Patents by Inventor Jack Chang

Jack Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12195258
    Abstract: A pouch fitment is provided and comprises a base which is attachable to a pouch and includes a dispensing spout. The fitment further comprises a closure cap for closing the spout. The closure cap is non-releasably associated with the base. The base and the closure cap are connected by a hinge. The fitment comprises a tamper-evident member. The tamper-evident member is movable from an engaged position to a released position. In the engaged position the closure cap is blocked from opening and in the released position the closure cap can be opened.
    Type: Grant
    Filed: October 1, 2020
    Date of Patent: January 14, 2025
    Assignee: OBRIST CLOSURES SWITZERLAND GMBH
    Inventors: Fabrice Guerin, Jack Chang, Frederic Chave, Jerome Mezerette
  • Publication number: 20250008799
    Abstract: A display may include an active area with a first region and a second region. The first region may overlap an input-output component such as a camera and may have a higher transparency than the second region. The first region may have a lower pixel density than the second region. Signal lines that pass through the first region may have transparent portions that overlap the first region and opaque portions that overlap the second region. To mitigate artifacts caused by high resistance of the transparent portions of the signal lines, the signal lines may include supplemental opaque portions that are electrically connected in parallel to the transparent portions and that are routed through the second region around the first region.
    Type: Application
    Filed: May 17, 2024
    Publication date: January 2, 2025
    Inventors: Shyuan Yang, Abbas Jamshidi Roudbari, Gihoon Choo, Jae Won Choi, Jean-Pierre S. Guillou, Jonglo Park, Kyounghwan Kim, Ricardo A. Peterson, Sungki Lee, Ting-Kuo Chang, Tsung-Ting Tsai, Warren S. Rieutort-Louis, Yi Qiao, Yuchi Che, Yue Cui, Yue Jack Chu, Zhizhen Ma
  • Patent number: 12116662
    Abstract: A process enables growing thick stoichiometric crystalline and preferably IR-transparent optical PCMO material on Si and other substrates. Sputter deposition is carried out in oxygen-free inert gas (e.g., Ar) environment, which helps to prevent decomposition of the PCMO material over the substrate. In the disclosed process, there is no need to add a seed layer prior to PCMO deposition. Moreover, no post-deposition annealing is needed in a high-temperature and high-pressure oxygen furnace, but an anneal provides certain additional benefits in terms of improved transparency at IR wavelengths. Over a long deposition time for a thick PCMO film on the high temperature (?450° C.) substrates, the PCMO deposition is made repeated cycles of deposition of the PCMO material at the high temperature, each deposition cycle being followed by cooling the PCMO-deposited substrate to a substantially lower temperature (<50° C.).
    Type: Grant
    Filed: August 18, 2022
    Date of Patent: October 15, 2024
    Assignee: HRL LABORATORIES, LLC
    Inventors: Kyung-Ah Son, Jeong-Sun Moon, Hwa Chang Seo, Richard M. Kremer, Ryan G. Quarfoth, Jack A. Crowell, Mariano J. Taboada, Joshua M. Doria, Terry B. Welch
  • Publication number: 20240218011
    Abstract: The present disclosure describes glucocorticoid agonist compounds, their conjugates with binding proteins, pharmaceutical compositions thereof, as well as methods and uses for treating diseases or conditions, such as autoimmune or inflammatory conditions.
    Type: Application
    Filed: July 20, 2023
    Publication date: July 4, 2024
    Inventors: Sean Wesley Smith, Scott Allan Mitchell, Jack Chang Hung Lee
  • Publication number: 20240067640
    Abstract: Compounds useful as linker-payload compounds are disclosed. The compounds have the following Structure (I): as a stereoisomer, enantiomer or tautomer thereof or a mixture thereof; or a pharmaceutically acceptable salt, solvate or prodrug thereof, wherein X1, X2, X3, X4, X5, R4a, and R4b are as defined herein. Additional compounds, conjugates, methods of preparation, pharmaceutical compositions, and methods of treatment related to conjugates of compounds of Structure (I) and a targeting moiety, or binding fragment thereof, are also provided.
    Type: Application
    Filed: March 10, 2023
    Publication date: February 29, 2024
    Inventors: Sean Wesley Smith, Scott Allan Mitchell, Jack Chang Hung Lee
  • Publication number: 20220332488
    Abstract: A pouch fitment (10) is provided and comprises a base (12) which is attachable to a pouch and includes a dispensing spout (20). The fitment further comprises a closure (14) for closing the spout. The closure is non-releasably associated with the base.
