Abstract: A microlithographic projection exposure apparatus contains an illumination system for generating projection light and a projection lens with which a reticle that is capable of being arranged in an object plane of the projection lens can be imaged onto a light-sensitive layer that is capable of being arranged in an image plane of the projection lens. The projection lens is designed for immersion mode, in which a final lens element of the projection lens on the image side is immersed in an immersion liquid. A terminating element that is transparent in respect of the projection is fastened between the final lens element on the image side and the light-sensitive layer.

Abstract: An imaging device in a projection exposure machine for microlithography comprises at least one optical element and at least one manipulator, a linear drive for manipulating the position of the optical element. Said linear drive has at least one moving element, said moving element having a shearing part and a lifting part. Said shearing part is arranged to move the optical element and said lifting part is arranged to move said shearing part. Said linear drive has a supporting element which is in contact with and prevents movement of the optical element while the shearing part is moved by the lifting part.

Abstract: A method and a device for the hot-repairing of the heating flues of a coke-oven battery according to which the completed sections of a heating flue still under construction are heated by means of a heated gas. The heated gas comprises the air usually provided for combustion in the heating flues during coking operations. The air is guided through the flow paths provided for in the coke-oven battery for combustion air and waste gases as well as through the regenerator, heated as it passes through the flow paths and then guided through the heating flues to be repaired. The completed section of the heating flue is separated from the non-completed portion by an air-reversion device that also directs the heated air.

Abstract: In a smart card module for biometric sensors for installation in smart cards, a support has at least one through opening or window in the region of a sensor chip. The sensor chip is mounted on the support such that an active surface of the sensor chip is directed toward the support and is situated in the region of the window, so that it can be accessed through the window in the support.

Abstract: A portable data carrier includes a card-shaped body having a recess for receiving a chip module. The chip module includes at least one semiconductor chip on a first main side of a chip carrier connected to the card-shaped body, and a metallization layer disposed on a second main side of the chip carrier and having contact lugs. The chip carrier has desired bending points which, upon the occurrence of bending stresses, reduce forces on the semiconductor chip and wire connections.

Abstract: A carrier element for a semiconductor chip and in particular for incorporation into smart cards. The carrier element has an encapsulation composition protecting the semiconductor chip. The carrier element connections are disposed on one of the main surfaces of the encapsulation composition along only two opposite edges. They are made of a conductive material and have a reduced thickness at the ends facing one another, the cross section having a step only on one side. The semiconductor chip is disposed on the connections in a region of the section of reduced thickness and is mechanically connected to the connections.

Abstract: A radio receiver for use in a vehicle, the radio receiver including a hard-disk drive having a hard disk, on which data can be stored in a non-volatile manner on storage locations of the hard disk, and a write-read memory so that data stored on the hard disk can be transferred into the write-read memory and can be displayed on a display device.

Abstract: A damp mop for plane surfaces having two mop plates 1, 2 that are coupled to a handle 13 and that have a mop pad 35 provided thereon. The two mop plates 1,2 are joined by a double joint 3, and can be pressed against one another by pressure arms 19, 20 disposed on a slide sleeve. The handle 13 is secured pivotably to the double joint 3 via a cardan joint 8.

Abstract: An optimized CO2 air-conditioning system for a vehicle has individual components designed and/or matched to one another in such a way that if the high pressures in the high-pressure section deviate by up to ±30% from the optimum high pressures, the associated optimum performance figures are reduced by no more than 20%. The individual components include a controllable compressor, a gas cooler, an internal heat exchanger, an evaporator and an accumulator. As a result, a fixed throttle expansion member can be used between the high-pressure and low-pressure sections of the system.

Abstract: Flip-chip bumps (solder bumps) are applied on the contact-connection points of a semiconductor chip. These bumps extend from there through a covering compound (mold) that is applied as a protective layer. The end of each one of the bumps that is remote from the semiconductor chip forms a pad. This pad lies approximately plane-parallel in the surface of the covering compound that is remote from the semiconductor chip. At least during the encapsulation process, the chips are preferably arranged on a carrier element, in particular a carrier strip.

