Abstract: Described is a new a solution comprising a phosphorous compound and optionally a solderability-enhancing compound and its use in a process for increasing the solderability and corrosion resistance of a metal or metal alloy surface.

Abstract: The invention relates to a layer system comprising on a substrate, the surface of which has been electropolished, (i) a Ni layer having a thickness ?3.0 ?m, (ii) a Ni—P layer having a thickness ?1.0 ?m, and (iii) a Au layer having a thickness ?1.0 ?m.

Abstract: The invention addresses the problem of improving the adhesion between silver surfaces and resin materials, such as epoxy resins and mold materials, used in the production of electronic devices. The invention provides a method for improving the adhesion between a silver surface and a resin material comprising a step of electrolytically treating the silver surface with a solution containing a hydroxide selected from alkali metal hydroxides, alkaline earth metal hydroxides, ammonium hydroxides and mixtures thereof, wherein the silver surface is the cathode.

Abstract: Described is a new a solution comprising a phosphorous compound and optionally a solderability-enhancing compound and its use in a process for increasing the solderability and corrosion resistance of a metal or metal alloy surface.

Abstract: The present invention relates to aqueous post-treatment compositions and an immersion and/or electrolytical process using said compositions for corrosion protection of metal and/or metal alloy surfaces. The aqueous post-treatment compositions comprise at least one polysiloxane betaine compound and at least one phosphorus containing compound.

Abstract: The invention relates to a layer system comprising on a substrate, the surface of which has been electropolished, (i) a Ni layer having a thickness ?3.0 ?m, (ii) a Ni—P layer having a thickness ?1.0 ?m, (iii) a Au layer having a thickness ?1.0 ?m.

Abstract: The invention concerns processes and solutions for the treatment of copper alloy surfaces, which are subsequently to be firmly bonded to polymeric material. The solution is used, in particular for firmly bonding lead frames to encapsulating molding compounds (polymeric material). The solution contains an oxidant, at least one acid, at least one adhesion-enhancing compound characterized in that the solution additionally contains fluoride ions in an amount of at least 100 mg per litre and chloride ions in an amount of 5 to 40 mg per litre. The solution is particularly useful for treatment of copper alloy surfaces, containing alloying elements selected from the group consisting of Si, Ni, Fe, Zr, P, Sn and Zn.

Abstract: A method for electrodepositing a metal layer from an electrolytic bath is described, wherein the concentrations of at least two components of the electrolytic bath are monitored by carrying out the following steps: (a) a sample is taken from the electrolytic bath; (b) the sample is supplied to a column for solid phase extraction, which contains a solid sorbent material; (c) the column is subjected to a washing procedure with a first eluent, wherein the at least two components remain on the column, and undesired components are eluted from the column; (d) the at least two components are eluted from the column by a second eluent; (e) the concentrations of the at least two components in the eluate obtained in step (d) are determined without separating the components from each other. In this method the use of poly(divinyl benzene-co-N-vinyl pyrrolidone) for solid phase extraction is particularly advantageous.