Abstract: Improvements to magnetic recording device including magnetic recording media are described. The improvements include the addition of copper to the recording layer as well as improved underlayers. In addition, improved manufacturing processes and magnetic/recording properties for media through heating and oxidation are described.

Abstract: A multi-function diversified photo frame formed by way of simple vacuum molding includes a front part and a rear part, which are integrally connected to each other or are not connected to each other. The photo frame is one-piece molded and made of an environment protective and single plastic material, such as PET, by way of heating vacuuming and extruding, so that the photo frame can be easily manufactured, the single material can be easily recycled, and the economic effectiveness of reducing the cost can be obtained. Thus, a photo, a picture, a commendation, a certificate or a voucher may be interposed between the front and rear parts and may be represented.

Abstract: A flash memory card and methods of manufacturing same are disclosed. The card includes a semiconductor package fabricated to receive a single-sided or double-sided lid. A surface of the semiconductor package may be formed with holes, trenches and/or pockmarks. After the holes, trenches and/or pockmarks are formed, a lid may be attached to the package surface in an injection molding process. During the injection molding process, the molten plastic flows into the holes, trenches and/or pockmarks to interconnect with the surface of the semiconductor package. Thus, when the molten plastic hardens, the holes, trenches and/or pockmarks ensure that the lid remains firmly attached to semiconductor package.

Abstract: A semiconductor die substrate panel is disclosed including a minimum kerf width between adjoining semiconductor package outlines on the panel, while ensuring electrical isolation of plated electrical terminals. By reducing the width of a boundary between adjoining package outlines, additional space is gained on a substrate panel for semiconductor packages.

Abstract: An IC package having reduced thickness includes a lead frame, a chip, and a plurality of bonding wires. The lead frame includes a front side, a rear side, a plurality of pins located on the front side, and a hollow portion formed on the lead frame. The chip is larger than the rear side of the lead frame. The chip includes a plurality of electrodes and is adhered to the rear side of the lead frame. The electrodes correspond to the hollow portion. The bonding wires pass through the hollow portion to be connected with the pins and the electrodes. Accordingly, the IC package can effectively take good use of the space below the lead frame, reducing the height of the bonding wires and saving the packaging space above the lead frame, and reduce the thickness of the IC package without addition of the cost and equipment.

Abstract: A method of manufacturing a die stack package includes the steps of providing a wafer having a first surface and a second surface, said first surface having a plurality of cut ways thereon, the second surface being coated with adhesive of a predetermined thickness at a predetermined position thereof, removing parts of the adhesive by photo-lithography, each of the parts of the adhesive corresponds to the cut way and is wider than the cut way; cutting the wafer along the cut ways to make a plurality of dies, each of the dies having a part of the adhesive thereon; and stacking each of the dies, whose surface having the adhesive faces a lower-layer die, on the lower-layer die. Therefore, the method facilitates the stacking operation and saves the production cost.

Abstract: A method of forming a semiconductor package with smooth edges, and a semiconductor package formed thereby is disclosed. In embodiments, after encapsulation, a panel of semiconductor packages may undergo a first cutting process which cuts the curvilinear edges of the packages. Next, the partially singulated panel of packages may undergo an abrasion process for smoothing the cut curvilinear edges. The abrasion process may occur by forcing abrasive particles over the jagged side edges of a semiconductor package as a result of a pressure differential above and below the semiconductor packages. Upon completion of the abrasive process, a second cutting process may be performed which cuts along straight edges and singulates the respective packages from the panel.

Abstract: An annular fan-shaped retractable honeycomb furniture assembly includes a honeycomb core and two panels. A binder is attached to a lateral side of the honeycomb core to serve as a center point when the honeycomb core is developed into an annular shape, and has the effect of fixing and shaping. A slant or an arced surface is formed on an upper side of the honeycomb core adjacent to the binder. The panels are respectively adhered to two opposite external surfaces of the honeycomb core to sandwich the honeycomb core. Each of the panels has one side portion, which projects over an edge of the honeycomb core and is formed with a slot. A fastener tape may be provided to fix the panels together after the honeycomb core is developed or retracted.

Abstract: A portable memory card and methods of manufacturing same are disclosed. The portable memory includes a substrate having a plurality of holes formed therein. During the encapsulation process, mold compound flows over the top surface of the substrate, through the holes, and down into a recessed section formed in the bottom mold cap plate to form a projection of mold compound on the bottom surface of the substrate.

