Semiconductor lamp with thermal handling system
A lamp, for general lighting applications, utilizes solid state light emitting sources to produce and distribute white light. The exemplary lamp also includes elements to dissipate the heat generated by the solid state light emitting sources. The lamp includes a thermal handling system having a heat sink and a thermal core made of a thermally conductive material to dissipate the heat generated by the solid state light emitting sources to a point outside the lamp.
Latest ABL IP Holding LLC Patents:
The present subject matter relates to lamps for general lighting applications that utilize solid state light emitting sources to effectively produce and distribute light of desirable characteristics such as may be comparable to common incandescent lamps, yet can effectively dissipate the heat generated by the solid state light emitting sources.
BACKGROUNDIt has been recognized that incandescent lamps are a relatively inefficient light source. However, after more than a century of development and usage, they are cheap. Also, the public is quite familiar with the form factors and light output characteristics of such lamps. Fluorescent lamps have long been a more efficient alternative to incandescent lamps. For many years, fluorescent lamps were most commonly used in commercial settings. However, recently, compact fluorescent lamps have been developed as replacements for incandescent lamps. While more efficient than incandescent lamps, compact fluorescent lamps also have some drawbacks. For example, compact fluorescent lamps utilize mercury vapor and represent an environmental hazard if broken or at time of disposal. Cheaper versions of compact fluorescent lamps also do not provide as desirable a color characteristic of light output as traditional incandescent lamps and often differ extensively from traditional lamp form factors.
Recent years have seen a rapid expansion in the performance of solid state light emitting sources such as light emitting devices (LEDs). With improved performance, there has been an attendant expansion in the variety of applications for such devices. For example, rapid improvements in semiconductors and related manufacturing technologies are driving a trend in the lighting industry toward the use of light emitting diodes (LEDs) or other solid state light sources to produce light for general lighting applications to meet the need for more efficient lighting technologies and to address ever increasing costs of energy along with concerns about global warming due to consumption of fossil fuels to generate energy. LED solutions also are more environmentally friendly than competing technologies, such as compact fluorescent lamps, for replacements for traditional incandescent lamps. Hence, there are now a variety of products on the market and a wide range of published proposals for various types of lamps using solid state light emitting sources, as lamp replacement alternatives.
Increased output power of the solid state light emitting sources, however, increases the need to dissipate the heat generated by operation of the solid state light emitting sources. Although many different heat dissipation techniques have been developed, there is still room for further improvement for lamps for general lighting applications that utilize solid state light emitting sources, to effectively dissipate heat generated by operation of the solid state light emitting sources.
SUMMARYThe teachings herein provide further improvements over existing lamp lighting technologies for providing energy efficient light utilizing solid state light emitters. The lamp is structurally configured to effectively dissipate heat generated during operation of the solid state light emitting sources.
In one example, a lamp includes a bulb and solid state light emitters for emitting light, such that lamp output is at least substantially white. A lighting industry standard lamp base is included for providing electricity from a lamp socket. Circuitry is connected to receive electricity from the lamp base, for driving the solid state emitters to emit light. A thermal handling system of the lamp includes a heat sink and a thermal core made of a thermally conductive material. The thermal core is positioned in the interior of the bulb supporting the solid state light emitters. A thermal transfer element of the thermal handling system is coupled to the thermal core and the heat sink. The heat transfer element supports the thermal core, with the solid state emitters, within the interior of the bulb; and that element transfers heat generated by the solid state light emitters from the thermal core to the heat sink. In some of the examples, at least one of the solid state light emitters is supported on an end of the thermal core in such an orientation so that a principal direction of emission of light from the at least one solid state light emitter is substantially the same as or parallel with a longitudinal axis of the lamp. Two or more of the solid state light emitters are supported on one or more lateral surfaces of the thermal core in orientations so that principal directions of emission of light from the two or more solid state light emitters are radially outward from the thermal core in different radial directions. The exemplary emitter arrangements may provide an emission distribution that, when viewed through the bulb, appears similar to light from the filament of an incandescent lamp.
In another example, a lamp includes a bulb, a heat sink and solid state light emitters. The lamp output light is at least substantially white. A thermal transfer element includes a first section forming a pedestal extending into an interior of the bulb supporting the solid state light emitters. Two or more of the solid state light emitters are supported on the pedestal in orientations so that principal directions of emissions from the two or more solid state light emitters are outward in different directions. A second section of the thermal transfer element extending from the pedestal of the first section and forms a spiral in heat communicative contact with the heat sink. The lamp includes a lighting industry standard lamp base for providing electricity from a lamp socket; and circuitry is connected to receive electricity from the lamp base, for driving the solid state emitters to emit light.
The disclosure below also encompasses a thermal handling system for a lamp, to effectively dissipate heat from the solid state light emitters during operation thereof.
