Patents by Inventor Jörg Sorg

Jörg Sorg has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20170219171
    Abstract: In various embodiments, a conversion device is provided. The conversion device may include a phosphor element made of a phosphor element material for converting pump radiation into conversion radiation; and a scattering element embodied as a volume scatterer. The scattering element is arranged in direct optical contact with the phosphor element in order to be transilluminated by the conversion radiation. The phosphor element material is present in monocrystalline form in the phosphor element over a volume of at least 1×10?2 mm3.
    Type: Application
    Filed: January 27, 2017
    Publication date: August 3, 2017
    Inventor: Joerg Sorg
  • Patent number: 9640739
    Abstract: Various embodiments relate to an optoelectronic component, including a carrier element, on which at least one optoelectronic semiconductor chip is arranged, and a cover, which is mounted on the carrier element in a region extending circumferentially around the semiconductor chip and together with the carrier element forms a sealed cavity in which the at least one optoelectronic semiconductor chip is arranged in an inert gas.
    Type: Grant
    Filed: January 8, 2013
    Date of Patent: May 2, 2017
    Assignee: OSRAM GMBH
    Inventors: Krister Bergenek, Ralph Wirth, Axel Kaltenbacher, Andreas Biebersdorf, Joerg Sorg, Christine Maier, Harald Jaeger, Gertrud Kraeuter, Frank Jermann, Stefan Lange
  • Patent number: 9614348
    Abstract: A light source arrangement is provided. The light source arrangement may include a plurality of semiconductor laser light sources, each having an optical axis. The semiconductor laser light sources are arranged in such a way that their optical axes are oriented parallel to one another so that respective laser light emission sides of the semiconductor laser light sources point in the same spatial direction. The light source arrangement may further include a deflection unit configured to collect and influence beam paths of the laser light emitted by the semiconductor laser light sources in order to form a beam bundle. The semiconductor laser light sources are arranged on a surface of a carrier, distributed at least two-dimensionally over the surface.
    Type: Grant
    Filed: March 19, 2015
    Date of Patent: April 4, 2017
    Assignee: Osram GmbH
    Inventors: Martin Daniels, Ulrich Hartwig, Joerg Sorg
  • Patent number: 9488344
    Abstract: A method for producing a lighting device may include: providing a first mount, fastening a second mount to the first mount, at least partially severing the second mount into at least two parts after fastening of the second mount to the first mount, and fastening at least two luminescence diode chips to that side of the second mount which is remote from the first mount.
    Type: Grant
    Filed: June 12, 2012
    Date of Patent: November 8, 2016
    Assignee: OSRAM GMBH
    Inventors: Joerg Sorg, Ralph Wirth
  • Patent number: 9437792
    Abstract: An optoelectronic semiconductor component includes: at least one optoelectronic semiconductor chip, a leadframe having one a plurality of leadframe parts, at least two electrical connection means via which the semiconductor chip is electrically contact-connected to the leadframe, and a potting body, which is fitted to the leadframe and mechanically supports the latter, wherein the one or at least one of the leadframe parts is provided with a reflective coating at a top side, the semiconductor chip is fitted on the reflective coating at the top side, the leadframe includes at least two contact locations, onto which the connection means are directly fitted, and the contact locations are formed from a material that is different from the reflective coating.
    Type: Grant
    Filed: August 30, 2012
    Date of Patent: September 6, 2016
    Assignee: OSRAM GMBH
    Inventors: Andreas Dobner, Joerg Sorg, Ralph Wirth
  • Patent number: 9380652
    Abstract: The lighting device has at least one LED chip that is potted by means of a potting compound, which potting compound has a light-transmissive, castable and curable matrix material comprising scattering volumes as filler material, wherein the scattering volumes are distributed inhomogeneously over a thickness of the potting compound and these scattering volumes have a lower density than the matrix material in its castable state. A method is used for producing a lighting device, which comprises at least one LED chip, by means of at least the following steps: potting the at least one LED chip by means of a potting compound containing scattering volumes, wherein the scattering volumes have a lower density than a matrix material of the potting compound in this state; curing the potting compound so that an inhomogeneous distribution of the scattering volumes is obtained owing to floating of the scattering volumes in the matrix material.
