Abstract: A lamp for general lighting applications utilizes solid state light emitters and provides light output that may approximate light emissions from of an incandescent lamp. An exemplary lamp includes a bulb and a pedestal extending into the bulb that supports the light emitters in orientations such that emissions from the emitters through the bulb approximate emissions from a filament of an incandescent lamp. An inner member around the emitters and the pedestal provides further light processing, e.g. diffusing and/or phosphor luminescence. The lamp conforms to form factors and/or uses lamp base connectors of common incandescent lamps and/or compact fluorescent lamps. For efficient substitution of components during manufacture of lamps to different specifications, at least some examples use modular couplings for the parts of the lamp to the heat sink or other housing, such as for couplings of the lamp base, the bulb and the inner light processing member (if provided).

Abstract: A lamp, for general lighting applications, utilizes solid state light emitting sources to produce and distribute white light. The exemplary lamp also includes elements to dissipate the heat generated by the solid state light emitting sources. The lamp includes a thermal handling system having a heat sink and a thermal core made of a thermally conductive material to dissipate the heat generated by the solid state light emitting sources to a point outside the lamp.

Abstract: The present subject matter relates to lamps for general lighting applications. More specifically, white light lamps described herein use semiconductor source to pump remotely deployed phosphor to produce light of desired characteristics. The lamps conform to form factors and/or use lamp base connectors of widely accepted lamp designs, such as those of common incandescent lamps and/or compact fluorescent lamps.

Abstract: A lamp, for general lighting applications, utilizes solid state light emitting sources to produce and distribute white light. The exemplary lamp also includes elements to dissipate the heat generated by the solid state light emitting sources. The lamp includes a thermal handling system having a heat sink and a thermal core made of a thermally conductive material to dissipate the heat generated by the solid state light emitting sources to a point outside the lamp.

Abstract: A lamp, for general lighting applications, utilizes solid state light emitting sources to produce and distribute white light. The exemplary lamp also includes elements to dissipate the heat generated by the solid state light emitting sources. The lamp includes a thermal handling system having a heat sink and a thermal core made of a thermally conductive material to dissipate the heat generated by the solid state light emitting sources to a point outside the lamp.

Abstract: Disclosed exemplary solid state light fixtures use optical cavities to combine or integrate light from LEDs or the like. In such a fixture, the cavity is formed by a light transmissive structure having a volume, and a diffuse reflector that covers a contoured portion of the structure. A heat sink member supports a flexible circuit board so as to position the light emitters to couple light to the transmissive structure and provide effective heat dissipation. The circuit board has flexible tabs mounting the emitters. When installed in the fixture, the tabs bend and the emitters press against a sufficiently rigid periphery of the light transmissive structure. TIM may be compressed between the heat sink member and the opposite surface of each tab. Heat conductive surface pads and heat conductors through vias through the tabs conduct heat from the emitters to the heat sink member, e.g. through the TIM.

Abstract: The present subject matter relates to lamps for general lighting applications. More specifically, white light lamps described herein use semiconductor source to pump remotely deployed phosphor to produce light of desired characteristics. The lamps conform to form factors and/or use lamp base connectors of widely accepted lamp designs, such as those of common incandescent lamps and/or compact fluorescent lamps.

Abstract: A lamp for general lighting applications is described. The lamp utilizes solid state light emitting sources to produce and distribute white light and dissipate the heat generated by the solid state light emitting sources. The lamp includes a thermal handling system having a heat sink and a thermal core made of a thermally conductive material to dissipate the heat generated by the solid state light emitting sources to a point outside the lamp.

Abstract: A lamp for general lighting applications utilizes solid state light emitters and provides light output that may approximate light emissions from of an incandescent lamp. An exemplary lamp includes a bulb and a pedestal extending into the bulb that supports the light emitters in orientations such that emissions from the emitters through the bulb approximate emissions from a filament of an incandescent lamp. An inner member around the emitters and the pedestal provides further light processing, e.g. diffusing and/or phosphor luminescence. The lamp conforms to form factors and/or uses lamp base connectors of common incandescent lamps and/or compact fluorescent lamps. For efficient substitution of components during manufacture of lamps to different specifications, at least some examples use modular couplings for the parts of the lamp to the heat sink or other housing, such as for couplings of the lamp base, the bulb and the inner light processing member (if provided).

Abstract: Disclosed exemplary solid state light fixtures use optical cavities to combine or integrate light from LEDs or the like. In such a fixture, the cavity is formed by a light transmissive structure having a volume, and a diffuse reflector that covers a contoured portion of the structure. A heat sink member supports a flexible circuit board so as to position the light emitters to couple light to the transmissive structure and provide effective heat dissipation. The circuit board has flexible tabs mounting the emitters. When installed in the fixture, the tabs bend and the emitters press against a sufficiently rigid periphery of the light transmissive structure. TIM may be compressed between the heat sink member and the opposite surface of each tab. Heat conductive surface pads and heat conductors through vias through the tabs conduct heat from the emitters to the heat sink member, e.g. through the TIM.