In one example of a thermal handling system, the system includes a heat sink including longitudinally arranged heat radiation fins each having a section extending radially outward and a flair section extending circumferentially away from the radially extending fin section. A thermal transfer element includes a first section for extension into an interior of a bulb of the lamp and a second section coupled in heat communicative contact with the heat sink. A multi-surfaced three-dimensional thermal core is attached to or integrated with, and thermally coupled to the first section of the thermal transfer element to form a pedestal. The pedestal supports at least some solid state light emitters of the lamp on surfaces of the core in orientations to emit light outward from the pedestal through a bulb of the lamp in different principal directions. The radially extending sections of the fins have angular separation from each other so as to allow at least some light emitted via the bulb of the lamp to pass through spaces between the fins.
Additional advantages and novel features will be set forth in part in the description which follows, and in part will become apparent to those skilled in the art upon examination of the following and the accompanying drawings or may be learned by production or operation of the examples. The advantages of the present teachings may be realized and attained by practice or use of various aspects of the methodologies, instrumentalities and combinations set forth in the detailed examples discussed below.
The drawing figures depict one or more implementations in accord with the present teachings, by way of example only, not by way of limitation. In the figures, like reference numerals refer to the same or similar elements.
In the following detailed description, numerous specific details are set forth by way of examples in order to provide a thorough understanding of the relevant teachings. However, it should be apparent to those skilled in the art that the present teachings may be practiced without such details. In other instances, well known methods, procedures, components, and/or circuitry have been described at a relatively high-level, without detail, in order to avoid unnecessarily obscuring aspects of the present teachings.
The various examples of solid state lamps disclosed herein may be used in common lighting fixtures, floor lamps and table lamps, or the like, e.g. as replacements for incandescent or compact fluorescent lamps. Similarly, the various examples of thermal handling systems are applicable to solid state lamps intended for a variety of lighting applications. Reference now is made in detail to the examples illustrated in the accompanying drawings and discussed below.
At a high level, a lamp 30, includes solid state light emitters 32, a bulb 31 and a pedestal 33. The pedestal 33 extends into an interior of the bulb 31 and supports the solid state light emitters 32. In the examples, the orientations of the solid state light emitters 32 produce emissions through the bulb 31 that approximate light source emissions from a filament of an incandescent lamp. The examples also use an inner optical processing member 34, of a material that is at least partially light transmissive. The member 34 is positioned radially and longitudinally around the solid state light emitters 32 supported on the pedestal 33 and between an inner surface of the bulb 31 and the solid state light emitters 32. The bulb and/or the inner member may be transparent or diffusely transmissive.
With respect to the shape of the bulbs 31 in
In any of the various shapes, the bulb 31 can be a diffusely transmissive or transparent glass or plastic bulb and exhibit a form factor within standard size, and the output distribution of light emitted via the bulb 31 conforms to industry accepted specifications, for a particular type of lamp product. Other appropriate transmissive materials may be used. For a diffuse outward appearance of the bulb, the output surface may be frosted white or translucent. Those skilled in the art will appreciate that these aspects of the lamp 30 facilitate use of the lamp as a replacement for existing lamps, such as incandescent lamps and compact fluorescent lamps.
The lamp 30 also includes a heat sink 36 (
In the examples, the pedestal 33 extends from the heat sink 36 or 36′ along the central longitudinal axis of the light engine/lamp into a region to be surrounded by the bulb 31 when attached to the heat sink member at the first modular-coupling. The pedestal 33 provides heat conductivity to and is supported by the heat sink 36 or 36′.
In
As shown in cross-section in
The examples also encompass heat dissipation technology to provide good heat conductivity so as to facilitate dissipation of heat generated during operation of the solid state light emitters 32. Hence, the exemplary lamp 30 in
In
As noted earlier, a variety of multi-surfaced shapes may be used for a core to support one or more solid state light emitters. In the example shown in
In the example shown in
The lamp shown in
In the exemplary orientation of
The light output intensity distribution from the lamp corresponds at least substantially to that currently offered by A-lamps. Other bulb/container structures, however, may be used; and a few examples include a bulb-and-stem arrangement for a decorative globe lamp type omni-directional lighting, as well as R-lamp and Par-lamp style bulbs for different directed lighting applications. At least for some of the directed lighting implementations, some internal surfaces of the bulbs may be reflective, to promote the desired output distributions.
The modularity of the solid state lamp will now be described further with reference back to
As further shown in
The modular coupling capability of the heat sink 36, together with the bulb and base that connect to the heat sink, provide a ‘light engine’ portion of the lamp for generating white light. Theoretically, the engine and bulb could be modular in design to allow a user to interchange glass bulbs, but in practice the lamp is an integral product. The light engine may be standardized across several different lamp product lines (A-lamps, R-lamps, Par-lamps or other styles of lamps, together with Edison lamp bases, three-way medium lamp bases, etc.). The modularity facilitates assembly of common elements forming the light engine together with the appropriate bulb and base (and possibly different drive circuits on the internal board), to adapt to different lamp applications/configurations.
