Abstract: An optoelectronic semiconductor device is disclosed wherein the device is a vertical-cavity surface-emitting laser or a photodiode containing a section, the top part of which is electrically isolated from the rest of the device. The electric isolation can be realized by etching a set of holes and selective oxidation of AlGaAs layer or layers such that the oxide forms a continuous layer or layers everywhere beneath the top surface of this section. Alternatively, a device can be grown epitaxially on a semi-insulating substrate, and a round trench around a section of the device can be etched down to the semi-insulating substrate thus isolating this section electrically from the rest of the device. Then if top contact pads are deposited on top of the electrically isolated section, the pads have a low capacitance, and a pad capacitance below two hundred femto-Farads, and the total capacitance of the device below three hundred femto-Farads can be reached.

Abstract: An optoelectronic semiconductor device is disclosed wherein the device is a vertical-cavity surface-emitting laser or a photodiode containing a section, the top part of which is electrically isolated from the rest of the device. The electric isolation can be realized by etching a set of holes and selective oxidation of AlGaAs layer or layers such that the oxide forms a continuous layer or layers everywhere beneath the top surface of this section. Alternatively, a device can be grown epitaxially on a semi-insulating substrate, and a round trench around a section of the device can be etched down to the semi-insulating substrate thus isolating this section electrically from the rest of the device. Then if top contact pads are deposited on top of the electrically isolated section, the pads have a low capacitance, and a pad capacitance below two hundred femto-Farads, and the total capacitance of the device below three hundred femto-Farads can be reached.

Abstract: An opto-electronic micro-module includes a monocrystalline substrate having a first surface and a second surface parallel to said first surface, wherein a through hole passes from said first surface through said monocrystalline substrate to said second surface; and an optical substrate having a first portion in said through hole and a second portion protruding from said through hole.

Abstract: An opto-electronic assembly for high speed opto-electronic signal transmission which comprises: mounting plate with a top side; wherein the top side contains at least one area at a higher level and at least one area at a lower level, an electro-optical or opto-electronic transducer component with a number of transducers with the optical port of the transducer component on the top side; a micro-mirror component; an optical transmission path assigned to each transducer wherein the transmission axis of each transmission path is oriented substantially parallel to the surface of the transducer component and to the top side of the mounting plate; and a transducer component that is mounted with the bottom side on the mounting plate below a micro-mirror component that is mounted above the transducer component in such a configuration that the optical transmission path to or from each transducer is reflected at the dedicated mirror surface.

Abstract: An opto-electronic assembly for high speed opto-electronic signal transmission which comprises: mounting plate with a top side; wherein the top side contains at least one area at a higher level and at least one area at a lower level, an electro-optical or opto-electronic transducer component with a number of transducers with the optical port of the transducer component on the top side; a micro-minor component; an optical transmission path assigned to each transducer wherein the transmission axis of each transmission path is oriented substantially parallel to the surface of the transducer component and to the top side of the mounting plate; and a transducer component that is mounted with the bottom side on the mounting plate below a micro-minor component that is mounted above the transducer component in such a configuration that the optical transmission path to or from each transducer is reflected at the dedicated mirror surface.

Abstract: The optoelectronic assembly for high speed signal transmission based on surface-emitting/receiving components is disclosed. The assembly contains a mounting plate with a top side used for the mounting of the components; single or multiple electrooptical or optoelectronic transducer components with the optical ports of the transducer on the top side and a bottom side used for assembly; a micro-mirror component; an optical transmission path wherein the transmission axis is oriented substantially parallel to the surface of the transducer components and to the top side of the mounting plate; and a transducer component mounted with the bottom side on the mounting plate near a micro-mirror component mounted above the transducer component in such a configuration that the optical transmission path to or from the transducer is reflected at the mirror surface such that the transducer is optically coupled to this same transmission path.

Abstract: The optoelectronic assembly for high speed signal transmission based on surface-emitting/receiving components is disclosed. The assembly contains a mounting plate with a top side used for the mounting of the components; single or multiple electrooptical or optoelectronic transducer components with the optical ports of the transducer on the top side and a bottom side used for assembly; a micro-mirror component; an optical transmission path wherein the transmission axis is oriented substantially parallel to the surface of the transducer components and to the top side of the mounting plate; and a transducer component mounted with the bottom side on the mounting plate near a micro-mirror component mounted above the transducer component in such a configuration that the optical transmission path to or from the transducer is reflected at the mirror surface such that the transducer is optically coupled to this same transmission path.

Abstract: The invention relates to an optoelectronic module for optical signals of two optical data channels for arrangement on a main circuit board of an assembly, having a housing, which has an underside for arrangement of the optoelectronic module on a main circuit board. The arrangement further includes a printed circuit board arranged in the housing, having a first optical coupling region and a second optical coupling region for the coupling of optical waveguides, wherein the first and second coupling regions are arranged on the printed circuit board. The first optical coupling region is arranged at a smaller distance from the underside of the housing than the second optical coupling region. The invention achieves an efficient utilization of the end area of an assembly.

Abstract: An optoelectronic assembly multiplexes and/or demultiplexes optical signals. The assembly includes a monolithic multiplexer for multiplexing and demultiplexing optical signals, and two optical imaging systems for coupling light beams in or coupling them out of the multiplexer. The first optical imaging system is integrated in a single-channel interface and/or the second optical imaging system is integrated in a multi-channel interface, and at least one interface is directly linked with the multiplexer.