Abstract: An adjusting optical element mount (1) serves for the position of two components (2a, 2b) in relation to one another, in particular of two carrier elements for optical elements, such as mirrors or lenses, in particular as an axial and/or angle manipulator for lithography lenses. The components (2a, 2b) can be adjusted in relation to one another via the action of force (F, T). Each of the components (2a, 2b) has at least three hinges (4a, 4b, 4c, 4d, 5a, 5b, 5c, 5d). Each of the hinges (4a, 4b, 4c, 4d) of one component (2a) is connected in each case to a corresponding hinge (5a, 5b, 5c, 5d) of the respectively other component (2b) to form a pair of hinges (7a, 7b, 7c, 7d) via a lever element (6a, 6b, 6c, 6d) in each case.

Abstract: A method for producing a chip module includes punching a chip carrier to form a chip carrier fixing section and chip carrier contact sections spaced apart from the chip carrier fixing section by slots defining a given distance. The given distance is subsequently reduced to a dimension preventing a flow through of a sealing mass by a swaging operation carried out at least in a region close to the slots.

Abstract: An adjusting optical element mount (1) serves for the position of two components (2a, 2b) in relation to one another, in particular of two carrier elements for optical elements, such as mirrors or lenses, in particular as an axial and/or angle manipulator for lithography lenses. The components (2a, 2b) can be adjusted in relation to one another via the action of force (F, T). Each of the components (2a, 2b) has at least three hinges (4a, 4b, 4c, 4d, 5a, 5b, 5c, 5d). Each of the hinges (4a, 4b, 4c, 4d) of one component (2a) is connected in each case to a corresponding hinge (5a, 5b, 5c, 5d) of the respectively other component (2b) to form a pair of hinges (7a, 7b, 7c, 7d) via a lever element (6a, 6b, 6c, 6d) in each case.

Abstract: A smart card with a card carrier on which a data processing circuit and also a connection assembly for the contactless communication of data between the data processing circuit and an external data processing station are provided. In the course of producing a prior art smart card, an integrated circuit is applied to a card carrier made of plastic. Afterwards, a transmitting/receiving coil connected to corresponding terminals of the integrated circuit is applied along the outer edges of the prior art smart card. In the case of the prior art smart card, the fact that defective prior art smart cards have to be destroyed is disadvantageous. According to the invention, the data processing circuit and the connection assembly are provided in a region of at least one module carrier and the card carrier has a region for accommodating the module carrier. This makes it possible firstly to test the completed module carrier in respect of its proper functioning before it is incorporated into a card carrier.

Abstract: A data transmission method is described, where first data is transmitted to a first processor, then second data based on the first data is transmitted to a second processor, and a check result is transmitted back to the first processor. This permits an independent check of data transmitted to a first processor by a second processor, so that abuse or prohibited use of first data in the first processor can be prevented.

Abstract: A separable pipe joint has two pipe segments that can be inserted one into the another, a gasket-seal arranged between the pipe segments, and a collet which is arranged so as to be adjustable between a separated position and a clamped position, and which is provided with latching means for axially fixing the pipe segments. To indicate a wear-resistant separable pipe joint, which permits a variable assembly of pipe segments adjoining each other, provision is made that as latching means for fixing at least two axially spaced latching members, radially extending to the inside, are arranged on the collet, the latching members in the clamped position of the collet gripping from behind, in each case, a radially elevated clamping step on the external surface of each pipe segment.

Abstract: A chip module has a contact area disposed on its outer side formed of a plurality of essentially flat contact elements of electrically conductive material insulated from one another. At least one semiconductor chip having one or more integrated semiconductor circuits that are electrically connected to the contact elements of the contact area via bonding wires. The contact elements of the chip module are formed by a prefabricated lead frame for supporting the at least one semiconductor chip and have on two opposing sides of the chip module outwardly offset terminals arranged in rows next to one another. The outwardly offset terminals are provided for surface mounting the chip module on the mounting surface of an external printed circuit board or an external circuit board substrate.

Abstract: A device of a vehicle for data transmission to a stationary beacon 91), which has a transceiver, comprising an on-board unit (2) with an antenna (6) for receiving a continuous signal (5), broadcast by the beacon (1), and for transmitting the received signal (5) back after modulation with a data signal (i(t)), is characterized in that the signal (7) transmitted back by the on-board unit (2) is a double-sideband signal. In that case, the on-board unit (2) can be designed as extremely simply and in the simplest case comprises a diode (9) connected to the base of the antenna (6).