portion of the backside surface of the body and a sidewall support member over at least a portion of the sidewall surface of the body extending an axial distance along at least a portion of the body and at least partially covering a circumferential surface of the body. The construction has a compressive stress exerted on the body.

Abstract: Diamond bonded constructions include a diamond body comprising intercrystalline bonded diamond and interstitial regions. The body has a working surface and an interface surface, and may be joined to a metallic substrate. The body has a gradient diamond volume content greater about 1.5 percent, wherein the diamond content at the interface surface is less than 94 percent, and increases moving toward the working surface. The body may include a region that is substantially free of a catalyst material otherwise disposed within the body and present in a gradient amount. An additional material may be included within the body and be present in a changing amount. The body may be formed by high-pressure HPHT processing, e.g., from 6,200 MPa to 10,000 MPa, to produce a sintered body having a characteristic diamond volume fraction v. average grain size relationship distinguishable from that of diamond bonded constructions form by conventional-pressure HPHT processing.

Abstract: A method for facilitating infiltration of an infiltrant material into a TSP material during re-bonding of the TSP material to a substrate, by enhancing the porosity of the TSP material near the interface with the substrate is provided. Cutting elements formed by such method and downhole tools including such cutting elements are also provided.

Abstract: Diamond bonded constructions comprise a body comprising a plurality of bonded together diamond grains with interstitial regions disposed between the grains that are substantially free of the catalyst material used to initially sinter the body. A metallic substrate is attached to the body, and a braze joint is interposed between the body and the substrate. The body is metallized to include a metallic material disposed along a substrate attachment surface in contact with the braze joint, wherein the metallic material is different from the braze joint material. The metallic material may exist within a region of the body extending fully or partially into the body, and/or may exist as a layer extending away from the substrate attachment surface. The body includes a working surface characterized by empty interstitial regions or by interstitial regions filled with an infiltrant material, wherein the infiltrant material is different from the metallizing material.

Abstract: The present disclosure relates in one aspect to a cutting element comprising a substrate and a cutting layer disposed on a surface of the substrate. The cutting layer comprises an ultra hard material. The substrate comprises tungsten carbide and a metal binder. The substrate has a magnetic saturation value in the range of from 80 to less than 85%. In another aspect, the magnetic saturation value may increase within the substrate along a gradient, wherein proximal to the interface with the cutting layer, the substrate has a magnetic saturation value in the range of from 80 to less than 85%. Also included are drill bits incoiporating such cutting elements. Additionally, the present disclosure relates to methods of manufacturing cutting elements.

Abstract: Thermally stable polycrystalline constructions comprise a body having a polycrystalline ultra-hard phase and a plurality of empty voids. A population of the voids can be filled with a reaction product. The body is substantially free of a catalyst material. The construction comprises a first support member attached to the body by a first braze material. A second support member is attached to the body and the first support member by a second braze material. The construction may include a third support member attached to the body that is integral or separate from one of the other support members. The braze materials used to attached the support members can be the same or different, as can be the materials used to form the different support members.

Abstract: A method of forming a polycrystalline diamond body includes mixing a sintering agent with diamond powder to form a premixed layer, the sintering agent including at least one alkaline eat mewl carbonate; forming an infiltration layer adjacent to the premixed layer, the infiltration layer including an infiltrant material including at least one alkaline earth metal carbonate; and subjecting the premixed layer and the infiltration layer to high pressure high temperature conditions.

Abstract: A method of making a polycrystalline diamond compact includes forming multiple layers of premised diamond particles and carbonate material, where the carbonate material includes an alkaline earth metal, carbonate, and where each layer has a weight percent ratio of diamond to carbonate that is different from adjacent layers. The layers are subjected to high pressure high temperature conditions to form polycrystalline diamond.

Abstract: The present disclosure relates to cutting elements incorporating polycrystalline diamond bodies used for subterranean drilling applications, and more particularly, to polycrystalline diamond bodies having a high diamond content which are configured to provide improved properties of thermal stability and wear resistance, while maintaining a desired degree of impact resistance, when compared to prior polycrystalline diamond bodies. In various embodiments disclosed herein, a cutting element with high diamond content includes a modified PCD structure and/or a modified interface (between the PCD body and a substrate), to provide superior performance.

