Abstract: A medical pump, in particular an infusion pump for conveying a medium, includes a seating for a hose clamp which is separate from the pump and arranged on the hose. Two clamping portions of the hose clamp which can be moved relative to each other can be transferred into a closed relative position in which they pinch off the hose arranged therebetween in such a manner that it is not possible for any medium to flow through the interior of the hose. Moreover, the clamping portions can be moved with respect to each other into an opened relative position in which the hose arranged between the clamping portions is not pinched off, so that the medium is able to flow through the interior of the hose. The pump is distinguished in that a sensor is provided thereon, in particular in the seating for the hose clamp, which sensor detects at least when the hose clamp is received in the seating—whether their clamping portions are in the closed or opened relative position.

Abstract: A medical pump, in particular an infusion pump for conveying a medium, includes a seating for a hose clamp which is separate from the pump and arranged on the hose. Two clamping portions of the hose clamp which can be moved relative to each other can be transferred into a closed relative position in which they pinch off the hose arranged therebetween in such a manner that it is not possible for any medium to flow through the interior of the hose. Moreover, the clamping portions can be moved with respect to each other into an opened relative position in which the hose arranged between the clamping portions is not pinched off, so that the medium is able to flow through the interior of the hose. The pump is distinguished in that a sensor is provided thereon, in particular in the seating for the hose clamp, which sensor detects at least when the hose clamp is received in the seating—whether their clamping portions are in the closed or opened relative position.

Abstract: A submodule and an assembly include a switching device having a substrate, and printed conductors arranged thereupon. The submodule incorporates a first and a second DC voltage printed conductor, to which a first and a second DC voltage terminal element are connected in an electrically conductive manner, and an AC voltage printed conductor, to which an AC voltage terminal element is connected in an electrically conductive manner. The submodule further comprises an insulating moulding, which encloses the switching device in a frame-type arrangement. The first DC voltage terminal element, by means of a first contact section, engages with a first supporting body of the insulating moulding, and the AC voltage terminal element, by means of a second contact section, engages with a second supporting body of the insulating moulding.

Abstract: A medical tube clamp for clamping a flexible medical tube comprising: a tube receiving area which is adapted to receive the medical tube, a first clamping portion including a first clamping jaw which is movable relative to a second clamping portion including a second clamping jaw, and a closure system for safely positioning the two clamping portions in more than one snap-fit position relative to each other so that, when the closure system is unlocked, the medical tube can be inserted in and removed from the tube clamp, in an open snap-fit position the inserted medical tube cannot be removed and is not clamped and in a clamping snap-fit position the medical tube is clamped between the first clamping jaw and the second clamping jaw, with the first clamping jaw being configured to be elastically movable relative to the first clamping portion via a connecting member and/or the second clamping jaw being configured to be elastically movable relative to the second clamping portion via a connecting member.

Abstract: A submodule and an assembly include a switching device having a substrate, and printed conductors arranged thereupon. The submodule incorporates a first and a second DC voltage printed conductor, to which a first and a second DC voltage terminal element are connected in an electrically conductive manner, and an AC voltage printed conductor, to which an AC voltage terminal element is connected in an electrically conductive manner. The submodule further comprises an insulating moulding, which encloses the switching device in a frame-type arrangement. The first DC voltage terminal element, by means of a first contact section, engages with a first supporting body of the insulating moulding, and the AC voltage terminal element, by means of a second contact section, engages with a second supporting body of the insulating moulding.

Abstract: A power electronic arrangement has a power converter module, and a first and a second DC voltage terminal element and a first and a second DC voltage connection element, connected to conductor tracks in an electrically conductive manner with the correct polarity. First and second DC voltage terminal element, and the first and second DC voltage connection element, form a stack with an insulation device therebetween. The first DC voltage terminal element has a first recess enclosed in a first main plane, the second DC voltage connection element has a second recess enclosed and aligned with the first in a third main plane, the second DC voltage terminal element and the first DC voltage connection element are in a second main plane between the first and third main plane, and are laterally spaced from each other proximate the recesses.

Abstract: A medical fluid pump, comprising a first, inner fluid system including a motor-driven suction/pressure unit and a first fluid pressure chamber which can be filled with fluid and emptied by the suction/pressure unit, and a second, outer fluid system including a second fluid pressure chamber which is coupled to the first pressure chamber in a pressure- and/or volume-dynamic manner via a movable separating wall and which is alternately coupled—via a valve means of the second fluid system—to a suction line and pressure line depending on the current working phase of the suction/pressure unit of the first fluid system is disclosed.