As outlined earlier, the solid state lamps in the examples produce light that is at least substantially white. Although output of the light from the emitters may be used, the color temperature and/or spectral quality of the output light may be relatively low and less than desirable, particular for high end lighting applications. Thus, many of the examples add remote phosphor to improve the color temperature and/or spectral qualities of the white light output of the lamps.
As referenced above, the lamp described in certain examples will include or have associated therewith remote phosphor deployment. The phosphor(s) will be external to the solid state light emitters 32. As such, the phosphor(s) are located apart from the semiconductor chips of the solid state emitters used in the particular lamp, that is to say remotely deployed with respect to the solid state emitters. The phosphor(s) are of a type for converting at least some portion of light from the solid state light emitters from a first spectral characteristic to a second spectral characteristic, to produce a white light output of the lamp from the bulb.
As shown in
For the lamp implementations with remotely deployed phosphor, the member and its support of the phosphor may take a variety of different forms. Solid examples of the member 34 may be transparent or diffusely transmissive. Glass, plastic and other materials are contemplated for the member 34. The phosphors may be embedded in the material of the member or may be coated on the inner surface and/or the outer surface of the member 34. The member may also allow air flow, for example, through passages (not shown). In another approach, the member 34 is formed of a permeable mesh coated with the phosphor material.
The inner member 34 of the examples shown in
The solid state lamps in the examples produce light that is at least substantially white. In some examples, the solid state emitters produce light that is at least substantially white. The white light from the emitters may form the lamp output. In other examples, the emitters produce white light at a first color temperature, and remotely deployed phosphor(s) in the lamp converts some of that light so that the lamp output is at least substantially white, but at a second color temperature. In these various examples, light is at least substantially white if human observers would typically perceive the light in question as white light.
It is contemplated that the lamp 30 may have a light output formed by only optical processing of the white light emitted by the solid state emitters 32. Hence, the white light output of the lamp 30 would be at least substantially white, in this case as white as the emitters are configured to produce; and that light would be at a particular color temperature. If included, the member 34 may provide diffusion, alone or in combination with diffusion by the bulb. Producing lamps of different color temperatures, using this approach would entail use of different white solid state emitters 32.
Another approach uses the emitters 32 that emit white light at the first color temperature in combination with a remotely deployed material bearing one or more phosphors. Semiconductor nanophosphors, doped semiconductor nanophosphors, as well as rare earth and other conventional phosphors, may be used alone or in various combinations to produce desired color temperatures and/or other desirable characteristics of a white light output. In this type arrangement, the phosphor or phosphors convert at least some portion of the white light (at a first color temperature) from the solid state light emitters from a first spectral characteristic to light of second spectral characteristic, which together with the rest of the light from the emitters produce the white light output from the bulb at a second color temperature.
In other examples the solid state light emitters 32 could be of any type rated to emit narrower band energy and remote phosphor luminescence converts that energy so as to produce a white light output of the lamp. In the more specific examples using this type of phosphor conversion, the light emitters 32 are devices rated to emit energy of any of the wavelengths from the blue/green region around 460 nm down into the UV range below 380 nm. In some examples, the solid state light emitters 32 are rated for blue light emission, such as at or about 450 nm. In other examples, the solid state light emitters 32 are near UV LEDs rated for emission somewhere in the below 420 nm, such as at or about 405 nm. In these examples, the phosphor bearing material may use a combination of semiconductor nanophosphors, a combination of one or more nanophosphors with at least one rare earth phosphor or a combination in which one or more of the phosphors is a doped semiconductor nanophosphor.
Many solid state light emitters exhibit emission spectra having a relatively narrow peak at a predominant wavelength, although some such devices may have a number of peaks in their emission spectra. Often, manufacturers rate such devices with respect to the intended wavelength λ of the predominant peak, although there is some variation or tolerance around the rated value, from device to device. Solid state light emitters for use in certain exemplary lamps will have a predominant wavelength λ in the range at or below 460 nm (λ≦460 nm), such as in a range of 380-460 nm. In lamps using this type of emitters, the emission spectrum of the solid state light emitter will be within the absorption spectrum of each of the one or more remotely deployed phosphors used in the lamp.
Each phosphor or nanophosphor is of a type for converting at least some portion of the wavelength range from the solid state emitters to a different range of wavelengths. The combined emissions of the pumped phosphors alone or in combination with some portion of remaining light from the emitters results in a light output that is at least substantially white, is at a desired color temperature and may exhibit other desired white light characteristics. In several examples offering particularly high spectral white light quality, the substantially white light corresponds to a point on the black body radiation spectrum. In such cases, the visible light output of the lamp deviates no more than ±50% from a black body radiation spectrum for the rated color temperature for the device, over at least 210 nm of the visible light spectrum. Also, the visible light output of the device has an average absolute value of deviation of no more than 15% from the black body radiation spectrum for the rated color temperature for the device, over at least the 210 nm of the visible light spectrum.
