Abstract: A process enables growing thick stoichiometric crystalline and preferably IR-transparent optical PCMO material on Si and other substrates. Sputter deposition is carried out in oxygen-free inert gas (e.g., Ar) environment, which helps to prevent decomposition of the PCMO material over the substrate. In the disclosed process, there is no need to add a seed layer prior to PCMO deposition. Moreover, no post-deposition annealing is needed in a high-temperature and high-pressure oxygen furnace, but an anneal provides certain additional benefits in terms of improved transparency at IR wavelengths. Over a long deposition time for a thick PCMO film on the high temperature (?450° C.) substrates, the PCMO deposition is made repeated cycles of deposition of the PCMO material at the high temperature, each deposition cycle being followed by cooling the PCMO-deposited substrate to a substantially lower temperature (<50° C.).

Abstract: The present disclosure describes glucocorticoid agonist compounds, their conjugates with binding proteins, pharmaceutical compositions thereof, as well as methods and uses for treating diseases or conditions, such as autoimmune or inflammatory conditions.

Abstract: Compounds useful as linker-payload compounds are disclosed. The compounds have the following Structure (I): as a stereoisomer, enantiomer or tautomer thereof or a mixture thereof; or a pharmaceutically acceptable salt, solvate or prodrug thereof, wherein X1, X2, X3, X4, X5, R4a, and R4b are as defined herein. Additional compounds, conjugates, methods of preparation, pharmaceutical compositions, and methods of treatment related to conjugates of compounds of Structure (I) and a targeting moiety, or binding fragment thereof, are also provided.

Abstract: A pouch fitment (10) is provided and comprises a base (12) which is attachable to a pouch and includes a dispensing spout (20). The fitment further comprises a closure (14) for closing the spout. The closure is non-releasably associated with the base.

Abstract: Described herein are compounds of Formula (I) wherein R1, R2, R3, R4, R5, R6, R7, R8 and R9 are defined herein, their use as diacylglycerol acyltransferase 2 (DGAT2) inhibitors, pharmaceutical compositions containing such inhibitors and the use of such inhibitors to treat, for example, NASH.

Abstract: Described herein are compounds of Formula (I) wherein R1, R2, R3, R4, R5, R6, R7, R8 and R9 are defined herein, their use as diacylglycerol acyltransferase 2 (DGAT2) inhibitors, pharmaceutical compositions containing such inhibitors and the use of such inhibitors to treat, for example, NASH.

Abstract: Described herein are compounds of Formula (I) wherein R1, R2, R3, R4, R5, R6, R7, R8 and R9 are defined herein, their use as diacylglycerol acyltransferase 2 (DGAT2) inhibitors, pharmaceutical compositions containing such inhibitors and the use of such inhibitors to treat, for example, NASH.

Abstract: Described herein are compounds of Formula (1) wherein R1, R2, R3, R4, R5, R6, R7, R8 and R9 are defined herein, their use as diacylglycerol acyltransferase 2 (DGAT2) inhibitors, pharmaceutical compositions containing such inhibitors and the use of such inhibitors to treat, for example, NASH.

Abstract: A vibrating glass massager includes a glass vibration head having a base end, a free end, and a wall defining a hollow interior compartment that is closed at the vibration head free end and open at the vibration head base end. A vibration motor assembly is disposed in the vibration head interior compartment. A resilient vibration-transmitting interface is disposed between the vibration motor assembly and the vibration head wall. A non-glass base includes a base housing. The base housing and the vibration head base end are joined in interlocking relationship at a head-base connection interface. A power source and a control circuit are disposed in the base housing. The control circuit is electrically connected to the power source and to the vibration motor assembly. The glass vibration head is operable to deliver vibrations received from the vibration motor assembly via the vibration transmitting interface.

Abstract: Process for producing a molded article, comprising a long fiber thermoplastic composite sheet (1) and a short fiber filled thermoplastic (2,3) component, preferably injected over the surface of the composite sheet, that are thermoformed.

Abstract: The invention relates to a new centrifugal filter for filtering impurities from liquid. Embodiments comprise a cylindrical housing having: (1) a top flow guiding assembly with a top portion having a first liquid outlet, a threaded middle portion, a bottom portion having a plurality of spiral flow guiding grooves adjacent the bottom portion, and a channel through a longitudinal axis; (2) a water inlet flow guiding assembly having a middle portion with a liquid inlet, and a channel through a longitudinal axis; (3) a recessed flow guiding assembly having a channel through a longitudinal axis which forms a conical taper; and (4) an impurity flow guiding assembly having a channel through a longitudinal axis that forms a second liquid outlet; each assembly releasably attachable within the cylindrical housing through threaded means.

Abstract: A vibrating glass massager includes a glass vibration head having a base end, a free end, and a wall defining a hollow interior compartment that is closed at the vibration head free end and open at the vibration head base end. A vibration motor assembly is disposed in the vibration head interior compartment. A resilient vibration-transmitting interface is disposed between the vibration motor assembly and the vibration head wall. A non-glass base includes a base housing. The base housing and the vibration head base end are joined in interlocking relationship at a head-base connection interface. A power source and a control circuit are disposed in the base housing. The control circuit is electrically connected to the power source and to the vibration motor assembly. The glass vibration head is operable to deliver vibrations received from the vibration motor assembly via the vibration transmitting interface.

Abstract: An integrated circuit, and a semiconductor die package formed therefrom, are disclosed including solder columns for adding structural support to the package during the fabrication process.

Abstract: A semiconductor die substrate panel is disclosed including a minimum kerf width between adjoining semiconductor package outlines on the panel, while ensuring electrical isolation of plated electrical terminals. By reducing the width of a boundary between adjoining package outlines, additional space is gained on a substrate panel for semiconductor packages.

Abstract: A system is disclosed for ejecting a semiconductor die from a tape to which the die is affixed during the wafer dicing process. In embodiments, the system includes an ejector tool including a support table, ejector pins and a pick-up arm. The support table is connected to a vacuum source for creating a negative pressure at an interface between the tape and support table. The support table further includes an aperture with one or more chamfered sidewalls. The vacuum source is connected to the aperture so that, upon placement of the tape on the support table with a die centered over the aperture, the vacuum source pulls a portion of the tape around the edges of the semiconductor die away from the die and into the space created by the chamfered edges.

Abstract: A flash memory card and methods of manufacturing same are disclosed. The card includes a semiconductor package fabricated to receive a single-sided or double-sided lid. A surface of the semiconductor package may be formed with holes, trenches and/or pockmarks. After the holes, trenches and/or pockmarks are formed, a lid may be attached to the package surface in an injection molding process. During the injection molding process, the molten plastic flows into the holes, trenches and/or pockmarks to interconnect with the surface of the semiconductor package. Thus, when the molten plastic hardens, the holes, trenches and/or pockmarks ensure that the lid remains firmly attached to semiconductor package.