Abstract: A semiconductor device having a redistribution layer, and methods of forming same, are disclosed. After fabrication of semiconductor die on a wafer, a tape assembly is applied onto a surface of the wafer, in contact with the surfaces of each semiconductor die on the wafer. The tape assembly includes a backgrind tape as a base layer, and a film assembly adhered to the backgrind tape. The film assembly in turn includes an adhesive film on which is deposited a thin layer of conductive material. The redistribution layer pattern is traced into the tape assembly, using for example a laser. Thereafter, the unheated portions of the tape assembly may be removed, leaving the heated redistribution layer pattern on each semiconductor die.

Abstract: A portable memory card and methods of manufacturing same are disclosed. The portable memory includes a substrate having a plurality of holes formed therein. During the encapsulation process, mold compound flows over the top surface of the substrate, through the holes, and down into a recessed section formed in the bottom mold cap plate to form a projection of mold compound on the bottom surface of the substrate.

Abstract: A semiconductor device having a redistribution layer, and methods of forming same, are disclosed. After fabrication of semiconductor die on a wafer, a tape assembly is applied onto a surface of the wafer, in contact with the surfaces of each semiconductor die on the wafer. The tape assembly includes a backgrind tape as a base layer, and a film assembly adhered to the backgrind tape. The film assembly in turn includes an adhesive film on which is deposited a thin layer of conductive material. The redistribution layer pattern is traced into the tape assembly, using for example a laser. Thereafter, the unheated portions of the tape assembly may be removed, leaving the heated redistribution layer pattern on each semiconductor die.

Abstract: A semiconductor die substrate panel is disclosed including a minimum kerf width between adjoining semiconductor package outlines on the panel, while ensuring electrical isolation of plated electrical terminals. By reducing the width of a boundary between adjoining package outlines, additional space is gained on a substrate panel for semiconductor packages.

Abstract: A semiconductor die substrate panel is disclosed including a minimum kerf width between adjoining semiconductor package outlines on the panel, while ensuring electrical isolation of plated electrical terminals. By reducing the width of a boundary between adjoining package outlines, additional space is gained on a substrate panel for semiconductor packages.

Abstract: A method of reducing mechanical stress on an integrated circuit is disclosed including applying solder columns to the substrate for adding structural support to the package during the fabrication process.

Abstract: Improvements to magnetic recording device including magnetic recording media are described. The improvements include the addition of copper to the recording layer as well as improved underlayers. In addition, improved manufacturing processes and magnetic/recording properties for media through heating and oxidation are described.

Abstract: A thin film disk for use in magnetic recording with an underlayer structure that includes a layer of CrMoZr, CrMoNb or CrMoMn is described. The preferred embodiment includes a circumferentially textured glass substrate, a pre-seed layer, a B2 seed layer, an underlayer structure and a magnetic layer stack with a plurality of layers. The preferred underlayer structure has a first underlayer of CrTi followed by a second underlayer of CrMoZr. The preferred B2 seed layer material is RuAl. The preferred pre-seed layer is CrTiAl. The preferred magnetic layer stack is CoCr/CoPtCrB/CoPtCrBCu. The preferred embodiment is useful for longitudinal magnetic recording. The in-plane crystallographic orientation, the Mrt orientation ratio and the media SNR are improved by the inclusion of the CrMoZr, CrMoNb or CrMoMn according to the invention.

Abstract: A method of reducing mechanical stress on an integrated circuit is disclosed including applying solder columns to the substrate for adding structural support to the package during the fabrication process.

Abstract: An integrated circuit, and a semiconductor die package formed therefrom, are disclosed including solder columns for adding structural support to the package during the fabrication process.

Abstract: A condenser microphone includes: a casing including a peripheral wall that has a top end and a bottom end defining a bottom opening, and a flange that is bent inwardly from the top end of the peripheral wall; a substrate having an inner surface that is attached to the bottom end, that covers the bottom opening, and that cooperates with the peripheral wall and the flange to define an accommodating space thereamong; a diaphragm-and-ring assembly disposed in the accommodating space; a spacer disposed in the accommodating space between the diaphragm-and-ring assembly and the inner surface of the substrate; and a backplate.