Whether using white light emitters or emitters of energy of wavelengths from the blue/green region around 460 nm down into the UV range below 380 nm, the implementations using phosphors can use different phosphor combinations/mixtures to produce lamps with white light output at different color temperatures and/or of different spectral quality.
If included, the phosphor(s) is remotely deployed in the lamp, relative to the emitters. A variety of remote phosphor deployment techniques may be used. For example, the phosphors may be in a gas or liquid container between the bulb 31 and the member 34. The phosphor(s) may be coated on the inner surface of the bulb 31. However, the member 34 also offers an advantageous mechanism for remotely deploying the phosphor(s). In many examples, the phosphor(s) may be embedded in the material of the member 34 or coated on an inner and/or an outer surface of the member.
As outlined above, the solid state light emitters 32 are semiconductor based structures for emitting light, in some examples for emitting substantially white light and in other examples for emitting light of color in a range to pump phosphors. In the example, the light emitters 32 comprise light emitting diode (LED) devices, although other semiconductor devices might be used.
As discussed herein, applicable solid state light emitters essentially include any of a wide range light emitting or generating devices formed from organic or inorganic semiconductor materials. Examples of solid state light emitters include semiconductor laser devices and the like. Many common examples of solid state emitters, however, are classified as types of “light emitting diodes” or “LEDs.” This exemplary class of solid state light emitters encompasses any and all types of semiconductor diode devices that are capable of receiving an electrical signal and producing a responsive output of electromagnetic energy. Thus, the term “LED” should be understood to include light emitting diodes of all types, light emitting polymers, organic diodes, and the like. LEDs may be individually packaged, as in the illustrated examples. Of course, LED based devices may be used that include a plurality of LEDs within one package, for example, multi-die LEDs that contain separately controllable red (R), green (G) and blue (B) LEDs within one package. Those skilled in the art will recognize that “LED” terminology does not restrict the source to any particular type of package for the LED type source. Such terms encompass LED devices that may be packaged or non-packaged, chip on board LEDs, surface mount LEDs, and any other configuration of the semiconductor diode device that emits light. Solid state lighting elements may include one or more phosphors and/or nanophosphors, which are integrated into elements of the package to convert at least some radiant energy to a different more desirable wavelength or range of wavelengths.
Attention is now directed to the lamp base which is modularly connected to the heat sink. The lamp base 35 (
Many of the components, in the form of a light engine, can be shared between different types/configurations of lamps. For example, the heat sink and pedestal may be the same for an Edison mount A lamp and for three-way A lamp. The lamp bases would be different. The drive circuitry would be different, and possibly the number and/or rated output of the emitters may be different.
The solid state light emitters in the various exemplary lamps may be driven/controlled by a variety of different types of circuits. Depending on the type of solid state emitters selected for use in a particular lamp product design, the solid state emitters may be driven by AC current, typically rectified; or the solid state emitters may be driven by a DC current after rectification and regulation. The degree of control may be relatively simple, e.g. ON/OFF in response to a switch, or the circuitry may utilize a programmable digital controller, to offer a range of sophisticated options. Intermediate levels of sophistication of the circuitry and attendant control are also possible.
A more detailed explanation of the solid state emitters and their arrangement in the lamp is now provided. The solid state light emitters 32 are positioned on the pedestal 33 positioned inside bulb 31. The pedestal 33 extends into the interior of the bulb 31 supporting the solid state light emitters in orientations such that emissions from the solid state light emitters 32 through the bulb 31 approximate light source emissions from a filament of an incandescent lamp. The pedestal 33 includes a multi-surfaced three-dimensional thermal core (discussed in further detail below in regard to
The pedestal 33 supports the solid state emitters 32 by way of a multi-surfaced three-dimensional thermal core providing the support for the solid state light emitters in the interior of the bulb 31. A variety of multi-surfaced shapes may be used for a thermal core to support one or more solid state light emitters. The multi-surfaced three-dimensional thermal core is made of a durable heat conducting material such as copper (Cu), aluminum (Al), thermally conductive plastics or ceramics. An example of a ceramic material is commercially available from CeramTec GmbH of Plochingen, Germany. Composite structures, having a conductive outer material and graphite core or a metal core with an outer dielectric layer are also contemplated. In some cases, the emitters are mounted on a circuit board attached to the core, whereas in other examples, electrical traces for the circuitry may be integrated with the core and the emitters mounted directly to the core without use of an additional circuit board element. Different materials may be selected for the core as a trade off of manufacturing cost/complexity versus effective heat transfer.
As shown in the example of
In addition to the core 51, the pedestal in the example of
In this example, the core 50 is attached to a section of the heat pipe 57 to form the pedestal, although in some later examples, the core is an integral element of the pedestal section of the heat pipe or other type of heat transfer element. Thus, the core and heat transfer element may be formed as an integral member or as two separate elements joined or attached together. As shown in
In the example shown in
The printed circuit board and emitters may be attached to the faces of the core by an adhesive or a solder. If solder is used, the solder to first attach the emitters to the board may melt at a higher temperature than the solder used to attach the board to the core, to facilitate assembly.