    Type: Application
    Filed: October 1, 2020
    Publication date: October 20, 2022
    Inventors: Fabrice GUERIN, Jack CHANG, Frederic CHAVE, Jerome MEZERETTE
  • Patent number: 11471458
    Abstract: Described herein are compounds of Formula (I) wherein R1, R2, R3, R4, R5, R6, R7, R8 and R9 are defined herein, their use as diacylglycerol acyltransferase 2 (DGAT2) inhibitors, pharmaceutical compositions containing such inhibitors and the use of such inhibitors to treat, for example, NASH.
    Type: Grant
    Filed: October 5, 2020
    Date of Patent: October 18, 2022
    Assignee: Pfizer Inc.
    Inventors: David James Edmonds, Kevin James Filipski, Kentaro Futatsugi, Michelle Renee Garnsey, Jack Chang Hung Lee, Daniel Jonathan Smaltz
  • Patent number: 11065249
    Abstract: Described herein are compounds of Formula (I) wherein R1, R2, R3, R4, R5, R6, R7, R8 and R9 are defined herein, their use as diacylglycerol acyltransferase 2 (DGAT2) inhibitors, pharmaceutical compositions containing such inhibitors and the use of such inhibitors to treat, for example, NASH.
    Type: Grant
    Filed: November 5, 2020
    Date of Patent: July 20, 2021
    Assignee: Pfizer Inc.
    Inventors: David James Edmonds, Kevin James Filipski, Kentaro Futatsugi, Michelle Renee Garnsey, Jack Chang Hung Lee, Daniel Jonathan Smaltz
  • Publication number: 20210100796
    Abstract: Described herein are compounds of Formula (I) wherein R1, R2, R3, R4, R5, R6, R7, R8 and R9 are defined herein, their use as diacylglycerol acyltransferase 2 (DGAT2) inhibitors, pharmaceutical compositions containing such inhibitors and the use of such inhibitors to treat, for example, NASH.
    Type: Application
    Filed: October 5, 2020
    Publication date: April 8, 2021
    Applicant: Pfizer Inc.
    Inventors: David James Edmonds, Kevin James Filipski, Kentaro Futatsugi, Michelle Renee Garnsey, Jack Chang Hung Lee, Daniel Jonathan Smaltz
  • Publication number: 20210100798
    Abstract: Described herein are compounds of Formula (1) wherein R1, R2, R3, R4, R5, R6, R7, R8 and R9 are defined herein, their use as diacylglycerol acyltransferase 2 (DGAT2) inhibitors, pharmaceutical compositions containing such inhibitors and the use of such inhibitors to treat, for example, NASH.
    Type: Application
    Filed: November 5, 2020
    Publication date: April 8, 2021
    Applicant: Pfizer Inc.
    Inventors: David James Edmonds, Kevin James Filipski, Kentaro Futatsugi, Michelle Renee Garnsey, Jack Chang Hung Lee, Daniel Jonathan Smaltz
  • Patent number: 10780019
    Abstract: A vibrating glass massager includes a glass vibration head having a base end, a free end, and a wall defining a hollow interior compartment that is closed at the vibration head free end and open at the vibration head base end. A vibration motor assembly is disposed in the vibration head interior compartment. A resilient vibration-transmitting interface is disposed between the vibration motor assembly and the vibration head wall. A non-glass base includes a base housing. The base housing and the vibration head base end are joined in interlocking relationship at a head-base connection interface. A power source and a control circuit are disposed in the base housing. The control circuit is electrically connected to the power source and to the vibration motor assembly. The glass vibration head is operable to deliver vibrations received from the vibration motor assembly via the vibration transmitting interface.
    Type: Grant
    Filed: November 24, 2016
    Date of Patent: September 22, 2020
    Assignee: Jopen LLC
    Inventor: Jack Chang
  • Publication number: 20200215731
    Abstract: Process for producing a molded article, comprising a long fiber thermoplastic composite sheet (1) and a short fiber filled thermoplastic (2,3) component, preferably injected over the surface of the composite sheet, that are thermoformed.
