Abstract: An array of microcavity plasma devices is formed in a ceramic substrate that provides structure for and isolation of an array of microcavities that are defined in the ceramic substrate. The ceramic substrate isolates the microcavities from electrodes disposed within the ceramic substrate. The electrodes are disposed to ignite a discharge in microcavities in the array of microcavities upon application of a time-varying potential between the electrodes. Embodiments of the invention include electrode and microcavity arrangements that permit addressing of individual microcavities or groups of microcavities. The contour of the microcavity wall allows for the electric field within the microcavity to be shaped.

Abstract: Microcavity plasma devices and arrays of microcavity plasma devices are provided that have a reduced excitation voltage. A trigger electrode disposed proximate to a microcavity reduce the excitation voltage required between first and second electrodes to ignite a plasma in the microcavity when gas(es) or vapor(s) (or combinations thereof) are contained within the microcavity. The invention also provides symmetrical microplasma devices and arrays of microcavity plasma devices for which current waveforms are the same for each half-cycle of the voltage driving waveform. Additionally, the invention also provides devices that have standoff portions and voids that can reduce cross talk. The devices are preferably also used with a trigger electrode.

Abstract: A microdischarge device that includes one or more electrodes encapsulated in a nanoporous dielectric. The devices include a first electrode encapsulated in the nanoporous dielectric and a second electrode that may also be encapsulated with the dielectric. The electrodes are configured to ignite a microdischarge in a microcavity when an AC or a pulsed DC excitation potential is applied between the first and second electrodes. The devices include linear and planar arrays of microdischarge devices. The microcavities in the planar arrays may be selectively excited for display applications.

Abstract: An AC, rf, or pulse-excited microdischarge device and array are provide by the invention. A preferred array includes a substrate. A plurality of microdischarge cavities that contain discharge medium are in the substrate. A transparent layer seals the discharge medium in the microdischarge cavites. Electrodes stimulate the discharge medium. The microdischarge cavities are physically isolated from the electrodes by dielectric and arranged relative to the electrodes such that ac, rf, or pulsed excitation applied to the electrodes stimulates plasma excitation of the discharge medium. The microdischarge cavities are sized to produce plasma within the microdischarge cavities.

Abstract: A preferred embodiment microplasma device includes first and second substrates. An electrode array is disposed on the first substrate. Cavities are formed in the second substrate by laser micromachining, etching, or by chemical (wet or dry) etching and the second substrate is overlaid on the electrode array. The inter-electrode spacing and electrode width are set so that each cavity has at least one pair of electrodes underneath it to excite a microplasma discharge in the cavity. A need to precisely register the two substrates is avoided.

Abstract: A preferred embodiment plasma extraction microcavity plasma device generates a spatially-confined plasma in a gas or vapor, or gas and vapor mixture, including, for example, atmospheric pressure air. A microcavity plasma device is excited by a potential applied between excitation electrodes of the microcavity plasma device, and a probe electrode proximate the microcavity is maintained at the potential of one of the electrodes, extracts plasma from the microcavity plasma device. In preferred embodiments, the excitation electrodes of the microcavity plasma device are isolated from the plasma by dielectric, and time-varying (AC, RF, bipolar or pulsed DC, etc.) potential excites a plasma that is then extracted by the probe electrode. In alternate embodiments, the microcavity plasma device has an excitation electrode that contacts the plasma. A DC potential excites a plasma that is then extracted by the probe electrode.

Abstract: A method for fabricating microcavity discharge devices and arrays of devices. The devices are fabricated by layering a dielectric on a first conducting layer. A second conducting layer or structure is overlaid on the dielectric layer. In some devices, a microcavity is created that penetrates the second conducting layer or structure and the dielectric layer. In other devices, the microcavity penetrates to the first conducting layer. The second conducting layer or structure together with the inside face of the microcavity is overlaid with a second dielectric layer. The microcavities are then filled with a discharge gas. When a time-varying potential of the appropriate magnitude is applied between the conductors, a microplasma discharge is generated in the microcavity. These devices can exhibit extended lifetimes since the conductors are encapsulated, shielding the conductors from degradation due to exposure to the plasma. Some of the devices are flexible and the dielectric can be chosen to act as a mirror.

Abstract: A method for fabricating microcavity discharge devices and arrays of devices. The devices are fabricated by layering a dielectric on a first conducting layer. A second conducting layer or structure is overlaid on the dielectric layer. In some devices, a microcavity is created that penetrates the second conducting layer or structure and the dielectric layer. In other devices, the microcavity penetrates to the first conducting layer. The second conducting layer or structure together with the inside face of the microcavity is overlaid with a second dielectric layer. The microcavities are then filled with a discharge gas. When a time-varying potential of the appropriate magnitude is applied between the conductors, a microplasma discharge is generated in the microcavity. These devices can exhibit extended lifetimes since the conductors are encapsulated, shielding the conductors from degradation due to exposure to the plasma. Some of the devices are flexible and the dielectric can be chosen to act as a mirror.

Abstract: A preferred embodiment microcavity plasma device array of the invention includes a plurality of first metal circumferential metal electrodes that surround microcavities in the device. The first circumferential electrodes are buried in a metal oxide layer and surround the microcavities in a plane transverse to the microcavity axis, while being protected from plasma in the microcavities by the metal oxide. In embodiments of the invention, the circumferential electrodes can be connected in patterns. A second electrode(s) is arranged so as to be isolated from said first electrodes by said first metal oxide layer. In some embodiments, the second electrode(s) is in a second layer, and in other embodiments the second electrode(s) is also within the first metal oxide layer. A containing layer, e.g., a thin layer of glass, quartz, or plastic, seals the discharge medium (plasma) into the microcavities. In a preferred method of formation embodiment, a metal foil or film is obtained or formed with micro-holes.

