Abstract: A wave spring having an axially resilient spring section including at least one one-layer wave-shaped spring configured to provide a spring force in an axial direction of the wave spring, and a radially resilient spring section configured to provide a spring force in a radial direction. The wave spring may be made from a continuous flat wire that forms both the axially resilient spring section and the radially resilient spring section, the flat wire being rotated 90° at a transition from the axial spring section to the radial spring section.

Abstract: A non-locating bearing assembly includes a bearing unit configured to support a rotating component relative to a stationary component, the bearing unit including a stationary bearing ring and a rotatable bearing ring that are rotatable with respect to each other. The rotatable bearing ring is fixedly connectable to the rotating component, and the stationary bearing ring is mountable in the stationary component in a rotationally fixed but axially displaceable manner. A connector is provided between the stationary bearing ring and the stationary component to connect the bearing ring to the stationary component in an axially displaceable but substantially rotationally fixed manner, and the connection is provided by a combination of a friction fit and an interference fit acting in the circumferential direction.

Abstract: A bearing assembly includes a bearing unit configured to support a rotating component relative to a stationary component and having a first stationary bearing ring configured to be connected to the stationary component in a rotationally fixed manner by a bearing carrier and a second rotatable bearing ring configured to be connected to the rotating component. The bearing carrier includes at least one electrical conductor configured to make electrical contact with the bearing unit and to make electrical contact with the stationary component or to be electrically connected to the stationary component when the bearing carrier is mounted to the stationary component.

Abstract: A non-locating bearing assembly includes a bearing unit configured to support a rotating component relative to a stationary component, and the bearing unit includes a first stationary bearing ring and a second rotatable bearing ring that is fixedly connectable to the rotating component. The bearing assembly also includes a bearing carrier to which the stationary bearing ring is attached in a rotationally fixed but axially displaceable manner, and the bearing carrier is configured to be fixedly connected to the stationary component.

Abstract: A non-locating bearing assembly includes a bearing unit configured to support a rotating component relative to a stationary component, and the bearing unit includes a first stationary bearing ring and a second rotatable bearing ring that is fixedly connectable to the rotating component. The assembly also includes a bearing carrier to which the stationary bearing ring is attached in a rotationally fixed but axially displaceable manner, and the bearing carrier is configured to be fixedly connected to the stationary component.

Abstract: A non-locating bearing assembly includes a bearing unit configured to support a rotatable component relative to a stationary component, the bearing unit including a first stationary bearing ring and a second rotatable bearing ring. The rotatable bearing ring is fixedly connectable to the rotatable component, and a bearing carrier is attached to the stationary bearing ring in a rotationally fixed but axially displaceable manner by a combination of a friction fit and an interference fit. The bearing carrier is configured to be fixedly connected to the stationary component.

Abstract: A bearing assembly includes a bearing unit configured to support a rotatable component relative to a stationary component which may be a bearing carrier, the bearing unit including a stationary bearing ring and a rotatable bearing ring. The rotatable bearing ring is connectable to the rotatable component and the stationary bearing ring is connectable to the bearing carrier such that they are rotationally fixed. At least part of the bearing unit is not covered by the bearing carrier.

Abstract: A bearing assembly includes a bearing unit configured to support a rotatable component relative to a stationary component, the bearing unit including a stationary bearing ring and a rotatable bearing ring, the rotatable bearing ring being connectable to the rotatable component and the stationary bearing ring being connectable to the stationary component such that the stationary bearing ring and the stationary component are rotationally fixed. The stationary component or a connecting element between the stationary component and the stationary bearing ring comprises a plurality of layers which may be formed by an additive manufacturing process. Also a method of forming the bearing assembly.

Abstract: A structural unit includes a cylindrical component and a metal-plate element having a through-neck, and the cylindrical component extends though the through-neck and is attached to the cylindrical component. The through-neck substantially determines a position of the metal-plate element relative to the cylindrical component with respect to a radial direction of the cylindrical component. Also an oil mist separator including the structural unit.

Abstract: The present disclosure is directed to a lead frame design that includes a copper alloy base material coated with an electroplated copper layer, a precious metal, and an adhesion promotion compound. The layers compensate for scratches or surface irregularities in the base material while promoting adhesion from the lead frame to the conductive connectors, and to the encapsulant by coupling them to different layers of a multilayer coating on the lead frame. The first layer of the multilayer coating is a soft electroplated copper to smooth the surface of the base material. The second layer of the multilayer coating is a thin precious metal to facilitate a mechanical coupling between leads of the lead frame and conductive connectors. The third layer of the multilayer coating is the adhesion promotion compound for facilitating a mechanical coupling to an encapsulant around the lead frame.

Abstract: A bearing carrier or a housing part includes a base body, a first component and at least one second component mounted in the base body, and a belt or a cable or a roving connected to the base body and to the first component and the second component such that the belt or the cable or the roving at least partially transmits forces that act on the first component to the second component. The first and second components may each be formed as rings having a cylindrical inner surface and an outer surface having a groove, and the element may pass through the grooves of the first and second components and be embedded in the base body.