    Type: Application
    Filed: December 19, 2017
    Publication date: July 9, 2020
    Inventors: Yilan LI, Eric QI, Jack CHANG, Sean GAO, Olaf ZÖLLNER, Thomas GRIMM
  • Publication number: 20190060796
    Abstract: The invention relates to a new centrifugal filter for filtering impurities from liquid. Embodiments comprise a cylindrical housing having: (1) a top flow guiding assembly with a top portion having a first liquid outlet, a threaded middle portion, a bottom portion having a plurality of spiral flow guiding grooves adjacent the bottom portion, and a channel through a longitudinal axis; (2) a water inlet flow guiding assembly having a middle portion with a liquid inlet, and a channel through a longitudinal axis; (3) a recessed flow guiding assembly having a channel through a longitudinal axis which forms a conical taper; and (4) an impurity flow guiding assembly having a channel through a longitudinal axis that forms a second liquid outlet; each assembly releasably attachable within the cylindrical housing through threaded means.
    Type: Application
    Filed: August 31, 2018
    Publication date: February 28, 2019
    Applicant: LIS Automatic Controlled Co Ltd
    Inventor: Jack Chang
  • Publication number: 20180140504
    Abstract: A vibrating glass massager includes a glass vibration head having a base end, a free end, and a wall defining a hollow interior compartment that is closed at the vibration head free end and open at the vibration head base end. A vibration motor assembly is disposed in the vibration head interior compartment. A resilient vibration-transmitting interface is disposed between the vibration motor assembly and the vibration head wall. A non-glass base includes a base housing. The base housing and the vibration head base end are joined in interlocking relationship at a head-base connection interface. A power source and a control circuit are disposed in the base housing. The control circuit is electrically connected to the power source and to the vibration motor assembly. The glass vibration head is operable to deliver vibrations received from the vibration motor assembly via the vibration transmitting interface.
    Type: Application
    Filed: November 24, 2016
    Publication date: May 24, 2018
    Inventor: Jack Chang
  • Patent number: 8878346
    Abstract: An integrated circuit, and a semiconductor die package formed therefrom, are disclosed including solder columns for adding structural support to the package during the fabrication process.
    Type: Grant
    Filed: April 28, 2006
    Date of Patent: November 4, 2014
    Assignee: SanDisk Technologies Inc.
    Inventors: Chin-Tien Chiu, Hem Takiar, Hui Liu, Jiang Hua Java Zhu, Jack Chang-Chien, Cheemen Yu
  • Patent number: 8637972
    Abstract: A semiconductor die substrate panel is disclosed including a minimum kerf width between adjoining semiconductor package outlines on the panel, while ensuring electrical isolation of plated electrical terminals. By reducing the width of a boundary between adjoining package outlines, additional space is gained on a substrate panel for semiconductor packages.
    Type: Grant
    Filed: June 8, 2007
    Date of Patent: January 28, 2014
    Assignee: SanDisk Technologies Inc.
    Inventors: Chih-Chin Liao, Ning Ye, Cheemen Yu, Jack Chang Chien, Hem Takiar
  • Patent number: 8499813
    Abstract: A system is disclosed for ejecting a semiconductor die from a tape to which the die is affixed during the wafer dicing process. In embodiments, the system includes an ejector tool including a support table, ejector pins and a pick-up arm. The support table is connected to a vacuum source for creating a negative pressure at an interface between the tape and support table. The support table further includes an aperture with one or more chamfered sidewalls. The vacuum source is connected to the aperture so that, upon placement of the tape on the support table with a die centered over the aperture, the vacuum source pulls a portion of the tape around the edges of the semiconductor die away from the die and into the space created by the chamfered edges.
    Type: Grant
    Filed: February 16, 2012
    Date of Patent: August 6, 2013
    Assignee: SanDisk Technologies Inc.
    Inventors: Jack Chang Chien, King Hoo Ong, Weili Wang, Li Wang, XingZhi Liang, Shicai Ma
  • Patent number: D687412
    Type: Grant
    Filed: September 14, 2012
    Date of Patent: August 6, 2013
    Assignee: GP Acoustics International Limited
    Inventors: Simon Davies, Patrick Ho, Yang Jack Chang, Graham Allen
  • Patent number: D710333
    Type: Grant
    Filed: May 22, 2013
    Date of Patent: August 5, 2014
    Assignee: GP Acoustics International Limited
    Inventors: Simon Davies, Jack Chang
  • Patent number: D949386
    Type: Grant
    Filed: March 6, 2020
    Date of Patent: April 19, 2022
    Assignee: Callfornia Exotic Novelties LLC
    Inventor: Jack Chang