Abstract: The invention concerns microcavity plasma devices and arrays with thin foil metal electrodes protected by metal oxide dielectric. Devices of the invention are amenable to mass production techniques, and may, for example, be fabricated by roll to roll processing. Exemplary devices of the invention are flexible. Embodiments of the invention provide for large arrays of microcavity plasma devices that can be made inexpensively. The structure of preferred embodiment microcavity plasma devices of the invention is based upon thin foils of metal that are available or can be produced in arbitrary lengths, such as on rolls. In a device of the invention, a pattern of microcavities is produced in a metal foil. Oxide is subsequently grown on the foil and within the microcavities (where plasma is to be produced) to protect the microcavity and electrically isolate the foil. A second metal foil is also encapsulated with oxide and is bonded to the first encapsulated foil.

Abstract: Microcavity plasma devices and arrays of microcavity plasma devices are provided that have a reduced excitation voltage. A trigger electrode disposed proximate to a microcavity reduce the excitation voltage required between first and second electrodes to ignite a plasma in the microcavity when gas(es) or vapor(s) (or combinations thereof) are contained within the microcavity. The invention also provides symmetrical microplasma devices and arrays of microcavity plasma devices for which current waveforms are the same for each half-cycle of the voltage driving waveform. Additionally, the invention also provides devices that have standoff portions and voids that can reduce cross talk. The devices are preferably also used with a trigger electrode.

Abstract: The invention provides methods of making arrays of thin sheet microdischarge devices. In a preferred method of fabricating an array of microdischarge devices, a multi-layer dielectric layer thin sheet is position with respect to a first thin electrode. A second electrode thin sheet is joined on the dielectric layer sheet. An array of microcavities is provided through at least a portion of the dielectric layer sheet. The method can produce thin large arrays inexpensively. In preferred embodiments, each of the multi-layer dielectric layer thin sheet, the first thin electrode and the second electrode thin sheet have a thickness of less than less than 100 ?m. In preferred embodiments, the multi-layer dielectric is formed of polymer, and in other embodiments from oxides and/or nitrides. In a particular preferred embodiment, the multilayer dielectric is formed from oxide and nitride films.

Abstract: The invention is directed to a method and apparatus for phase-locking microdischarge device arrays and an ac, rf, or pulse-excited microdischarge. The invention provides output from a non-laser optical source that is a phase-locked array of microdischarges formed of microdischarge cavities containing discharge filler and excitation electrodes. In exemplary embodiments, entire arrays of microdischarge device optical emitters that are not lasers can be fabricated into a surface area having a largest dimension smaller than the coherence length of at least one of the emissions produced by the individual elements. In other embodiments, arrays of microdischarge devices configured in a Fresnel pattern constitute a lens suitable for both producing and focusing light.

Abstract: A method for fabricating dielectric encapsulated electrodes. The process includes anodizing a metal to form a dielectric layer with columnar micropores; dissolving a portion of the dielectric layer and then anodizing the resultant structure a second time. The nanoporous structure that results can provide properties superior to those of conventional dielectric encapsulated metals. The pores of the dielectric may be backfilled with one or more materials to further tailor the properties of the dielectric.

Abstract: A preferred embodiment plasma extraction microcavity plasma device generates a spatially-confined plasma in a gas or vapor, or gas and vapor mixture, including, for example, atmospheric pressure air. A microcavity plasma device is excited by a potential applied between excitation electrodes of the microcavity plasma device, and a probe electrode proximate the microcavity is maintained at the potential of one of the electrodes, extracts plasma from the microcavity plasma device. In preferred embodiments, the excitation electrodes of the microcavity plasma device are isolated from the plasma by dielectric, and time-varying (AC, RF, bipolar or pulsed DC, etc.) potential excites a plasma that is then extracted by the probe electrode. In alternate embodiments, the microcavity plasma device has an excitation electrode that contacts the plasma. A DC potential excites a plasma that is then extracted by the probe electrode.

Abstract: Field emission nanostructures assist operation of a microdischarge device. The field emission nanostructures are integrated into the microdischarge device(s) or are situated near an electrode of the microdischarge device(s). The field emission nanostructures reduce operating and ignition voltages compared to otherwise identical devices lacking the field emission nanostructures, while also increasing the radiative output of the microdischarge device(s).

Abstract: A microdischarge device has a semiconductor layer, an intermediate layer, and a conductive layer. A tapered cavity is disposed in at least the semiconductor layer.

Abstract: A microdischarge device that includes one or more electrodes encapsulated in a nanoporous dielectric. The devices include a first electrode encapsulated in the nanoporous dielectric and a second electrode that may also be encapsulated with the dielectric. The electrodes are configured to ignite a microdischarge in a microcavity when an AC or a pulsed DC excitation potential is applied between the first and second electrodes. The devices include linear and planar arrays of microdischarge devices. The microcavities in the planar arrays may be selectively excited for display applications.

Abstract: A method for fabricating dielectric encapsulated electrodes. The process includes anodizing a metal to form a dielectric layer with columnar micropores; dissolving a portion of the dielectric layer and then anodizing the resultant structure a second time. The nanoporous structure that results can provide properties superior to those of conventional dielectric encapsulated metals. The pores of the dielectric may be backfilled with one or more materials to further tailor the properties of the dielectric.

Abstract: A discharge device is described that contains an anode, a cathode, and an insulating layer disposed between the anode and the cathode. A cavity is extends entirely through at least one of the anode or cathode and penetrates the dielectric layer. At least one of the anode or cathode may include a screen or the dielectric layer may have a plurality of films with at least two different dielectric constants. The voltage differences between the anode and cathode in each of multiple devices electrically connected together may be limited.