Abstract: The invention relates to an optoelectronic arrangement having a laser component. There are provided: a cooling device of small design for cooling the laser component down to a constant temperature, a device for the direct optical detection of the emitted wavelength of the laser component, whose signal is used to control the cooling device, and a package of small design with an extent of at most 6.5 mm perpendicular to the optical axis of the laser component and in which the above named components are arranged. The invention also relates to a method for controlling the emitted wavelength of a laser component.

Abstract: An optoelectronic arrangement includes at least one laser component. A heating device for heating the laser component up to a constant temperature is provided in such a way that the laser component is operated at a temperature that is at least equal to the highest temperature to be expected that would be present during operation of the laser component without the heating device. A method for operating a laser component includes heating the laser component to a constant temperature that is at least equal to the highest temperature to be expected that would be present during operation of the laser component without heating. The laser component is then operated at this temperature. The exact monitoring of the emitted wavelength of a laser component is rendered possible in a simple way.

Abstract: A bidirectional transmitting and receiving device includes a transmitting component with an emission area of a first size, and a receiving component with a receiving area of a second size. The device further includes coupling optics for coupling light between the transmitting component and the receiving component on the one hand, and an optical waveguide to be coupled thereto on the other hand. The coupling optics have two imaging systems that are arranged one behind the other such that the light that is emitted from the transmitting component is imaged by the first imaging system on an intermediate plane on which the receiving component is located, and in the process passes through the receiving component or passes by it at the side.

Abstract: The invention relates to an emission module for an optical signal transmission, comprising an emission unit which emits light of a certain wavelength, an emission unit substrate on which the emission unit is arranged or embodied, a detection unit which detects light of a certain wavelength, and a detection unit substrate on which the detection unit is arranged or embodied. According to the invention, the emission unit substrate and/or the detection unit substrate are transparent to the wavelength emitted by the emission unit, and the emission unit and the detection unit are superposed in the direction of the light emitted. The inventive solution enables the emission unit and the detection unit to be optically coupled without requiring additional optical components such as reflecting surfaces. Novel, compact optical system can thus be carried out in an emission module.

Abstract: An apparatus for demultiplexing optical signals at a large number of wavelengths using at least one wavelength-selective filter includes at least two wavelength-selective filters in each case for separation of signal components at one wavelength or at two or more wavelengths, located one behind the other in an oblique configuration in the beam path of the apparatus, and disposed such that the signal component that is transmitted by a first filter falls on the subsequent, second filter, the signal component that is reflected by the second filter not being reflected back to the first filter but, instead, running past the first filter, and the signal components that are reflected by the filters are joined together.

Abstract: A device for optical and/or electrical data transmission and/or processing has at least one electrical component, at least one optoelectronic component electrically connected to the electrical component, and an optically transparent carrier with a first surface, on which the electrical component and the optoelectronic component are disposed. Light is coupled into or out of the optoelectronic component through the carrier, and a frame is connected to the carrier, via which frame the components disposed on the carrier are electrically contact-connected. The device provides both optical and electrical inputs and outputs for optoelectronic and electrical components integrated into a device.

Abstract: An optical transmitter and a method for generating a digital optical signal sequence are provided. The optical transmitter has light transmitters which are independently drivable and generate an optical signal for each of the bits of a digital electrical signal sequence that is to be converted into a digital optical signal sequence. The optical signals are combined and superposed into an optical signal path. A control device is provided for distributing the bits between the light transmitters.

Abstract: To ensure laser safety, also in the case of a largest possible coupled optical power, during the direct optical coupling of a light-emitted component to an optical waveguide, an optical system includes coupling the light through a fiber end configured as a multimode step index optical waveguide having a numeric aperture larger than the half-width value of the angular distribution of the radiation emitted from the radiation source. To distribute the radiation fed into the actual optical waveguide over the largest possible angular range with regard to the luminous power, the coupling of the light beam into the fiber end is effected such that the coupled light beams are inclined in relation to the geometric axis of the optical core of the fiber end at a defined angle.

Abstract: The invention relates to an arrangement for multiplexing and/or demultiplexing the signals of a plurality of optical data channels of different wavelength, in which the multiplexed signals are transmitted in a waveguide (1). According to the invention, the waveguide (1) is disposed or embodied in a planar substrate (2), which has a plurality of cutouts (3) extending at a defined angle, which interrupt the waveguide (1) at successive points, and one wavelength-selective mirror (4) is disposed in each of these cutouts (3), at which mirror light is coupled in or out obliquely to the surface of the substrate (2). The invention further relates to a method for producing such an arrangement.

Abstract: Optical fiber for optically coupling a light radiation source to a multimode optical waveguide, and method for manufacturing it. Optical fiber for optically coupling a light radiation source (6) to a multimode optical waveguide (7) having an optical fiber core (2) for transmitting light waves, optical fiber cladding (3) enclosing the optical fiber core (2), an injection end face (4) of the optical fiber core (2) for injecting light emitted by the light radiation source (6) into the optical fiber core (2), an extraction end face (5) of the optical fiber core (2) for extracting light from the optical fiber core (2) into the multimode optical waveguide (7), the injection end face (4) of the optical fiber core being curved spherically inward in order to widen the radiation angle of the injected light.

Abstract: The electro-optical module has a substrate with a mounting surface that is free from depressions. A surface-mounted component unit is disosed on the mounting surface. The component unit contains as integral components an electro-optical component and a lens which are aligned directly with one another. The surface serves, furthermore, as a reference plane for assembling a receptacle for an optical fiber plug.