Abstract: Diamond bonded constructions comprise a polycrystalline diamond body having a matrix phase of bonded-together diamond grains and a plurality of interstitial regions between the diamond grains including a catalyst material used to form the diamond body disposed within the interstitial regions. A sintered thermally stable diamond element is disposed within and bonded to the diamond body, and is configured and positioned to form part of a working surface. The thermally stable diamond element is bonded to the polycrystalline diamond body, and a substrate is bonded to the polycrystalline diamond body. The thermally stable diamond element comprises a plurality of bonded-together diamond grains and interstitial regions, wherein the interstitial regions are substantially free of a catalyst material used to make or sinter the thermally stable diamond element. A barrier material may be disposed over or infiltrated into one or more surfaces of the thermally stable diamond element.

Abstract: Thermally stable diamond bonded construction comprise a diamond bonded body including a thermally stable region, comprising a plurality of diamond grains bonded together by a reaction product of the diamond grains with a reactant such as Si, and a polycrystalline diamond region, comprising intercrystalline bonded diamond and a catalyst material. The body further comprises a ceramic compound formed by reaction of an Nb, Zr, Ti, or Mo getter material with a gaseous element generated during HPHT sintering of the diamond bonded body. The diamond bonded body may comprise from 0.1 to 15 percent by weight of the ceramic compound. The diamond bonded body can be formed during a single HPHT process operated at different temperatures when the reactant has a melting temperature above the catalyst material. The construction may include a metallic substrate attached to the diamond bonded body to facilitate use as a wear or cutting element.

Abstract: Methods and systems of attaching a thermally stable polycrystalline diamond (TSP) material layer to a substrate. The methods include placing a braze material between the TSP material layer and the substrate, pressing at least one of the TSP material layer and substrate against the other of the TSP material layer and the substrate, heating the braze material to a temperature of at least 800° C., and cooling the braze forming a bond attaching the TSP material layer to the substrate.

Abstract: Diamond bonded constructions include a diamond body comprising intercrystalline bonded diamond and interstitial regions. The body has a working surface and an interface surface, and may be joined to a metallic substrate. The body has a gradient diamond volume content greater about 1.5 percent, wherein the diamond content at the interface surface is less than 94 percent, and increases moving toward the working surface. The body may include a region that is substantially free of a catalyst material otherwise disposed within the body and present in a gradient amount. An additional material may be included within the body and be present in a changing amount. The body may be formed by high-pressure HPHT processing, e.g., from 6,200 MPa to 10,000 MPa, to produce a sintered body having a characteristic diamond volume fraction v. average grain size relationship distinguishable from that of diamond bonded constructions form by conventional-pressure HPHT processing.

Abstract: Polycrystalline ultra-hard compact constructions comprise a polycrystalline ultra-hard compact having a polycrystalline ultra-hard body attached to a substrate. A support member is attached to the compact by a braze material. The support member can have a one-piece construction including one or more support sections. The support member has a first section extending axially along a wall surface of the compact, and extending circumferentially along a portion of the compact. The support member can include a second section extending radially along a backside surface of the compact, and/or a third section extending radially along a front side surface of the compact. In one embodiment, the support member includes a second and/or third section and the compact disposed therein is in an axially compressed state. The support member is interposed between the compact and an end-use device to improve the compact attachment strength with respect to the end-use device.

Abstract: Ultra-hard constructions comprise a sintered diamond-bonded body comprising a matrix of bonded-together diamond grains and a plurality of interstitial regions substantially free of a catalyst material. A metal material comprising a carbide constituent is disposed on a substrate interface surface of the diamond body. A substrate is attached to the diamond-bonded body through a braze joint interposed between the metal material and the substrate. The braze joint is formed from a non-active braze material that reacts with the substrate and metal material. The braze joint is formed at the melting temperature of the non-active braze material in the absence of high-pressure conditions. In an example embodiment, the non-active braze material reacts with the carbide constituent in the metal material. Example materials useful for forming the non-active braze material include those selected from Cu, Ni, Mn, Au, Pd, and combinations and alloys thereof.

Abstract: Ultra-hard constructions comprise polycrystalline diamond-body having a first metallic substrate attached thereto, and having a second metallic substrate attached to the first metallic substrate. The first and second substrates each comprise a first hard particle phase, e.g., WC, and a second binder material phase, e.g., Co, wherein the hard particles in the second substrate are sized larger than those in the first substrate. The first substrate may contain a larger amount of binder material than the second substrate. Constructed in this matter, the first substrate is engineered to facilitate sintering diamond body during HPHT conditions, while the second substrate is engineered to provide an improved degree of erosion resistance when placed in an end-use application. The construction may be formed during a single HPHT process. The second substrate may comprise 80 percent or more of the combined thickness of the first and second substrates.