    Type: Grant
    Filed: April 19, 2013
    Date of Patent: June 28, 2016
    Assignee: OSRAM GmbH
    Inventors: Krister Bergenek, Andreas Biebersdorf, Gertrud Kraeuter, Joerg Sorg, Reiner Windisch
  • Patent number: 9291315
    Abstract: In various embodiments, a lighting device includes at least one laser light source and a light wavelength conversion element. The light wavelength conversion element includes phosphor which is arranged on a surface region of a substrate and is used for wavelength conversion of the light emitted by the at least one laser light source. The light wavelength conversion element has a greater thickness at the edge of the surface region, provided with phosphor, of the substrate than at the surface centroid of the surface region, provided with phosphor, of the substrate. The thickness is respectively measured perpendicularly to the surface region, provided with phosphor, of the substrate.
    Type: Grant
    Filed: July 1, 2014
    Date of Patent: March 22, 2016
    Assignee: OSRAM GmbH
    Inventors: Joerg Sorg, Florian Boesl, Dennis Sprenger
  • Publication number: 20150270682
    Abstract: A light source arrangement is provided. The light source arrangement may include a plurality of semiconductor laser light sources, each having an optical axis. The semiconductor laser light sources are arranged in such a way that their optical axes are oriented parallel to one another so that respective laser light emission sides of the semiconductor laser light sources point in the same spatial direction. The light source arrangement may further include a deflection unit configured to collect and influence beam paths of the laser light emitted by the semiconductor laser light sources in order to form a beam bundle. The semiconductor laser light sources are arranged on a surface of a carrier, distributed at least two-dimensionally over the surface.
    Type: Application
    Filed: March 19, 2015
    Publication date: September 24, 2015
    Inventors: Martin Daniels, Ulrich Hartwig, Joerg Sorg
  • Publication number: 20150062955
    Abstract: In various embodiments, a lighting device includes at least one laser light source and a light wavelength conversion element. The light wavelength conversion element includes phosphor which is arranged on a surface region of a substrate and is used for wavelength conversion of the light emitted by the at least one laser light source. The light wavelength conversion element has a greater thickness at the edge of the surface region, provided with phosphor, of the substrate than at the surface centroid of the surface region, provided with phosphor, of the substrate. The thickness is respectively measured perpendicularly to the surface region, provided with phosphor, of the substrate.
    Type: Application
    Filed: July 1, 2014
    Publication date: March 5, 2015
    Inventors: Joerg Sorg, Florian Boesl, Dennis Sprenger
  • Publication number: 20150036343
    Abstract: A method for producing a lighting device may include: providing a first mount, fastening a second mount to the first mount, at least partially severing the second mount into at least two parts after fastening of the second mount to the first mount, and fastening at least two luminescence diode chips to that side of the second mount which is remote from the first mount.
    Type: Application
    Filed: June 12, 2012
    Publication date: February 5, 2015
    Applicant: OSRAM GMBH
    Inventors: Joerg Sorg, Ralph Wirth
  • Publication number: 20150014711
    Abstract: Various embodiments relate to an optoelectronic component, including a carrier element, on which at least one optoelectronic semiconductor chip is arranged, and a cover, which is mounted on the carrier element in a region extending circumferentially around the semiconductor chip and together with the carrier element forms a sealed cavity in which the at least one optoelectronic semiconductor chip is arranged in an inert gas.
    Type: Application
    Filed: January 8, 2013
    Publication date: January 15, 2015
    Inventors: Krister Bergenek, Ralph Wirth, Axel Kaltenbacher, Andreas Biebersdorf, Joerg Sorg, Christine Maier, Harald Jaeger, Gertrud Kraeuter, Frank Jermann, Stefan Lange
  • Publication number: 20140367708
    Abstract: A light-emitting diode arrangement may include a first layer structure including at least one epitaxially formed light-emitting diode, and at least one second layer structure including at least one epitaxially formed light-emitting diode, wherein the at least one second layer structure is arranged on the first layer structure, and wherein contact faces of the at least one epitaxially formed light-emitting diode in the respective layer structure face contact faces of the at least one epitaxially formed light-emitting diode of the layer structure arranged directly therebelow or thereabove.
