Abstract: A memory device includes multiple memory cells configured to store data. The memory device also includes multiple digit lines each configured to carry data to and from a respective memory cell. The memory device further includes multiple sense amplifiers each selectively coupled to respective digit lines and including first and second NMOS transistors and first and second gut nodes coupled to the first and second NMOS transistors, respectively. Each sense amplifier is configured to perform threshold compensation for the first and second NMOS transistors by storing respective voltages at the first and second gut nodes that are proportional to the respective threshold voltages of the first and second NMOS transistors. The sense amplifier also amplifies a differential voltage between the first and second gut nodes by charging the first gut node and discharging the second gut node based at least in part on respective charges of the digit lines.

Abstract: A memory device includes multiple memory cells configured to store data. The memory device also includes multiple digit lines each configured to carry data to and from a respective memory cell. The memory device further includes multiple sense amplifiers each selectively coupled to respective digit lines and including first and second NMOS transistors and first and second gut nodes coupled to the first and second NMOS transistors, respectively. Each sense amplifier is configured to perform threshold compensation for the first and second NMOS transistors by storing respective voltages at the first and second gut nodes that are proportional to the respective threshold voltages of the first and second NMOS transistors. The sense amplifier also amplifies a differential voltage between the first and second gut nodes by charging the first gut node and discharging the second gut node based at least in part on respective charges of the digit lines.

Abstract: Apparatuses, systems, and methods for compensated sense amplifier with crosscoupled n-type transistors. A sense amplifier has a pair of p-type transistors coupled between a system voltage and respective first and second gut nodes. When a command signal is active, the p-type transistors are coupled in a diode fashion from the system voltage to the respective gut nodes. The amplifier also has a pair of n-type transistors which are cross coupled, where a first n-type transistor has a node coupled to the first gut node and a gate coupled to the second gut node and the second n-type transistor has a node coupled to the second gut node and a gate coupled to the first gut node. Each of the n-type transistors may have a separate current flowing through them and respective one of a pair of feedback transistors to a ground voltage.

Abstract: Some embodiments include a memory device having a buried wordline, a shield plate, and an access device. The access device includes first and second diffusion regions and a channel region. The diffusion regions and the channel region are arranged vertically so that the channel region is between the first and second diffusion regions. The wordline is adjacent to a first side surface of the channel region, and the shield plate is adjacent to a second side surface of the channel region; with the first and second side surfaces being in opposing relation to one another. Some embodiments include methods of forming integrated assemblies.

Abstract: Methods of operating memory devices are disclosed. A method may include activating a first, target word line. The method may also include coupling a second word line adjacent the first, target word line to an associated first main word line while the first, target word line is activated. Further, the method may include coupling the associated main word line to a negative word line voltage while the first, target word line is activated. Associated circuits, devices, and systems are also disclosed.

Abstract: Memory devices are disclosed. A device may include a number of word line drivers, wherein each word line driver of the number of word line drivers including a first transistor and a second transistor. The device may also include a number of first driver gates, wherein the first transistor of each word line driver has a gate coupled to a dedicated first driver gate of the number of driver gates. Further, the device may include a second driver gate coupled to a gate of each second transistor of each of the number of word line drivers. Associated circuits, methods, and systems are also disclosed.

Abstract: Apparatuses, systems, and methods for single-ended sense amplifiers. A memory device may include a number of sense amplifiers used to read the voltage of memory cells along digit lines. Double-ended sense amplifiers are coupled to two digit lines. Single-ended sense amplifiers are coupled to a single digit line. The memory cells of an edge word line of a memory array may alternately be coupled to a single-ended sense amplifier or a double-ended sense amplifier. The use of single-ended sense amplifiers may reduce a footprint for a given number of memory cells in the array.

Abstract: Apparatuses and methods are disclosed that include ferroelectric memory and for operating ferroelectric memory. An example apparatus includes a capacitor having a first plate, a second plate, and a ferroelectric dielectric material. The apparatus further includes a first digit line and a first selection component configured to couple the first plate to the first digit line, and also includes a second digit line and a second selection component configured to couple the second plate to the second digit line.

Abstract: An access line multiplexor can be formed under vertically stacked tiers of memory cells. The multiplexor can include a first transistor coupled to a vertical access line, to a horizontal access line, and to a second transistor. The second transistor can be coupled to a power supply. The transistors can be n-type metal oxide semiconductor transistors.

Abstract: An access line multiplexor can be formed under vertically stacked tiers of memory cells. The multiplexor can include a first transistor coupled to a vertical access line, to a horizontal access line, and to a second transistor. The second transistor can be coupled to a power supply. The transistors can be n-type metal oxide semiconductor transistors.

Abstract: Apparatuses and methods are disclosed that include ferroelectric memory and for operating ferroelectric memory. An example apparatus includes a capacitor having a first plate, a second plate, and a ferroelectric dielectric material. The apparatus further includes a first digit line and a first selection component configured to couple the first plate to the first digit line, and also includes a second digit line and a second selection component configured to couple the second plate to the second digit line.