Abstract: A medical pump, in particular an infusion pump for conveying a medium, includes a seating for a hose clamp which is separate from the pump and arranged on the hose. Two clamping portions of the hose clamp which can be moved relative to each other can be transferred into a closed relative position in which they pinch off the hose arranged therebetween in such a manner that it is not possible for any medium to flow through the interior of the hose. Moreover, the clamping portions can be moved with respect to each other into an opened relative position in which the hose arranged between the clamping portions is not pinched off, so that the medium is able to flow through the interior of the hose. The pump is distinguished in that a sensor is provided thereon, in particular in the seating for the hose clamp, which sensor detects at least when the hose clamp is received in the seating—whether their clamping portions are in the closed or opened relative position.

Abstract: A power semiconductor module, and an arrangement using the module. The module has a basic parallelepipedal shape with opposed pairs of main, longitudinal and narrow sides, a cooling device which is capable of carrying a flow of a cooling fluid, having a power electronics switch and a housing. The cooling device has a cooling volume with at least one cooling face and four connection devices which are arranged in pairs on the main sides. In addition, the connection devices carry the cooling fluid and are designed as a flow inflow and a flow outflow and as a return inflow and a return outflow, respectively. The power electronics switch has load input connection devices and load output connection devices which are arranged on one or both longitudinal sides and a control connection device which is arranged on a narrow side of the module.

Abstract: A power semiconductor module comprising a substrate. The power semiconductor module has first and second DC voltage load current connection elements and first and second power semiconductor components. The first and second power semiconductor components are arranged along a lateral first direction of the substrate. The power semiconductor module has a foil composite having a first metallic foil layer and a structured second metallic foil layer and an electrically insulating foil layer arranged between the first and second metallic foil layers. The first power semiconductor component and the second power semiconductor component are electrically conductively connected to the foil composite and to the substrate. The first and second power semiconductor components are arranged on a common side in relation to the first and second DC voltage load current connection elements. The invention provides a power semiconductor module having a particularly low-inductance construction.

Abstract: A medical fluid pump, comprising a first, inner fluid system including a motor-driven suction/pressure unit and a first fluid pressure chamber which can be filled with fluid and emptied by the suction/pressure unit, and a second, outer fluid system including a second fluid pressure chamber which is coupled to the first pressure chamber in a pressure- and/or volume-dynamic manner via a movable separating wall and which is alternately coupled—via a valve means of the second fluid system—to a suction line and pressure line depending on the current working phase of the suction/pressure unit of the first fluid system is disclosed.

Abstract: An arrangement having a cooling circulation, a plurality of modular power semiconductor modules and at least one capacitor, wherein a power semiconductor module has a power electronics switch and a cooling device, which is capable of carrying a flow of a cooling fluid, for cooling the switch, the cooling device having at least one cooling face, and four connection devices for the cooling fluid. The connection devices are arranged in pairs on main sides of the power semiconductor module. The power semiconductor modules have their main sides strung together modularly by connecting corresponding connection devices on successive power semiconductor modules. To this end, at least two successive power semiconductor modules have a capacitor arranged between them which, for its part, is cooled by means of the cooling circulation of the cooling fluid as provided by the arrangement.

Abstract: A power electronic system with a cooling device, and a method for producing the system, comprising a plurality of submodules, each submodule having a first planar insulating material body, one first conductor track cohesively connected thereto, one power switch arranged on the conductor track, at least one internal connecting device composed of an alternate layer sequence of at least one electrically conductive film and at least one electrically insulating film, wherein at least one electrically conductive layer forms at least one second conductor track, and comprising external connection elements. In this case, the submodules are arranged cohesively or in a force-locking manner and in a manner spaced apart from one another with their first main surface on the cooling device. At least one second conductor track at least partially covers first conductor tracks of two submodules, electrically connects them to one another and covers an interspace between the submodules.

Abstract: A surface-mountable magnetic field sensor (1) with a semiconductor chip (4), a magnetic field measuring device (30), and in a method for producing and populating a circuit board (24) having a magnetic field sensor (1), the magnetic field sensor (1) has a semiconductor chip (4), which is arranged on a flat-conductor substrate (5). At least three flat-conductor electrodes (6 to 9), which protrude out of a plastic housing side (10), are electrically connected to the semiconductor chip (4). The flat-conductor substrate (5) and the semiconductor chip (4) are embedded in a plastic housing (11). The plastic housing (11) can be inserted with the embedded semiconductor chip (4) into a magnetic field gap (12), with the flat-conductor electrodes (6 to 9) protruding, wherein the flat-conductor electrodes (6 to 9) have bends (13 to 16) at a distance from the plastic housing side (10), the bends being surface-mountable on a circuit board.