    Type: Application
    Filed: December 7, 2012
    Publication date: December 18, 2014
    Inventors: Joerg Sorg, Axel Kaltenbacher, Andreas Biebersdorf
  • Publication number: 20140246688
    Abstract: An optoelectronic semiconductor component includes: at least one optoelectronic semiconductor chip, a leadframe having one a plurality of leadframe parts, at least two electrical connection means via which the semiconductor chip is electrically contact-connected to the leadframe, and a potting body, which is fitted to the leadframe and mechanically supports the latter, wherein the one or at least one of the leadframe parts is provided with a reflective coating at a top side, the semiconductor chip is fitted on the reflective coating at the top side, the leadframe includes at least two contact locations, onto which the connection means are directly fitted, and the contact locations are formed from a material that is different from the reflective coating.
    Type: Application
    Filed: August 30, 2012
    Publication date: September 4, 2014
    Applicant: OSRAM GMBH
    Inventors: Andreas Dobner, Joerg Sorg, Ralph Wirth
  • Patent number: 8393748
    Abstract: An arrangement includes a semiconductor chip, which is designed to emit light during operation, and a cover layer, which lies across from the light-emitting surface of the semiconductor chip, such that light emitted from the semiconductor chip penetrates into the cover layer. In an area of the cover layer, overlapping with the chip, a light deflecting structure is provided by means of which light penetrating into the cover layer is deflected. The cover layer acts as an optical waveguide and is designed to emit the light such that it is distributed over the upper surface of cover layer.
    Type: Grant
    Filed: January 23, 2008
    Date of Patent: March 12, 2013
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventors: Siegfried Herrmann, Berthold Hahn, Joerg Sorg, Stefan Gruber
  • Patent number: 8247263
    Abstract: The invention relates to a method for producing an optical and a radiation-emitting component by a molding process, and to an optical and a radiation-emitting component having well-defined viscosity.
    Type: Grant
    Filed: February 28, 2006
    Date of Patent: August 21, 2012
    Assignee: Osram Opto Semiconductors GmbH
    Inventors: Bert Braune, Herbert Brunner, Harald Jäger, Jörg Sorg
  • Publication number: 20110057218
    Abstract: A semiconductor based component with radiation-emitting properties. A glass substrate (1) is provided, which has a first surface (2) and a second surface (1), where a semiconductor element (5) with radiation-emitting properties is accommodated on the first surface (2). Also disclosed is a method for fabricating a semiconductor based component, with the following steps: providing a glass substrate (1), application of a semiconductor element (5) to the first surface (2) of the glass substrate. Also disclosed is a receptacle for a semiconductor based component in which two electrical contact areas (13) are provided, which can be electrically connected to contact areas (7) of the semiconductor based component.
    Type: Application
    Filed: September 12, 2008
    Publication date: March 10, 2011
    Applicant: OSRAM Opto Semiconductors GmbH
    Inventors: Jörg Sorg, Stefan Gruber
  • Publication number: 20100103650
    Abstract: An arrangement includes a semiconductor chip, which is designed to emit light during operation, and a cover layer, which lies across from the light-emitting surface of the semiconductor chip, such that light emitted from the semiconductor chip penetrates into the cover layer. In an area of the cover layer, overlapping with the chip, a light deflecting structure is provided by means of which light penetrating into the cover layer is deflected. The cover layer acts as an optical waveguide and is designed to emit the light such that it is distributed over the upper surface of cover layer.
    Type: Application
    Filed: January 23, 2008
    Publication date: April 29, 2010
    Inventors: Siegfried Herrmann, Berthold Hahn, Joerg Sorg, Stefan Gruber
  • Patent number: 7455461
    Abstract: To secure an optical lens over an optoelectronic transmitter or receiver, it is proposed to use a UV-initiated or photoinitiated, cationically curing epoxy resin, by means of which the bonded joint can be set and thereby fixed in a few seconds. Also proposed, for use as adhesives, are resin compositions that can be applied as liquids, are optically matched, and are optimized for durable, reliable use in optoelectronic components and for the large-scale manufacture thereof.
    Type: Grant
    Filed: May 11, 2001
    Date of Patent: November 25, 2008
    Assignee: Osram Opto Semiconductors GmbH
    Inventors: Klaus Höhn, Jörg Sorg