The example in
An alternative example for including the solid state light emitters on a thermal core is illustrated in
In addition to the thermal core circuit board 50′, the pedestal in the example of
In some examples of the structures that provide thermal transfer as well as circuit connections, similar materials/structures may be used as the heat transfer element instead of the heat pipe. In such cases, it may be advantageous to manufacture the core and the heat transfer element as a single integral unit.
In yet another example shown in
In addition to the thermal core circuit board 50″, the pedestal in the example of
In yet another example shown in
The heat pipe arrangements of
As discussed above for
The core receives heat from the solid state emitters and carries the heat to the thermal transfer element. That element in turn carries the heat to the heat sink for dissipation to the ambient atmosphere. Examples of the core and transfer element have been shown and described. A variety of heat sink arrangements may be used.
A thermal handling system for any of the preceding lamps is now described. The system effectively dissipates heat from the solid state light emitters during operation thereof. In one example of a thermal handling system, the system includes a heat sink including longitudinally arranged heat radiation fins each having a section extending radially outward and a flair section extending circumferentially away from the radially extending fin section. Any of the examples shown in
The multi-surfaced three-dimensional thermal core of the thermal system has at least three substantially flat surfaces (
Attention is now directed to
Also shown in cross section in
Heat radiation fins 41 extend out from the cylindrical section of the heat sink core. Lengthwise, the fins extend in a direction parallel to the longitudinal axis of the heat sink and the lamp (vertical in the orientation of
The radially extending sections of the fins have angular separation from each other so as to allow at least some light emitted via the globe to pass through spaces between the fins. The fins 41 in this example have a somewhat angled profile at their outer edges. The heat sink also includes flares 42 on the fins 41. In the example of
The heat sink example in
In this example, a cutout region 48 exists between the distal and proximal ends of each of the fins 41. Multiple air passages 39 extend around the core 47 to further facilitate with heat dissipation. The opening 44 is for receiving the axially extending portion of the thermal transfer element, such as the heat pipe 38, to extend through the upper portion of the heat sink into the interior of a bulb 31. Ring 45 is for the inner optical processing member 34 to be fixedly secured to the heat sink. The outermost ring 46 is for fixedly securing the bulb 31 to the heat sink.
The heat sink example in
Attention is now directed to the additional examples of the heat sink configuration as shown in
In the example shown in
As seen in
As seen in
The effects of radiation although often minimal when compared to the cooling effect of convection, especially when temperatures are not extremely elevated, can become more important when a system utilizes natural convection versus forced convection. To take advantage of extra cooling capacity provided through the process of radiation, the heat sink is finished to improve the emissivity of the heat sink surfaces.
The emissivity of an object relates to the ability of the object to radiate energy. Normally, the blacker the material, the better the emissivity. Conversely, the more reflective the material, the lower the emissivity. Emissivity, however, depends on a variety of factors, including wavelength of the energy to be emitted or radiated from surface(s) of the object. At the temperatures for dissipation from the sinks of solid state lamps like those under consideration here, the heat produces radiant energy of relatively long wavelengths outside the visible portion of the spectrum, e.g. in the infrared range. Some finishes that may appear reflective to an observer are reflective in the visible spectrum, but are actually darker in longer wavelength ranges outside the visible spectrum, such as in the infrared range. The improved emissivity may outweigh any thermal insulating effect of the finish in relation to the convective heat dissipation.
In any of the solid state lamps shown in the drawings, the surface finish on the outside of heat sink could be chosen to improve emissivity. For example, the finish could be a paint, powder coat, anodized surface or any other method that results in higher emissivity compared to the bare heat sink surface, whatever the material of or process used to produce the heat sink.
Of these exemplary finishes, white paint or powder coat may provide the greatest benefit due to the high emissivity in the infrared region and high reflectivity in the visible spectrum. The high reflectivity in the visible spectrum provides good light distribution in directions where light from the bulb passes between the heat sink fins. Black paint or powder coat provides similar emissivity in the infrared region but lacks the reflectivity of the white paint making it less suitable for lighting applications where the surfaces in question could absorb visible light that would otherwise exit the system.
Anodizing is another useful method for improving the emissivity when the heat sink has an aluminum based metallic surface. Of the various aluminum anodizing techniques, a clear anodized finish may be best suited for this application, in that it provides improved infrared radiation yet provides good reflectivity of visible light from the bulb.
While the foregoing has described what are considered to be the best mode and/or other examples, it is understood that various modifications may be made therein and that the subject matter disclosed herein may be implemented in various forms and examples, and that the teachings may be applied in numerous applications, only some of which have been described herein. It is intended by the following claims to claim any and all applications, modifications and variations that fall within the true scope of the present teachings.