Abstract: The present disclosure is directed to a lead frame design that includes a copper alloy base material coated with an electroplated copper layer, a precious metal, and an adhesion promotion compound. The layers compensate for scratches or surface irregularities in the base material while promoting adhesion from the lead frame to the conductive connectors, and to the encapsulant by coupling them to different layers of a multilayer coating on the lead frame. The first layer of the multilayer coating is a soft electroplated copper to smooth the surface of the base material. The second layer of the multilayer coating is a thin precious metal to facilitate a mechanical coupling between leads of the lead frame and conductive connectors. The third layer of the multilayer coating is the adhesion promotion compound for facilitating a mechanical coupling to an encapsulant around the lead frame.

Abstract: A lead-frame structure having two faces and exposing a treated silver surface on at least one of said two faces, the treated silver surface(s) serving the wire bonding, which lead-frame structure has a surface which, after applying resin to it, has excellent adhesion even under severe testing conditions, such as the IPC/JEDEC J-STD-20 MSL standard, and a surface mount electronic device comprising a lead-frame or lead-frame entity and at least one semiconductor device mounted thereon, wherein the lead-frame or lead-frame entity exposes a treated silver surface on at least one of the two faces thereof, wherein the treated silver surface(s) serve(s) the wire bonding, and wherein a resin is applied to the lead-frame or lead-frame entity, and which surface mount electronic device has excellent adhesion of the surface of the lead-frame or lead-frame entity even under severe testing conditions.

Abstract: A method of producing a lead-frame structure having two faces and exposing a treated silver surface on at least one of the two faces, the treated silver surface(s) serving the wire bonding, which yields a surface which, after applying resin to it, has excellent adhesion even under severe testing conditions, such as the IPC/JEDEC J-STD-20 MSL standard, and a method of producing a surface mount electronic device including a lead-frame or lead-frame entity and at least one semiconductor device mounted thereon, wherein the lead-frame or lead-frame entity exposes a treated silver surface on at least one of the two faces, wherein the treated silver surface(s) serve(s) the wire bonding, and wherein a resin is applied to the lead-frame or lead-frame entity, which method yields excellent adhesion of the surface of the lead-frame or lead-frame entity even under severe testing conditions.

Abstract: A retaining element configured to retain an outer ring of a bearing in a housing, the retaining element having a body having a first side and a second side and a substantially circular through-hole extending from the first side to the second side and an axial thickness from the first side to the second side. A boundary of the through-hole includes two or fewer recesses. The retaining element is configured to hold an attachment element in the two or fewer recesses, the attachment element being configured to engage a groove in a bearing to hold the bearing in the retaining element.

Abstract: The present disclosure is directed to a lead frame design that includes a copper alloy base material coated with an electroplated copper layer, a precious metal, and an adhesion promotion compound. The layers compensate for scratches or surface irregularities in the base material while promoting adhesion from the lead frame to the conductive connectors, and to the encapsulant by coupling them to different layers of a multilayer coating on the lead frame. The first layer of the multilayer coating is a soft electroplated copper to smooth the surface of the base material. The second layer of the multilayer coating is a thin precious metal to facilitate a mechanical coupling between leads of the lead frame and conductive connectors. The third layer of the multilayer coating is the adhesion promotion compound for facilitating a mechanical coupling to an encapsulant around the lead frame.

Abstract: To achieve tin deposits being largely free of pressure induced whiskers, a method of depositing a tin layer on a metal substrate is devised, wherein said method comprises: (a) providing said metal substrate; (b) depositing a nickel/phosphorous alloy underlayer on at least one surface of said metal substrate; and (c) depositing said tin layer on said nickel/phosphorous alloy underlayer by depositing said tin layer comprising using a pulse plating method.

Abstract: A structural unit includes a cylindrical component and a metal-plate element having a through-neck, and the cylindrical component extends though the through-neck and is attached to the cylindrical component. The through-neck substantially determines a position of the metal-plate element relative to the cylindrical component with respect to a radial direction of the cylindrical component. Also an oil mist separator including the structural unit.

Abstract: A lead-frame structure having two faces and exposing a treated silver surface on at least one of said two faces, the treated silver surface(s) serving the wire bonding, which lead-frame structure has a surface which, after applying resin to it, has excellent adhesion even under severe testing conditions, such as the IPC/JEDEC J-STD-20 MSL standard, and a surface mount electronic device comprising a lead-frame or lead-frame entity and at least one semiconductor device mounted thereon, wherein the lead-frame or lead-frame entity exposes a treated silver surface on at least one of the two faces thereof, wherein the treated silver surface(s) serve(s) the wire bonding, and wherein a resin is applied to the lead-frame or lead-frame entity, and which surface mount electronic device has excellent adhesion of the surface of the lead-frame or lead-frame entity even under severe testing conditions.

Abstract: A method of producing a lead-frame structure having two faces and exposing a treated silver surface on at least one of the two faces, the treated silver surface(s) serving the wire bonding, which yields a surface which, after applying resin to it, has excellent adhesion even under severe testing conditions, such as the IPC/JEDEC J-STD-20 MSL standard, and a method of producing a surface mount electronic device including a lead-frame or lead-frame entity and at least one semiconductor device mounted thereon, wherein the lead-frame or lead-frame entity exposes a treated silver surface on at least one of the two faces, wherein the treated silver surface(s) serve(s) the wire bonding, and wherein a resin is applied to the lead-frame or lead-frame entity, which method yields excellent adhesion of the surface of the lead-frame or lead-frame entity even under severe testing conditions.