Abstract: A power semiconductor module that includes a substrate having at least one power semiconductor element; a heat sink for dissipation of heat from the at least one power semiconductor element and a housing having a cutout which is arranged on a lower face of the housing facing the heat sink and holds the substrate; and to a method for production of such power semiconductor modules. The power semiconductor module has at least one holding element, which engages in a recess, which is associated with the at least one holding element, on the lower face of the housing and is designed such that it limits any movement of the substrate in the direction of the lower face of the housing.

Abstract: A power semiconductor module includes a housing, terminal elements leading to the outside of the housing, an electrically insulated substrate arranged inside the housing, with the substrate being comprised of an insulating body and having on the first main face facing away from the base plate a plurality of connecting tracks electrically insulated from each other. The terminal and connecting elements are arranged on a connecting track in with contact faces contacting connecting tracks or power semiconductor components, with the individual contact faces having a plurality of partial contact faces. In one optional embodiment, each partial contact face has a maximum area of 20 mm2. In another embodiment, partial contact faces each are arranged at a distance of approximately 5 mm with regard to each other and the connection of the partial faces to the connecting tracks or the power semiconductor components is flush.

Abstract: A power semiconductor module that includes a substrate having at least one power semiconductor element; a heat sink for dissipation of heat from the at least one power semiconductor element and a housing having a cutout which is arranged on a lower face of the housing facing the heat sink and holds the substrate; and to a method for production of such power semiconductor modules. The power semiconductor module has at least one holding element, which engages in a recess, which is associated with the at least one holding element, on the lower face of the housing and is designed such that it limits any movement of the substrate in the direction of the lower face of the housing.

Abstract: A power semiconductor module with a scalable construction, having a base plate or intended for direct mounting on a heat sink. The module has a framelike housing, a cover, terminal elements, extending to the outside of the housing for load contacts and auxiliary contacts. The module having at least two electrically insulating substrates disposed inside the housing, which in turn each comprise one insulating body and a plurality of metal conducting tracks, located on the first main face of the insulating body, which first main face is remote from the base plate or the heat sink. The metal connecting tracks are electrically insulated from one another, and power semiconductor components are located on and electrically connected to these connecting tracks. The substrates (50) are identical, and electrically connected to one another, and have the same type and number of power semiconductor components disposed thereon.

Abstract: A power semiconductor module, having a metal base plate for mounting on a heat sink. The module comprises a framelike housing, a cover, terminal elements, leading to the outside of the housing, for load contacts and auxiliary contacts, and having at least one electrically insulating substrate, disposed inside the housing. The substrate includes an insulating body and a plurality of metal connecting tracks, electrically insulated from one another. Power semiconductor components are located on the connecting tracks and connected to these connecting tracks via appropriate circuitry. The base plate has a stiffening structure, which extends near and along a side of the base plate, and in the longitudinal direction of the base plate. The stiffening structure is formed of the base plate material itself by deformation and protrudes out of the upper surface of the base plate.

Abstract: A power semiconductor module has a base plate comprising a framelike housing, a cap, and at least one electrically insulated substrate disposed inside the housing. The substrate comprises an insulation body with a plurality of metal connection tracks located thereon and insulated from one another, power semiconductor components located on the connection tracks, and terminal elements leading to the outside of the power semiconductor module for load and auxiliary contacts. Some of these terminal elements in the interior of the power semiconductor module comprise contact springs, which are disposed between the connection tracks and contact points on a printed circuit board. The printed circuit board has conductor tracks, which connect the contact points to contact elements that lead to the outside of the power semiconductor module.

Abstract: A pressure sensor is provided with two supporting bodies (10,11) with plane supporting surfaces (12,13) between which a hose (14) is compressed or flattened. For measuring the internal pressure of the hose (14), pressure transmission means (17 or 22) is displaceable in a gap (16) that is arranged at a supporting body (10 or 11) adjacent to the compressed of flattened hose (14). The pressure transmission means (17 or 22) presses against the plane surface of the flattened-hose (14) and is supported on a force sensor (19). Thus, the deformation forces generated upon compressing the hose are eliminated for the measurement of pressure.

Abstract: The pressure sensor comprises two supporting bodies (10,11) with plane supporting surfaces (12,13) between which a hose (14) is flattened. For measuring the internal pressure of the hose (14), a web (17) displaceable in a gap (16) is arranged at a supporting body (10), said web pressing against the plane surface of the flattened hose (14) and being supported on a force sensor (19). Thus, the deformation forces generated upon compressing the hose are eliminated for the measurement of pressure.

Abstract: A circuit arrangement includes a base body, with one or more substrates, an intermediate-circuit board, a compression device and a driver circuit. Each substrate includes a positive-pole conductive strip, a negative-pole conductive strip, and auxiliary connections. Components such as power transistors, are in contact with the conductive strips and the auxiliary connections. The intermediate-circuit board includes a positive-pole DC connection and negative-pole DC connection and electrical capacitors connected between them. An AC connection element that must be cooled is assigned to each substrate. The positive-pole DC connection and the negative-pole DC connection include contacts for direct low-inductance connection with the corresponding conductive strips of the one or more substrates. The equivalent applies to the one or more AC connection elements.

Abstract: The ultrasonic sensor comprises an ultrasonic transmitter (11) and an ultrasonic receiver (12) between which an accommodating device (13) for a hose (14) is arranged. The hose is flattened between stamps (21, 22) thus being pressed against rigid concave forming areas (15, 16) where the hose bears in a gap-free manner upon the housing wall (17). The sound velocity in the housing (10) is approximately as large as in the material of the hose (14). In the liquid contained in the hose the sound velocity is considerably smaller. Parallel sound waves are refracted at the interface between hose material and liquid such that the sound waves converge. By concentrating the sound energy into the hose and onto the ultrasonic receiver (12) a high-energy received signal is generated. When air bubbles exist in the liquid, the received signal is attenuated.