Claims
1. A lamp, comprising:
- solid state light emitters;
- a bulb;
- a thermal handling system, comprising: a heat sink; a thermal core of a thermally conductive material, positioned in the interior of the bulb supporting the solid state light emitters; and a heat pipe coupled to the thermal core and the heat sink for supporting the thermal core, with the solid state emitters within the interior of the bulb, and for transferring heat generated by the solid state light emitters from the thermal core to the heat sink, wherein: the heat pipe includes a first section extending along the longitudinal axis of the lamp into the interior of the bulb coupled to the thermal core, and a spiral-shaped second section connected to the first section and forming a spiral in heat communicative contact with the heat sink, at least one of the solid state light emitters is supported on an end of the thermal core in such an orientation so that a principal direction of emission of light from the at least one solid state light emitter is substantially the same as or parallel with a longitudinal axis of the lamp, and a plurality of the solid state light emitters are supported on one or more lateral surfaces of the thermal core in orientations so that principal directions of emission of light from the plurality of the solid state light emitters are radially outward from the thermal core in a plurality of different radial directions;
- a lighting industry standard lamp base for providing electricity from a lamp socket;
- circuitry connected to receive electricity from the lamp base, for driving the solid state emitters to emit light;
- a circuit board attached to the thermal core for driving the solid state light emitters, wherein:
- the circuit board extends vertically upward from the lamp base in an interior space within the heat sink, and
- the spiral shaped second section of the heat pipe coils around a portion of the circuit board.
2. The lamp of claim 1, wherein:
- the thermal core has at least three substantially flat surfaces facing outward from the longitudinal axis of the lamp in different directions each supporting one or more of the plurality of the solid state light emitters in a different orientation, and
- the solid state light emitters on the thermal core produce combined emissions through the bulb approximating light source emissions from a filament of an incandescent bulb.
3. The lamp of claim 1, wherein the thermal core is formed as an integral element of the heat pipe.
4. The lamp of claim 1, wherein the first section of the heat pipe extends along an axis of the lamp substantially centered through the spiral of the second section of the heat pipe.
5. The lamp of claim 1, wherein the heat sink comprises:
- an interior surface and longitudinally arranged heat radiation fins extending outward from the interior surface, each heat radiation fin having a section extending radially outward, wherein:
- the spiral shaped second section of the heat pipe is in heat communicative contact with the interior surface of the heat sink,
- the heat sink supports the heat pipe within the lamp, and
- the heat generated by the solid state emitters is transferred from the spiral shaped second section of the heat pipe and the interior surface of the heat sink to the longitudinally arranged heat radiation fins.
6. The lamp of claim 5, wherein:
- the first section of the heat pipe comprises a first end forming a hot interface for receiving the heat generated by the solid state emitters,
- the second section of the heat pipe comprises a second end for receiving the heat from the first end of the first section of the heat pipe, and
- the heat is transferred out of a cold interface at the second end of the second section of the heat pipe to the interior surface of the heat sink.
7. The lamp of claim 1, wherein the thermal core has a plurality of radially facing surfaces supporting the plurality of the solid state light emitters in the orientations to emit light radially outward in the plurality of different directions.
8. The lamp of claim 7, wherein each of the radially facing surfaces supports at least two solid state light emitters.
9. The lamp of claim 7, further comprising;
- a flexible circuit board attached to the thermal core for providing electrical connections to the solid state emitters and for attaching the solid state emitters to the thermal core,
- wherein the flexible circuit board includes an end section supporting the at least one light emitter attached to the end of the thermal core, and
- a plurality of lateral sections each supporting one or more solid state emitters, the lateral sections being attached to respective radially facing surfaces of the thermal core.
10. The lamp of claim 1, wherein the thermal core comprises a material including electrical conductors so as to function as a circuit board for providing electrical connections to the solid state emitters.
11. The lamp of claim 10, wherein the solid state emitters comprise packaged light emitting diodes mounted on and connected to the thermal core circuit board.
12. The lamp of claim 10, wherein the solid state emitters comprise light emitting diode dies mounted on and connected to the thermal core circuit board.
13. A lamp, comprising:
- solid state light emitters;
- a bulb;
- a thermal handling system, comprising: a heat sink;
- a thermal core of a thermally conductive material, positioned in the interior of the bulb supporting the solid state light emitters; and
- a heat pipe coupled to the thermal core and the heat sink for supporting the thermal core, with the solid state emitters within the interior of the bulb, and for transferring heat generated by the solid state light emitters from the thermal core to the heat sink, wherein: the heat pipe includes a first section extending along the longitudinal axis of the lamp into the interior of the bulb coupled to the thermal core, and a spiral-shaped second section connected to the first section and forming a spiral in heat communicative contact with the heat sink, at least one of the solid state light emitters is supported on an end of the thermal core in such an orientation so that a principal direction of emission of light from the at least one solid state light emitter is substantially the same as or parallel with a longitudinal axis of the lamp, a plurality of the solid state light emitters are supported on one or more lateral surfaces of the thermal core in orientations so that principal directions of emission of light from the plurality of the solid state light emitters are radially outward from the thermal core in a plurality of different radial directions, and the heat sink comprises a plurality of longitudinally arranged heat radiation fins each having at least a section extending radially outward at an angle around a longitudinal axis of the lamp, the radiation fins having angular separation from each other so as to allow at least some of the light from the plurality of solid state emitters to pass through spaces between the radiation fins;
- a lighting industry standard lamp base for providing electricity from a lamp socket; and circuitry connected to receive electricity from the lamp base, for driving the solid state emitters to emit light.