Abstract: Some embodiments include an integrated assembly having first and second wordlines coupled with DRIVER circuitry. The first wordline has a first end distal from the DRIVER circuitry, and the second wordline has a second end distal from the DRIVER circuitry. A switch is adjacent to the first end and is configured to couple said first end to one or both of the second end and a LOW-VOLTAGE-REFERENCE-SOURCE (e.g., a VNWL supply) during a transition of the first wordline from an “ON” state to an “OFF” state.

Abstract: Apparatuses and methods are disclosed that include ferroelectric memory and for operating ferroelectric memory. An example apparatus includes a capacitor having a first plate, a second plate, and a ferroelectric dielectric material. The apparatus further includes a first digit line and a first selection component configured to couple the first plate to the first digit line, and also includes a second digit line and a second selection component configured to couple the second plate to the second digit line.

Abstract: An apparatus includes a plurality of main word line circuits. Each main word line circuit drives a respective global word line to one of an active state value, an intermediate voltage state, or a pre-charge state. The intermediate voltage state voltage is below the active state voltage and above the pre-charge state voltage. The memory device also includes a plurality of sub-word line drivers. Each sub-word line driver is connected to a corresponding global word line and configured to drive a respective local word line between the corresponding global word line voltage and a low voltage value. The apparatus further includes a plurality of phase drivers. Each phase driver is connected to a predetermined number of sub-word line drivers, where each of the predetermined number of sub-word line drivers connects to a different global word line.

Abstract: Apparatuses and methods are disclosed that include ferroelectric memory cells. An example ferroelectric memory cell includes two transistors and two capacitors. Another example ferroelectric memory cell includes three transistors and two capacitors. Another example ferroelectric memory cell includes four transistors and two capacitors.

Abstract: Some embodiments include an integrated assembly having a first digit line coupled with SENSE AMPLIFIER circuitry. The first digit line has a first region distal from the SENSE AMPLIFIER circuitry. A second digit line is coupled with the SENSE AMPLIFIER circuitry and has a second region distal from the SENSE AMPLIFIER circuitry. PRECHARGE circuitry includes one or more first equalization transistors proximate the first and second regions, and includes a second equalization transistor proximate the SENSE AMPLIFIER circuitry. Some embodiments include an integrated assembly having a first digit line coupled with SENSE AMPLIFIER circuitry. The first digit line has a first region distal from the SENSE AMPLIFIER circuitry. A second digit line is coupled with the SENSE AMPLIFIER circuitry and has a second region distal from the SENSE AMPLIFIER circuitry. PRECHARGE circuitry includes an electrical connection coupling the first and second regions to one another.

Abstract: Apparatuses and methods are disclosed that include ferroelectric memory and for accessing ferroelectric memory. An example method includes increasing a voltage of a first cell plate of a capacitor to change the voltage of a second cell plate of the capacitor, a second digit line, and a second sense node. The voltage of the second cell plate and the second digit line is decreased to change the voltage of the first cell plate, a first digit line, and a first sense node. The first node is driven to a first voltage and the second node is driven to a second voltage responsive to the voltage of the first node being greater than the second node. The first node is driven to the second voltage and the second node is driven to the first voltage responsive to the voltage of the first node being less than the second node.

Abstract: A main word line circuit provides a first and second row factor signals. The main word line circuit includes a pull-up circuit to drive a global word line to follow a first decoded address signal when the first row factor signal is at a first value. The main word line circuit includes an intermediate voltage circuit to drive the global word line to follow a value of the second row factor signal. A processing device drives the global word line to an active state by setting the first row factor signal to the first value when the first decoded address signal is at a high state, and drives the global word line to follow a value of the second row factor signal by setting the first row factor signal to the second value while the first decoded address signal is at the high state.

Abstract: An apparatus includes a plurality of main word line circuits. Each main word line circuit drives a respective global word line to one of an active state value, an intermediate voltage state, or a pre-charge state. The intermediate voltage state voltage is below the active state voltage and above the pre-charge state voltage. The memory device also includes a plurality of sub-word line drivers. Each sub-word line driver is connected to a corresponding global word line and configured to drive a respective local word line between the corresponding global word line voltage and a low voltage value. The apparatus further includes a plurality of phase drivers. Each phase driver is connected to a predetermined number of sub-word line drivers, where each of the predetermined number of sub-word line drivers connects to a different global word line.

Abstract: Some embodiments include a memory device having a buried wordline, a shield plate, and an access device. The access device includes first and second diffusion regions and a channel region. The diffusion regions and the channel region are arranged vertically so that the channel region is between the first and second diffusion regions. The wordline is adjacent to a first side surface of the channel region, and the shield plate is adjacent to a second side surface of the channel region; with the first and second side surfaces being in opposing relation to one another. Some embodiments include methods of forming integrated assemblies.