Abstract: A power semiconductor module comprising a substrate. The power semiconductor module has first and second DC voltage load current connection elements and first and second power semiconductor components. The first and second power semiconductor components are arranged along a lateral first direction of the substrate. The power semiconductor module has a foil composite having a first metallic foil layer and a structured second metallic foil layer and an electrically insulating foil layer arranged between the first and second metallic foil layers. The first power semiconductor component and the second power semiconductor component are electrically conductively connected to the foil composite and to the substrate. The first and second power semiconductor components are arranged on a common side in relation to the first and second DC voltage load current connection elements. The invention provides a power semiconductor module having a particularly low-inductance construction.

Abstract: An arrangement having a cooling circulation, a plurality of modular power semiconductor modules and at least one capacitor, wherein a power semiconductor module has a power electronics switch and a cooling device, which is capable of carrying a flow of a cooling fluid, for cooling the switch, the cooling device having at least one cooling face, and four connection devices for the cooling fluid. The connection devices are arranged in pairs on main sides of the power semiconductor module. The power semiconductor modules have their main sides strung together modularly by connecting corresponding connection devices on successive power semiconductor modules. To this end, at least two successive power semiconductor modules have a capacitor arranged between them which, for its part, is cooled by means of the cooling circulation of the cooling fluid as provided by the arrangement.

Abstract: A power semiconductor module, and an arrangement using the module. The module has a basic parallelepipedal shape with opposed pairs of main, longitudinal and narrow sides, a cooling device which is capable of carrying a flow of a cooling fluid, having a power electronics switch and a housing. The cooling device has a cooling volume with at least one cooling face and four connection devices which are arranged in pairs on the main sides. In addition, the connection devices carry the cooling fluid and are designed as a flow inflow and a flow outflow and as a return inflow and a return outflow, respectively. The power electronics switch has load input connection devices and load output connection devices which are arranged on one or both longitudinal sides and a control connection device which is arranged on a narrow side of the module.

Abstract: A power electronic system with a cooling device, and a method for producing the system, comprising a plurality of submodules, each submodule having a first planar insulating material body, one first conductor track cohesively connected thereto, one power switch arranged on the conductor track, at least one internal connecting device composed of an alternate layer sequence of at least one electrically conductive film and at least one electrically insulating film, wherein at least one electrically conductive layer forms at least one second conductor track, and comprising external connection elements. In this case, the submodules are arranged cohesively or in a force-locking manner and in a manner spaced apart from one another with their first main surface on the cooling device. At least one second conductor track at least partially covers first conductor tracks of two submodules, electrically connects them to one another and covers an interspace between the submodules.

Abstract: A pressure-contact power semiconductor module is arranged on a heat sink. The power semiconductor module is used with at least one substrate provided with conductor tracks and power semiconductor components. The module has a mounting body, on the underside of which the at least one substrate is arranged, and which is formed with cutouts. The module also includes a load connection element which is provided with contact feet that project away from strip sections and make pressure contact with the conductor tracks. The power semiconductor module additionally has a dimensionally stable cover, which covers the mounting body on all sides and is connected to the mounting body by means of snap-action latching connections. At least one pad element is restrained between the cover and the strip sections of the load connection elements.

Abstract: A surface-mountable magnetic field sensor (1) with a semiconductor chip (4), a magnetic field measuring device (30), and in a method for producing and populating a circuit board (24) having a magnetic field sensor (1), the magnetic field sensor (1) has a semiconductor chip (4), which is arranged on a flat-conductor substrate (5). At least three flat-conductor electrodes (6 to 9), which protrude out of a plastic housing side (10), are electrically connected to the semiconductor chip (4). The flat-conductor substrate (5) and the semiconductor chip (4) are embedded in a plastic housing (11). The plastic housing (11) can be inserted with the embedded semiconductor chip (4) into a magnetic field gap (12), with the flat-conductor electrodes (6 to 9) protruding, wherein the flat-conductor electrodes (6 to 9) have bends (13 to 16) at a distance from the plastic housing side (10), the bends being surface-mountable on a circuit board.