14. The lamp of claim 13, wherein the flairs are located at positions between proximal and distal ends of the radially extending fin sections.
15. The lamp of claim 13, wherein each of the heat radiation fins further comprises a flair section extending circumferentially away from the radially extending section of the fin.
16. The lamp of claim 15, wherein the flairs are at distal ends of the radially extending fin sections.
17. A lamp, comprising:
- a plurality of solid state light emitters;
- a bulb;
- a heat sink;
- a heat pipe comprising: a first section extending into an interior of the bulb supporting the solid state light emitters, a plurality of the solid state light emitters being supported on the first section in orientations so that principal directions of emissions from the plurality are outward through the bulb in a plurality of different directions; and a spiral-shaped second section connected to and extending from the first section into the heat sink and forming a spiral in heat communicative contact with the heat sink;
- a lighting industry standard lamp base for providing electricity from a lamp socket; and
- circuitry connected to receive electricity from the lamp base, for driving the solid state emitters to emit light,
- wherein the heat sink comprises a plurality of longitudinally arranged heat radiation fins each having at least a section extending radially outward at an angle around a longitudinal axis of the lamp, the radiation fins having angular separation from each other so as to allow at least some emissions by way of the bulb to pass through spaces between the radiation fins.
1930879 | October 1933 | Linderoth et al. |
1956133 | April 1934 | Rosenblad |
2061742 | November 1936 | Swart |
2142679 | January 1939 | Seifert |
2856161 | October 1958 | Flynn |
3376403 | April 1968 | Mircea |
3486489 | December 1969 | Huggins |
4729076 | March 1, 1988 | Masami et al. |
5785418 | July 28, 1998 | Hochstein |
5806965 | September 15, 1998 | Deese |
5857767 | January 12, 1999 | Hochstein |
6045240 | April 4, 2000 | Hochstein |
6311764 | November 6, 2001 | Schulz et al. |
6431728 | August 13, 2002 | Fredericks et al. |
6450661 | September 17, 2002 | Okumura |
6499860 | December 31, 2002 | Begemann |
6517217 | February 11, 2003 | Liao |
6578986 | June 17, 2003 | Swaris et al. |
6580228 | June 17, 2003 | Chen et al. |
6598996 | July 29, 2003 | Lodhie |
6621222 | September 16, 2003 | Hong |
6682211 | January 27, 2004 | English et al. |
6709132 | March 23, 2004 | Ishibashi |
6712486 | March 30, 2004 | Popovich et al. |
6787999 | September 7, 2004 | Stimac et al. |
6799864 | October 5, 2004 | Bohler et al. |
6864513 | March 8, 2005 | Lin et al. |
6880956 | April 19, 2005 | Zhang |
6948829 | September 27, 2005 | Verdes et al. |
6969843 | November 29, 2005 | Beach et al. |
6974234 | December 13, 2005 | Galli |
6991351 | January 31, 2006 | Petrick |
7058103 | June 6, 2006 | Ishida et al. |
7086767 | August 8, 2006 | Sidwell et al. |
7121687 | October 17, 2006 | Sidwell et al. |
7148632 | December 12, 2006 | Berman et al. |
7157745 | January 2, 2007 | Blonder et al. |
7207695 | April 24, 2007 | Coushaine et al. |
7210832 | May 1, 2007 | Huang |
7226189 | June 5, 2007 | Lee et al. |
7300187 | November 27, 2007 | Huang et al. |
7314291 | January 1, 2008 | Tain et al. |
7338186 | March 4, 2008 | Wu et al. |
7345320 | March 18, 2008 | Dahm |
7396142 | July 8, 2008 | Laizure, Jr. et al. |
7488093 | February 10, 2009 | Huang et al. |
7543960 | June 9, 2009 | Chang et al. |
7547124 | June 16, 2009 | Chang et al. |
7581856 | September 1, 2009 | Kang et al. |
7588351 | September 15, 2009 | Meyer |
7604380 | October 20, 2009 | Burton et al. |
7641361 | January 5, 2010 | Wedell et al. |
7708452 | May 4, 2010 | Maxik et al. |
7740380 | June 22, 2010 | Thrailkill |
7748876 | July 6, 2010 | Zhang et al. |
7753560 | July 13, 2010 | Xu et al. |
7755901 | July 13, 2010 | Shen |
7768192 | August 3, 2010 | Van De Ven et al. |
7824075 | November 2, 2010 | Maxik |
7845825 | December 7, 2010 | Ramer et al. |
7862210 | January 4, 2011 | Zhang et al. |
7880389 | February 1, 2011 | Imai et al. |
20020012246 | January 31, 2002 | Rincover et al. |
20040213016 | October 28, 2004 | Rice |
20040251011 | December 16, 2004 | Kudo |
20050068776 | March 31, 2005 | Ge |
20050092469 | May 5, 2005 | Huang |
20060092639 | May 4, 2006 | Livesay et al. |
20060198147 | September 7, 2006 | Ge |
20070241661 | October 18, 2007 | Yin |
20070267976 | November 22, 2007 | Bohler et al. |
20070285926 | December 13, 2007 | Maxik |
20080093963 | April 24, 2008 | Marien et al. |
20080290814 | November 27, 2008 | Leong et al. |
20090002995 | January 1, 2009 | Lee et al. |
20090073697 | March 19, 2009 | Peck et al. |
20090097241 | April 16, 2009 | Xu et al. |
20090251884 | October 8, 2009 | Rains |
20090268461 | October 29, 2009 | Deak et al. |
20090294780 | December 3, 2009 | Chon et al. |
20090295266 | December 3, 2009 | Ramer et al. |
20090296368 | December 3, 2009 | Ramer |
20100027258 | February 4, 2010 | Maxik et al. |
20100073924 | March 25, 2010 | Deng |
20100103678 | April 29, 2010 | Van Den Ven et al. |
20100133578 | June 3, 2010 | Pickard et al. |
20100172122 | July 8, 2010 | Ramer et al. |
20100187961 | July 29, 2010 | Scott |
20100207502 | August 19, 2010 | Cao et al. |
20100213808 | August 26, 2010 | Shi |
20100219735 | September 2, 2010 | Sakai et al. |
20100277059 | November 4, 2010 | Rains, Jr. et al. |
20100277067 | November 4, 2010 | Maxik et al. |
20100277069 | November 4, 2010 | Janik et al. |
20100277907 | November 4, 2010 | Phipps et al. |
20100301729 | December 2, 2010 | Simon et al. |
20100314985 | December 16, 2010 | Premysler |
20100315252 | December 16, 2010 | Desphande et al. |
20110019409 | January 27, 2011 | Wronski |
20110045614 | February 24, 2011 | Helbing et al. |
20110051423 | March 3, 2011 | Hand et al. |
20110095686 | April 28, 2011 | Falicoff et al. |
20110176291 | July 21, 2011 | Sanders et al. |
20110193473 | August 11, 2011 | Sanders et al. |
20110215696 | September 8, 2011 | Tong et al. |
20110278633 | November 17, 2011 | Clifford |
- Dr. S. Sunderrajan, President, “Delivering Tunable Color Quality with Compromise,” Strategies in Light, The Leading Events for the Global LED Lighting Industry, NNCrystal US Corporation, Feb. 2011.
- NNCrystal Poster Displayed at LightFair 2010, May 10-14, 2010.
- NNCrystal Corporation Handout at LightFair May 10-14, 2010.
- Cree True White Light, 2011.
- M. Lamonica, “Cree raises stakes in LED bulb race,” CNET News, Jan. 27, 2011.
- M. Lamonica, “Sylvania takes on 60-watt bulb with LED light,” CNET News, May 13, 2010.
- M. Lamonica, “GE makes LED replacement for 40-watt bulb,” CNET News, Apr. 8, 2010.
- C. Lombardi, “Philips offers LED replacement for 60-watt bulb,” CNET News, May 12, 2010.
- M. Lamonica, “LEDs keep coming: 60-watt stand-in priced at $30,” CNET News, Dec. 13, 2010.
- “Lighting Science Group Pursues Prestigious L Prize with Revolutionary New LED Bulb,” Mar. 8, 2011.
- United State Office Action issued in U.S. Appl. No. 13/051,596 dated Dec. 9, 2011.
- United States Office Action issued in U.S. Appl. No. 13/051,662 dated Apr. 13, 2012.
- United States Office Action issued in U.S. Appl. No. 13/051,596 dated May 30, 2012.
- International Search Report and Written Opinion of the International Searching Authority issued in International Patent Application No. PCT/US12 /27862 dated Jul. 13, 2012.
- International Search Report and Written Opinion of the International Searching Authority issued in International Patent Application No. PCT/US 12/27856 dated Jul. 13, 2012.
- International Search Report and Written Opinion of the International Searching Authority issued in International Patent Application No. PCT/US 12/27869 dated Jul. 13, 2012.
Type: Grant
Filed: Mar 18, 2011
Date of Patent: Sep 25, 2012
Patent Publication Number: 20110176316
Assignee: ABL IP Holding LLC (Conyers, GA)
Inventors: J. Michael Phipps (Springfield, VA), Chad N. Sanders (Ashburn, VA), Steve S. Lyons (Herndon, VA)
Primary Examiner: Ismael Negron
Attorney: McDermott Will & Emery LLP
Application Number: 13/051,628
International Classification: F21V 29/00 (20060101);